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Advanced Partial Discharge Testing for Modern Power Modules

Advanced Partial Discharge Testing for Modern Power Modules

Modern power modules need PD testing that goes beyond traditional standards. This article looks at advanced diagnostic methods that help improve…


Solution-based Manufacturing Platform for Advanced WBG Technologies

Solution-based Manufacturing Platform for Advanced WBG Technologies

Learn how Sanan offers a solution-based, vertically integrated manufacturing platform for advanced SiC/GaN WBG technologies, enabling faster…


Sensor Placement Errors in High-Voltage Systems That Distort Measurements

Sensor Placement Errors in High-Voltage Systems That Distort Measurements

Improper sensor placement in high-voltage systems can lead to distorted measurements. This article explains how ground shifts, dv/dt, and layout…


Advancing Power Efficiency With SiC Merged-Pin Schottky (MPS) Diodes

Advancing Power Efficiency With SiC Merged-Pin Schottky (MPS) Diodes

By combining Schottky and PiN diode structures in a single, monolithic device, SiC MPS diodes overcome the historical trade-offs between low…


Formic Acid Soldering: Enabling the Next Generation of Power Devices—Part 2

Formic Acid Soldering: Enabling the Next Generation of Power Devices—Part 2

In part 2, we focus on application considerations and take a deeper look at case studies for prevailing solder material alternatives, including…


Why Oscilloscope Bandwidth Specs Are Often Misleading for HV Measurement

Why Oscilloscope Bandwidth Specs Are Often Misleading for HV Measurement

Oscilloscope bandwidth can quietly change high-voltage transients and hide the real dv/dt stress, not just probe capacitance or ground inductance.


Sustainability and Energy Efficiency Benefits of Lead-Free Soldering

Sustainability and Energy Efficiency Benefits of Lead-Free Soldering

Learn how lead-free soldering offers a sustainable, energy-efficient solution for power module assembly. It achieves up to 55% energy savings and…


Meeting Compact Inverter Design Demand With Small Size While Maintaining Insulation Distance

Meeting Compact Inverter Design Demand With Small Size While Maintaining Insulation Distance

In recent years, power density of a power inverter stages are increasing by providing low power losses as well as compact size so that the demand…


Inside the Silicon Carbide JFET: Specs, Stability, and the New Performance Frontier

Inside the Silicon Carbide JFET: Specs, Stability, and the New Performance Frontier

Learn how SiC JFETs beat MOSFETs for next-gen power. They offer ultralow loss, superior stability, and rugged avalanche protection—critical for…


IGCT Platform for up to 8.5 kV and Advanced Turn-Off Current Capability

IGCT Platform for up to 8.5 kV and Advanced Turn-Off Current Capability

Learn how Hitachi Energy's IGCT platform scales to 8.5 kV. It provides high turn-off capability and supports cost-efficient system designs for…


GaN-Based Synchronous CCM PFC for Hydraulic Pump Power Supply Applications

GaN-Based Synchronous CCM PFC for Hydraulic Pump Power Supply Applications

This article details a GaN-based synchronous CCM-PFC design for hydraulic pump power supplies. It achieves 98.5% peak efficiency at 300W and…


Polycrystalline-SiC-Based Substrate Boosts Performance of SiC Power Devices

Polycrystalline-SiC-Based Substrate Boosts Performance of SiC Power Devices

Learn how SmartSiC technology using Smart Cut overcomes standard Silicon Carbide limitations, reducing CO2 emissions, boosting device efficiency…


Precision Cooling of Performance Modules

Precision Cooling of Performance Modules

High power density in electronics necessitates efficient cooling. Learn how passive (heat sinks), forced (cooling aggregates/fans), and liquid…


Practical Limitations of IEC Partial Discharge Standards in Power Modules

Practical Limitations of IEC Partial Discharge Standards in Power Modules

IEC partial standards miss dv/dt, thermal, and micro-PD effects in power modules, limiting their value for inverter-driven reliability prediction.


Beyond Mobility: Delivering Proven SiC Technology Where Performance and Reliability Matter the Most

Beyond Mobility: Delivering Proven SiC Technology Where Performance and Reliability Matter the Most

Learn how Mitsubishi Electric’s latest Unifull SiC modules combine advanced performance with enhanced power cycling capability enabled by…


Using Low-Voltage GaN in ISOP Converters for AI Servers With 800 V Architecture

Using Low-Voltage GaN in ISOP Converters for AI Servers With 800 V Architecture

Over the past decade, AI workloads have relied on server architectures not designed for their rapidly growing power demands. Recently, the concept…


Thermal Management for SiC Semis—Top Side Cooling as an Innovative Solution

Thermal Management for SiC Semis—Top Side Cooling as an Innovative Solution

The growing demand for powerful and compact power electronics places high demands on the thermal management of modern semiconductor technologies.…


Solving Military-Avionics DC-DC Power Challenges with Modularity—Part 4

Solving Military-Avionics DC-DC Power Challenges with Modularity—Part 4

While the first three parts in this article series detailed military and avionic standards and front-end solutions, this last Part 4 delves into…


Enabling High Efficiency: Gate Driver ICs for Automotive Traction Inverters

Enabling High Efficiency: Gate Driver ICs for Automotive Traction Inverters

E-mobility is driving significant demand for power electronics, particularly inverters. High-performance power modules help ensure efficient designs.


Improve Motor Lifetime With Slew Rate Control Gate Drive Optocoupler

Improve Motor Lifetime With Slew Rate Control Gate Drive Optocoupler

Learn how Slew Rate Control (SRC) gate drive optocouplers mitigate high dv/dt from PWM in VSDs, reducing motor overvoltage, EMI, and power loss,…