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Meeting Compact Inverter Design Demand With Small Size While Maintaining Insulation Distance

Meeting Compact Inverter Design Demand With Small Size While Maintaining Insulation Distance

In recent years, power density of a power inverter stages are increasing by providing low power losses as well as compact size so that the demand…


Inside the Silicon Carbide JFET: Specs, Stability, and the New Performance Frontier

Inside the Silicon Carbide JFET: Specs, Stability, and the New Performance Frontier

Learn how SiC JFETs beat MOSFETs for next-gen power. They offer ultralow loss, superior stability, and rugged avalanche protection—critical for…


IGCT Platform for up to 8.5 kV and Advanced Turn-Off Current Capability

IGCT Platform for up to 8.5 kV and Advanced Turn-Off Current Capability

Learn how Hitachi Energy's IGCT platform scales to 8.5 kV. It provides high turn-off capability and supports cost-efficient system designs for…


GaN-Based Synchronous CCM PFC for Hydraulic Pump Power Supply Applications

GaN-Based Synchronous CCM PFC for Hydraulic Pump Power Supply Applications

This article details a GaN-based synchronous CCM-PFC design for hydraulic pump power supplies. It achieves 98.5% peak efficiency at 300W and…


Polycrystalline-SiC-Based Substrate Boosts Performance of SiC Power Devices

Polycrystalline-SiC-Based Substrate Boosts Performance of SiC Power Devices

Learn how SmartSiC technology using Smart Cut overcomes standard Silicon Carbide limitations, reducing CO2 emissions, boosting device efficiency…


Precision Cooling of Performance Modules

Precision Cooling of Performance Modules

High power density in electronics necessitates efficient cooling. Learn how passive (heat sinks), forced (cooling aggregates/fans), and liquid…


Practical Limitations of IEC Partial Discharge Standards in Power Modules

Practical Limitations of IEC Partial Discharge Standards in Power Modules

IEC partial standards miss dv/dt, thermal, and micro-PD effects in power modules, limiting their value for inverter-driven reliability prediction.


Beyond Mobility: Delivering Proven SiC Technology Where Performance and Reliability Matter the Most

Beyond Mobility: Delivering Proven SiC Technology Where Performance and Reliability Matter the Most

Learn how Mitsubishi Electric’s latest Unifull SiC modules combine advanced performance with enhanced power cycling capability enabled by…


Using Low-Voltage GaN in ISOP Converters for AI Servers With 800 V Architecture

Using Low-Voltage GaN in ISOP Converters for AI Servers With 800 V Architecture

Over the past decade, AI workloads have relied on server architectures not designed for their rapidly growing power demands. Recently, the concept…


Thermal Management for SiC Semis—Top Side Cooling as an Innovative Solution

Thermal Management for SiC Semis—Top Side Cooling as an Innovative Solution

The growing demand for powerful and compact power electronics places high demands on the thermal management of modern semiconductor technologies.…


Solving Military-Avionics DC-DC Power Challenges with Modularity—Part 4

Solving Military-Avionics DC-DC Power Challenges with Modularity—Part 4

While the first three parts in this article series detailed military and avionic standards and front-end solutions, this last Part 4 delves into…


Enabling High Efficiency: Gate Driver ICs for Automotive Traction Inverters

Enabling High Efficiency: Gate Driver ICs for Automotive Traction Inverters

E-mobility is driving significant demand for power electronics, particularly inverters. High-performance power modules help ensure efficient designs.


Improve Motor Lifetime With Slew Rate Control Gate Drive Optocoupler

Improve Motor Lifetime With Slew Rate Control Gate Drive Optocoupler

Learn how Slew Rate Control (SRC) gate drive optocouplers mitigate high dv/dt from PWM in VSDs, reducing motor overvoltage, EMI, and power loss,…


Predicting and Controlling Thermal Runaway in High-Voltage Power Modules

Predicting and Controlling Thermal Runaway in High-Voltage Power Modules

In this article, we take a system-level look at how thermal runaway begins, propagates across multi-module converters, and how engineers can model,…


An Exploration of Surface Mount Power Packaging Technologies for SiC MOSFETs

An Exploration of Surface Mount Power Packaging Technologies for SiC MOSFETs

Surface-mount packaging for SiC MOSFETs boosts power density, reduces parasitics, and improves thermal performance compared to legacy packages,…


Selecting the Right SiC MOSFET for Efficient Zero-Voltage Switching

Selecting the Right SiC MOSFET for Efficient Zero-Voltage Switching

Learn how research with 1200 V SiC MOSFETs can help designers select the optimal SiC devices for their high-frequency softswitching applications.


SiC-MPS Diodes Under Stress: Robust Performance Under Extreme Conditions

SiC-MPS Diodes Under Stress: Robust Performance Under Extreme Conditions

What is the reverse recovery behavior of SiC-MPS diodes in scenarios that challenge their thermal and dynamic robustness? This article provides a…


The Next Leap in EV Powertrain Efficiency: The Rise of 3-Level Inverters

The Next Leap in EV Powertrain Efficiency: The Rise of 3-Level Inverters

Learn the advantages of upgrading from a 2-level inverter to a 3-level inverter for SiC-based EV powertrain designs.


Three-Phase Module Based on Monolithic Gan Half-Bridge ICs

Three-Phase Module Based on Monolithic Gan Half-Bridge ICs

Learn about the EPC33110, a three-phase module that uses GaN monolithic ICs. It enables the development of smaller, lighter motor drive inverters.


Pulsed Inductance Measurement Replaces Reactance Method for Large Power Chokes

Pulsed Inductance Measurement Replaces Reactance Method for Large Power Chokes

In this article, learn why pulse measurement has advantages over the conventional reactance-based method when it comes to determining the…