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Solution-based Manufacturing Platform for Advanced WBG Technologies

Solution-based Manufacturing Platform for Advanced WBG Technologies

Learn how Sanan offers a solution-based, vertically integrated manufacturing platform for advanced SiC/GaN WBG technologies, enabling faster…


Polycrystalline-SiC-Based Substrate Boosts Performance of SiC Power Devices

Polycrystalline-SiC-Based Substrate Boosts Performance of SiC Power Devices

Learn how SmartSiC technology using Smart Cut overcomes standard Silicon Carbide limitations, reducing CO2 emissions, boosting device efficiency…


Thermal Management for SiC Semis—Top Side Cooling as an Innovative Solution

Thermal Management for SiC Semis—Top Side Cooling as an Innovative Solution

The growing demand for powerful and compact power electronics places high demands on the thermal management of modern semiconductor technologies.…


The Future of Power Conversion in Home Appliances with SiC SLIMDIPs

The Future of Power Conversion in Home Appliances with SiC SLIMDIPs

Learn how two new Mitsubishi SLIMDIP IPMs address the growing need for high-efficiency power semiconductor devices in consumer applications.


Reports of Silicon’s Death Have Been Greatly Exaggerated

Reports of Silicon’s Death Have Been Greatly Exaggerated

Learn how a new MOSFET architecture stretches the performance of silicon power devices using a patented approach.


Next-Gen SiC MOSFET and Si RC-IGBT Tech Meets E-Mobility Needs

Next-Gen SiC MOSFET and Si RC-IGBT Tech Meets E-Mobility Needs

Learn how Mitsubishi’s in-house designed & developed efficient semiconductor bare-dies (SiC MOSFET & Si RC-IGBT) and compact…


HV-IGBT Module for High-Performance Inverter Design

HV-IGBT Module for High-Performance Inverter Design

Learn about Mitsubishi’s XB-Series HV-IGBT modules. They offer lower switching losses and enhanced reliability through 7th-gen Si IGBT and RFC…


Powering the SiC Revolution with Vertical Integration

Powering the SiC Revolution with Vertical Integration

Silicon Carbide (SiC) has a 3x bandgap compared to silicon. Learn how unipolar devices like MOSETs in the several kV range are possible with SiC.


SiC Power Stack Evaluation Kit: Accelerate Inverter Development

SiC Power Stack Evaluation Kit: Accelerate Inverter Development

This article examines an evaluation kit to shorten time-to-market for SiC inverters.


Troubleshooting TRIAC Outputs For PLC AC Modules

Troubleshooting TRIAC Outputs For PLC AC Modules

When troubleshooting AC outputs driven by TRIACs, some confusing meter readings can result from the solid state properties of a series circuit. In…


Adapting MOSFET Gate Drivers for Use With GaN FETs

Adapting MOSFET Gate Drivers for Use With GaN FETs

This article explores the differences between GaN FETs and silicon MOSFETs, provides recommendations for using generic gate drivers with GaN FETs,…


Bringing Reliability to SiC Power Modules

Bringing Reliability to SiC Power Modules

Harnessing the unique electrical advantages of wide-bandgap silicon carbide (SiC) in commercial applications requires addressing reliability…


SiC LinPak Designed for Improved Switching Performance, Reliability

SiC LinPak Designed for Improved Switching Performance, Reliability

Each day that we wake up and turn on a light, the coffee machine, or electric stove to prepare breakfast, we expect all the electric motors,…


Q&A: Inside SiC Technology from Upstate New York

Q&A: Inside SiC Technology from Upstate New York

Wolfspeed has opened its Mohawk Valley Silicon Carbide fabrication facility in Marcy, N.Y. The 200 mm wafer fab aims to lead the transition from…


Gallium Nitride and Silicon Carbide: Compound Materials for Radiation-Hardened Applications

Gallium Nitride and Silicon Carbide: Compound Materials for Radiation-Hardened Applications

For a long time, silicon-based devices have represented the baseline standard in the semiconductor landscape. Starting from 2007, due to Moore’s…


CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems

CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems

The International Conference on Integrated Power Electronics Systems (CIPS) focuses on the technological background, starting with the components…


Eliminating Power Conversion Trade-Offs by Moving to 1700V SiC MOSFETs

Eliminating Power Conversion Trade-Offs by Moving to 1700V SiC MOSFETs

Designers of high-voltage power systems have struggled to meet customers’ needs for continued innovation when using silicon MOSFETs and IGBTs.…


GaN vs Silicon Smackdown

GaN vs Silicon Smackdown

One way to tell when a new technology has passed the tipping point of adoption is by the voices advocating the status quo. The more conservative…


SiC MOSFETs Push the Boundaries of Power Electronics

SiC MOSFETs Push the Boundaries of Power Electronics

ROHM’s 4th generation SiC MOSFETs offer improved characteristics compared to the older generation, and at lower prices. Several applications in…


SiC MOSFET Enhances Stability Under Real Application Conditions

SiC MOSFET Enhances Stability Under Real Application Conditions

The recently launched 1200 V CoolSiC™ MOSFET M1H comes with a variety of new features and improvements from which the targeted applications will…