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Research on Smart Distribution Transformers and Integrated Communication Applications

Research on Smart Distribution Transformers and Integrated Communication Applications

A smart distribution transformer architecture integrating condition monitoring, active voltage compensation, and AMI communication to improve…


Scalable SiC Traction Inverter Architecture for Next-Gen xEV Platforms

Scalable SiC Traction Inverter Architecture for Next-Gen xEV Platforms

Combining Mitsubishi Electric J3-Series 1300V SiC power modules with Mersen low-inductance laminated busbars to achieve high power density,…


Optimal Cooling Element Geometry

Optimal Cooling Element Geometry

Efficient cooling of electronic components requires balancing thermal performance with precise geometric tolerance specifications to ensure system…


Embedded Power Modules: Digital-Twin-Based Development for the Next Generation of SiC Inverters

Embedded Power Modules: Digital-Twin-Based Development for the Next Generation of SiC Inverters

Higher switching speed and increasing power density create new requirements for power semiconductor integration, parasitic behavior, thermal…


100 V GaN Transistor for AI, Industrial, and Motor-Drive Applications

100 V GaN Transistor for AI, Industrial, and Motor-Drive Applications

Learn how EPC’s 100 V EPC2375 GaN transistor features a novel 3-pad package that reduces resistance and maximizes efficiency, driving higher…


Building a Traction Inverter Around a Low-Inductance SiC Card

Building a Traction Inverter Around a Low-Inductance SiC Card

Fuji Electric’s new 3D-wired SiC module uses copper pins and a resin IMS to cut inductance by 76% and switching losses by 56%, boosting…


Switching Inductive Loads With a Mechanical Switch

Switching Inductive Loads With a Mechanical Switch

A mechanical switch’s headline current rating is a resistive rating. Switching an inductive load is a different problem, set by the flyback…


DC Anti-Backflow: Comparing Active ORing and Diode ORing for Reverse Current Protection

DC Anti-Backflow: Comparing Active ORing and Diode ORing for Reverse Current Protection

Reverse-current protection has become an integral part of overall power-system architecture. Selecting the appropriate ORing strategy requires…


Technical Articles Sep 23, 2026 by RECOM
Rethinking Inductor Sizing: The High-Gain Magnetic Illusion

Rethinking Inductor Sizing: The High-Gain Magnetic Illusion

By defining a Utilization Factor, this article debunks inductor sizing myths and presents a strategic framework for magnetic volume optimization in…


GaN Technology: Now With 2200 V Rating

GaN Technology: Now With 2200 V Rating

The release of 2200 V PowiGaN technology marks the next major step in high-voltage GaN power conversion. Power supply engineers grappling with the…


From Grid to GPU: Enabling Multi-Megawatt SST Architectures With High-Current SiC Power Modules

From Grid to GPU: Enabling Multi-Megawatt SST Architectures With High-Current SiC Power Modules

AI-driven data centers require power supplies with high efficiency, power density, and reliability. Solid-State Transformer (SST) architectures…


Design and Sustainability Strategies for Advanced High Power IGBT Modules

Design and Sustainability Strategies for Advanced High Power IGBT Modules

IGBT modules must optimize losses and reliability to meet green energy demands, using sustainable, lead-free manufacturing and high-density…


Modeling of Powder Core Inductors for Assessing the Accuracy of Finite Element Simulation

Modeling of Powder Core Inductors for Assessing the Accuracy of Finite Element Simulation

This article models the inductance of various powder core shapes using experimental data. It also compares inductance values obtained through…


Buffer Technology Improves Fast Recovery Diodes for High-Speed IGBTs

Buffer Technology Improves Fast Recovery Diodes for High-Speed IGBTs

This article deals with fast recovery diodes (FRDs), which are tailored for high-speed IGBT applications, aiming to reduce oscillations, voltage…


IGBT Modules With SLC+ Technology: A Strong Fit for Wind Converter Designs

IGBT Modules With SLC+ Technology: A Strong Fit for Wind Converter Designs

Engineered for modern wind converter applications, LV100 IGBT modules with SLC+ technology support high efficiency, improved power-cycling…


GaN Continues To Expand Its Role in AI Power Architectures

GaN Continues To Expand Its Role in AI Power Architectures

Learn how GaN technology is revolutionizing AI data centers by enabling high-efficiency power conversion for multi-kilowatt GPUs and emerging 800 V…


AI-Driven Battery Intelligence for UAVs

AI-Driven Battery Intelligence for UAVs

This article outlines the V.nod digital twin for UAVs: a battery-centric workflow using hardware-coupled emulation and AI. It validates batteries…


Breaking the Silicon Limit and Moving Beyond the SiC Ceiling

Breaking the Silicon Limit and Moving Beyond the SiC Ceiling

Learn how IceMOS Technology’s MEMS-based superjunction platform pushes power transistor limits, aiming to break the silicon barrier and surpass…


Why EV Inverter Efficiency Measurements Become Unreliable at Higher SiC Switching Frequencies

Why EV Inverter Efficiency Measurements Become Unreliable at Higher SiC Switching Frequencies

Learn why high-frequency SiC switching can distort EV inverter efficiency results and how a…


Industry White Papers In partnership with Hioki
High Reliability Preforms for Module-To-Heatsink Attach

High Reliability Preforms for Module-To-Heatsink Attach

Learn how Innolot 2.0 offers a cost-optimized, highly reliable solder alloy for EV power module heatsink attachment, delivering superior creep…