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Optimal Cooling Element Geometry

Optimal Cooling Element Geometry

Efficient cooling of electronic components requires balancing thermal performance with precise geometric tolerance specifications to ensure system…


Building a Traction Inverter Around a Low-Inductance SiC Card

Building a Traction Inverter Around a Low-Inductance SiC Card

Fuji Electric’s new 3D-wired SiC module uses copper pins and a resin IMS to cut inductance by 76% and switching losses by 56%, boosting…


High-Frequency 100 V GaN Motor Drives Push LV Motion Control to the Next Level

High-Frequency 100 V GaN Motor Drives Push LV Motion Control to the Next Level

100 V GaN motor drives enable high-frequency switching up to 100 kHz, delivering greater efficiency and power density, and lower noise than silicon…


Design and Sustainability Strategies for Advanced High Power IGBT Modules

Design and Sustainability Strategies for Advanced High Power IGBT Modules

IGBT modules must optimize losses and reliability to meet green energy demands, using sustainable, lead-free manufacturing and high-density…


Modeling of Powder Core Inductors for Assessing the Accuracy of Finite Element Simulation

Modeling of Powder Core Inductors for Assessing the Accuracy of Finite Element Simulation

This article models the inductance of various powder core shapes using experimental data. It also compares inductance values obtained through…


Switching Analysis: Testing for Reliability in Power Converter Designs

Switching Analysis: Testing for Reliability in Power Converter Designs

Build more reliable power converters with practical guidance on probe selection, test setup,…


Why EV Inverter Efficiency Measurements Become Unreliable at Higher SiC Switching Frequencies

Why EV Inverter Efficiency Measurements Become Unreliable at Higher SiC Switching Frequencies

Learn why high-frequency SiC switching can distort EV inverter efficiency results and how a…


Industry White Papers In partnership with Hioki
High Reliability Preforms for Module-To-Heatsink Attach

High Reliability Preforms for Module-To-Heatsink Attach

Learn how Innolot 2.0 offers a cost-optimized, highly reliable solder alloy for EV power module heatsink attachment, delivering superior creep…


Analytical Relationship Between Feedback Loop Properties and Load Transient Response in Voltage Converters

Analytical Relationship Between Feedback Loop Properties and Load Transient Response in Voltage Converters

Here we present a generic, topology-independent loop model for voltage converters, linking frequency-domain design to time-domain performance using…


Gate Driver Failure in High dv/dt Converters

Gate Driver Failure in High dv/dt Converters

High dv/dt switching can make gate drivers a point of failure. Parasitic coupling and false turn-on may cause unwanted switching and put extra…


Improving Efficiency and Thermal Margin in a 204 W Quarter-Brick Converter Using a 150 V MOSFET

Improving Efficiency and Thermal Margin in a 204 W Quarter-Brick Converter Using a 150 V MOSFET

Learn how 150 V SuperQ MOSFETs boost 204 W converter efficiency greater than 0.8%, cut heat by 2 W, and lower peak temps by 31°C. They improve…


Isolation Technology Under High dv/dt Stress

Isolation Technology Under High dv/dt Stress

Isolation technologies respond differently to fast voltage changes. This article examines how capacitive, magnetic, and optical isolation perform…


Isolated DC-DC Power Supplies: Module or Discrete Design?

Isolated DC-DC Power Supplies: Module or Discrete Design?

When is a fully integrated module the better option, and when does a discrete design offer the greater advantage? This story discusses the major…


Technical Articles May 27, 2026 by RECOM
Inside the Silicon Carbide JFET: Specs, Stability, and the New Performance Frontier

Inside the Silicon Carbide JFET: Specs, Stability, and the New Performance Frontier

Learn how SiC JFETs beat MOSFETs for next-gen power. They offer ultralow loss, superior stability, and rugged avalanche protection—critical for…


Precision Cooling of Performance Modules

Precision Cooling of Performance Modules

High power density in electronics necessitates efficient cooling. Learn how passive (heat sinks), forced (cooling aggregates/fans), and liquid…


High-Precision Digital Temperature Sensors Thanks to Wafer-Based Calibration

High-Precision Digital Temperature Sensors Thanks to Wafer-Based Calibration

Power electronics plays a crucial role in modern temperature sensor systems, enabling efficient signal conditioning, energy management, and data…


Thermal Management for SiC Semis—Top Side Cooling as an Innovative Solution

Thermal Management for SiC Semis—Top Side Cooling as an Innovative Solution

The growing demand for powerful and compact power electronics places high demands on the thermal management of modern semiconductor technologies.…


Solving Military-Avionics DC-DC Power Challenges with Modularity—Part 4

Solving Military-Avionics DC-DC Power Challenges with Modularity—Part 4

While the first three parts in this article series detailed military and avionic standards and front-end solutions, this last Part 4 delves into…


On-Chip Redundancy and the Myth of Independence

On-Chip Redundancy and the Myth of Independence

Redundancy is often treated as a numbers problem: add more blocks, duplicate critical functions, and safety improves. In battery management ICs,…


The Hidden Costs of Outdated Power Plant Practices — And How to Fix Them Fast

The Hidden Costs of Outdated Power Plant Practices — And How to Fix Them Fast

Building integrated and modern systems enable resilient, efficient, and safer operations that…