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 Securing and Scaling a Connected Grid: Communications Architecture

Securing and Scaling a Connected Grid: Communications Architecture

Modernizing the grid into a distributed, data-driven system requires secure and flexible communication networks to handle the growing complexity of connected devices.


EV Racecars Accelerate, Setting Speed and Endurance Records

EV Racecars Accelerate, Setting Speed and Endurance Records

Formula E racing has introduced its Gen4 racecar, while Ford has shattered speed records in electric drag racing.


News 23 hours ago by Claire Turvill
TI Intros 26-Cell Battery Monitor IC With Integrated Smart EIS Engine

TI Intros 26-Cell Battery Monitor IC With Integrated Smart EIS Engine

Unveiled today at PCIM, TI’s new automotive-grade battery monitor IC increases channel density by 44% and embeds real-time EIS to detect internal cell faults and mitigate thermal runaway.


A Three-Phase GaN QFN Module for High Power-Density Motor Drives

A Three-Phase GaN QFN Module for High Power-Density Motor Drives

The EPC91132 evaluation board is a 3-phase BLDC motor drive inverter board featuring the EPC33110 module, which integrates three monolithic gallium nitride (GaN) half-bridges.


AOS Targets Intel Panther Lake With Low-Quiescent-Power Controllers

AOS Targets Intel Panther Lake With Low-Quiescent-Power Controllers

Paired with compact smart power stages, the new digital multiphase controllers may extend notebook battery life by up to an hour.


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Briefs: Mobile EV Charging, Battery Testing, Anodes, and MOSFETs

Briefs: Mobile EV Charging, Battery Testing, Anodes, and MOSFETs

Alpine Energy, CATL, Graphite One, Polar Semiconductor, and Nexperia are developing products and facilities for vehicle-to-vehicle charging, energy storage system testing, anode materials, and power MOSFETs.


News Jun 04, 2026 by Karen Hanson
Infineon Intros 1300 V SiC Module Capable of 205°C Continuous Operation

Infineon Intros 1300 V SiC Module Capable of 205°C Continuous Operation

A new automotive silicon carbide power module pushes thermal boundaries to enhance electric vehicle traction inverter density and streamline cooling system demands.


TDK Squeezes 3 A in 2.5 mm Package for Optical Transceivers

TDK Squeezes 3 A in 2.5 mm Package for Optical Transceivers

The FS3303 is the first in an expanded lineup spanning 3 A to 80 A, aimed at powering the DSPs and photonic ICs in next-generation optical modules