Higher switching speed and increasing power density create new requirements for power semiconductor integration, parasitic behavior, thermal management, and validation effort.
The DF150 is the first in the company's Defiant Future series, targeting defense and industrial applications with MIL-STD certifications and fanless operation down to -46°C.
Learn how low quiescent current drivers and properly sized bootstrap capacitors resolve UVLO issues and maximize efficiency in low-frequency totem-pole converter slow leg designs.
Three low-profile models rated at 40 A, 60 A, and 80 A swap the potentiometer for DIP-switch voltage selection, with redundant variants available for parallel setups.
Designed for tight control cabinets, the DURAmax DC UPS combines 24V backup power with USB-C configuration, status monitoring, and battery management.
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GE Vernova, Tennessee Valley Authority, EVgo, Delta Electronics, Dukosi, Wärtsilä, and RCT Solutions have taken steps to meet future energy demands.
Fuji Electric’s new 3D-wired SiC module uses copper pins and a resin IMS to cut inductance by 76% and switching losses by 56%, boosting performance and design flexibility for EV inverters.
Engineers who think of thermal stability as a first-class design variable will build systems that last.
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