This new board-mounted power factor correction module claims to push power density boundaries to streamline power system design for space-constrained industrial, medical, and defense applications.
Two companies are developing robotics to automate labor-intensive construction tasks, while Google is investing in a massive, domestically sourced solar-plus-storage project
Learn how Innolot 2.0 offers a cost-optimized, highly reliable solder alloy for EV power module heatsink attachment, delivering superior creep performance and reduced thermal stress.
AI's demand for power density drives the need for smaller, integrated gate drivers. High-voltage designs using wide bandgap transistors often face footprint challenges.
Learn how to reduce voltage spikes in flyback converters using a low-cost, easy-to-implement clamping controller that improves efficiency and EMI performance without complex design changes.
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Carlo Gavazzi’s new insulation monitoring device targets unearthed DC systems to enhance safety and simplify integration in high-voltage Mode 4 DC electric vehicle charging stations.
The USC-run service that pioneered multi-project wafers in 1981 now offers a path from shared shuttle runs to full production on GlobalFoundries' FinFET and FD-SOI processes.
Alpha and Omega Semiconductor's AmpStack packaging stacks a complete 80 V half-bridge inside a single DFN6x5 footprint, cutting board space and parasitic inductance.
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