Latest Semiconductors Technical Articles

High power density in electronics necessitates efficient cooling. Learn how passive (heat sinks), forced (cooling…

High power density in electronics necessitates efficient cooling. Learn how passive (heat sinks), forced (cooling aggregates/fans), and liquid…

IEC partial standards miss dv/dt, thermal, and micro-PD effects in power modules, limiting their value for…

IEC partial standards miss dv/dt, thermal, and micro-PD effects in power modules, limiting their value for inverter-driven reliability prediction.

The growing demand for powerful and compact power electronics places high demands on the thermal management of modern…

The growing demand for powerful and compact power electronics places high demands on the thermal management of modern semiconductor technologies.…

Learn how two new Mitsubishi SLIMDIP IPMs address the growing need for high-efficiency power semiconductor devices in…

Learn how two new Mitsubishi SLIMDIP IPMs address the growing need for high-efficiency power semiconductor devices in consumer applications.

Learn how a new MOSFET architecture stretches the performance of silicon power devices using a patented approach.

Learn how a new MOSFET architecture stretches the performance of silicon power devices using a patented approach.

This step-by-step guide describes the basic concept of double pulse testing (DPT) and the…

This step-by-step guide describes the basic concept of double pulse testing (DPT) and the…

Learn how Mitsubishi’s in-house designed & developed efficient semiconductor bare-dies (SiC MOSFET & Si RC-IGBT) and…

Learn how Mitsubishi’s in-house designed & developed efficient semiconductor bare-dies (SiC MOSFET & Si RC-IGBT) and compact…

Learn how SiC inverter solutions offer a modular, functionally safe platform with certified components, accelerating…

Learn how SiC inverter solutions offer a modular, functionally safe platform with certified components, accelerating development and compliance…

The embedding of semiconductor dies, particularly GaN and SiC MOSFETs, into PCB structures provides multiple system-level…

The embedding of semiconductor dies, particularly GaN and SiC MOSFETs, into PCB structures provides multiple system-level benefits. Learn how this…

Silicon Carbide (SiC) has a 3x bandgap compared to silicon. Learn how unipolar devices like MOSETs in the several kV…

Silicon Carbide (SiC) has a 3x bandgap compared to silicon. Learn how unipolar devices like MOSETs in the several kV range are possible with SiC.

Compressors in refrigerators and freezers are headed for a time of change, as system designs must meet demands for…

Compressors in refrigerators and freezers are headed for a time of change, as system designs must meet demands for greater power efficiency. Learn…

SiC-based semiconductors can operate higher temperatures than silicon-based devices. Learn the unique challenges involved…

SiC-based semiconductors can operate higher temperatures than silicon-based devices. Learn the unique challenges involved with monitoring and…

Improvements in SiC wafering and epitaxy manufacturing challenges are delivering affordable, high-efficiency power semiconductors.

Improvements in SiC wafering and epitaxy manufacturing challenges are delivering affordable, high-efficiency power semiconductors.

EEPower’s collaboration with Bodo's Power Systems has yielded a wealth of technical articles addressing critical…

EEPower’s collaboration with Bodo's Power Systems has yielded a wealth of technical articles addressing critical industry trends and…

What causes failure in wide bandgap semiconductors, and how can engineers mitigate them?

What causes failure in wide bandgap semiconductors, and how can engineers mitigate them?

Transfer molded modules could meet new BEV requirements regarding power handling capability and electrical and thermal…

Transfer molded modules could meet new BEV requirements regarding power handling capability and electrical and thermal performance.

Trench MOS structures offer several benefits compared to traditional p-n junction solutions. Learn what they are here.

Trench MOS structures offer several benefits compared to traditional p-n junction solutions. Learn what they are here.

Power semiconductors contain bare chips that must be characterized before being placed in a package or power module but…

Power semiconductors contain bare chips that must be characterized before being placed in a package or power module but several challenges must…

The often cited I2t value describes a power semiconductor’s ability to withstand surge current events. However, the…

The often cited I2t value describes a power semiconductor’s ability to withstand surge current events. However, the dependency on the current…