Modern solar panels are demanding increasingly higher power density and longer operating lifetimes. Solar applications, including power optimizers…
June 07, 2023 by Shengke Zhang
This article presents an ultra-high-efficiency and high-power-density design of a power factor correction (PFC) and asymmetrical half-bridge (AHB)…
June 04, 2023 by Tom Ribarich
HV LinPak is a new package that adds to several options converter designers have for using Si IGBTs and SiC MOSFETs with nominal blocking voltages…
June 01, 2023 by Virgiliu Botan
High functional integration and power density are at the foundation of our energy-efficient, cost-effective power modules for motor drives tailored…
May 23, 2023 by Michele Portico
This article reviews the types and operation of stepper motor drive circuits used in precise positioning and control applications. It examines…
May 16, 2023 by Bob Odhiambo
Silver sintering and transient liquid phase soldering are replacement technologies for bonding using high reliability solder alloys. This article…
May 03, 2023 by Dmytro Pavlyuchkov
Although SiC MOSFETs offer many benefits, it took more than ten years for suppliers to consolidate and align specifications and standards. Today,…
April 25, 2023 by Chun Keong Tee
Isolated flying capacitor multilevel converters have various modes of operation critical to their proper working. This article explains the four…
April 24, 2023 by Rakesh Kumar
While embedded motor drives are gaining popularity in industrial applications, their compact size and tight integration present new challenges in…
April 11, 2023 by Vincotech
Transient thermal impedance is a measure of how a device behaves when pulsed power is applied. Transient thermal impedance is an important…
March 16, 2023 by Christophe Vaucourt
Innovative semiconductor design and packaging technologies are improving efficiencies in data centers as server power demands increase.
March 09, 2023 by Robert Taylor
Since the launch of GaN-on-Si enhancement mode power transistors in March 2010, there has been a slow but monotonic shift towards the adoption and…
March 07, 2023 by Alex Lidow
The challenge of IGBT module paralleling is to understand the necessary de-rating of power converters under consideration of different module…
February 27, 2023 by Nils Soltau
The number of semiconductors in nearly every application is multiplying. Many of the design challenges facing electronics engineers all tie back to…
February 24, 2023 by Robert Taylor
Vision systems are now incorporated into a variety of products. Processing the video signal is typically performed by a dedicated IC requiring…
February 23, 2023 by Yael Coleman
It is difficult to optimize the switching performance of IGBTs with only one fixed value for the gate resistor. The use of two-level slew-rate…
January 19, 2023 by Wolfgang Frank
Modern industrial plants place high demands on the reliability and interference immunity of power supplies. Typically, the plant components are…
January 18, 2023 by Timur Uludag
One relatively easy way for manufacturers to reduce the cost of electronic components is by using the same designs or components for disparate…
December 29, 2022 by Victor Khasiev
Navitas’ GaNSense technology provide size and loss savings to enable integration of the inverter with the motor.
December 21, 2022 by Alfred Hesener
An Application Example for xEV applications. Since the benefits of SiC power semiconductors for electric powertrains are proven, SiC power…
December 19, 2022 by ROHM Semiconductor
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