Latest ICs Technical Articles

Consortium-developed integrated power electronics for drives systems in electric and hybrid vehicles uses FTCAP DC link capacitors

Consortium-developed integrated power electronics for drives systems in electric and hybrid vehicles uses FTCAP DC link capacitors

This article features Texas Instrument on how the TPS62840 step-down converter in the DGR package can help system and…

This article features Texas Instrument on how the TPS62840 step-down converter in the DGR package can help system and equipment design teams meet…

This article highlights avalanche ruggedness of discrete 1.2 kV SiC MPS diodes.

This article highlights avalanche ruggedness of discrete 1.2 kV SiC MPS diodes.

This article investigates the performance and cost of different boost topologies for 1500V multi-string solar inverters.

This article investigates the performance and cost of different boost topologies for 1500V multi-string solar inverters.

This article breaks down the complexities found in the fundamental field of grounding for the correct, faultless…

This article breaks down the complexities found in the fundamental field of grounding for the correct, faultless operation of electrical systems.

This article highlights SEMIKRON IGBT Generation 7 that features four main advantages compared to previous generations.

This article highlights SEMIKRON IGBT Generation 7 that features four main advantages compared to previous generations.

This article introduces a 1700V soft recovery diode with different current ratings.

This article introduces a 1700V soft recovery diode with different current ratings.

This article highlights Analog Devices' LTC7821-based hybrid converter that has the benefits of both conventional buck…

This article highlights Analog Devices' LTC7821-based hybrid converter that has the benefits of both conventional buck converters and charge…

This article discusses how the cost differences can be bridged by the benefits of the 4x inductor size reduction, smaller…

This article discusses how the cost differences can be bridged by the benefits of the 4x inductor size reduction, smaller heat sink and smaller…

For the emerging mega-watt applications with SiC power devices, the proper validation of output chokes poses great challenges.

For the emerging mega-watt applications with SiC power devices, the proper validation of output chokes poses great challenges.

This article highlights Broadcom isolation technologies, namely the optocoupler, magnetic coupler, and capacitive coupler.

This article highlights Broadcom isolation technologies, namely the optocoupler, magnetic coupler, and capacitive coupler.

This article discusses the benefits of commercial GaN power transistors in comparison to Si SJMOS and SiC MOS transistors…

This article discusses the benefits of commercial GaN power transistors in comparison to Si SJMOS and SiC MOS transistors for a soft-switching LLC…

This article discusses Pre-Switch's solution for the elimination of switching losses by incorporating AI into the…

This article discusses Pre-Switch's solution for the elimination of switching losses by incorporating AI into the Auxiliary Resonant…

This article discusses the Modular DC-DC converters and their recent developments in terms of power density.

This article discusses the Modular DC-DC converters and their recent developments in terms of power density.

This article gives insight on Source-Down packaging technology, a key enabler for delivering the required power density…

This article gives insight on Source-Down packaging technology, a key enabler for delivering the required power density to feed the power-hungry…

This article discusses UnitedSiC's state of the art low-resistance power semiconductor switches and their characteristics…

This article discusses UnitedSiC's state of the art low-resistance power semiconductor switches and their characteristics and application…

This article focuses on the 2-level inverter and use this topology to exhibit the results

This article focuses on the 2-level inverter and use this topology to exhibit the results

This article provides an overview of the versatile combinations of chipsets and packaging and the resulting performance.

This article provides an overview of the versatile combinations of chipsets and packaging and the resulting performance.

This article introduces the µMaxPak, a proprietary power QFN package using automated low-cost QFN assembly technology.

This article introduces the µMaxPak, a proprietary power QFN package using automated low-cost QFN assembly technology.