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Improving Vacuum Solder Reflow for Challenging Power Module Packaging

Improving Vacuum Solder Reflow for Challenging Power Module Packaging

This article discusses the evaluation of flux-free soldering process for bare copper DBC substrate to Nickel-plated copper base plate soldering.


Internal Faraday Shield and Small Ci-o Friendly Optocoupler Galvanic Isolation Performance

Internal Faraday Shield and Small Ci-o Friendly Optocoupler Galvanic Isolation Performance

This article highlights Broadcom isolation technologies, namely the optocoupler, magnetic coupler, and capacitive coupler.


The Power of Dowell’s Equations and Curves

The Power of Dowell’s Equations and Curves

This article discusses Dowell's equation and how it provides a powerful analytical tool for magnetics engineers.


Design Considerations for a GaN-Based High Frequency LLC Resonant Converter

Design Considerations for a GaN-Based High Frequency LLC Resonant Converter

This article discusses the benefits of commercial GaN power transistors in comparison to Si SJMOS and SiC MOS transistors for a soft-switching LLC…


What Makes a Strong Magnetic Design?

What Makes a Strong Magnetic Design?

The story of magnetics in Europe has many important researchers and engineers involved in winding coils and preparing winding machines.


AI-Powered Architecture Unleashes Future Silicon IGBT and SiC Improvements

AI-Powered Architecture Unleashes Future Silicon IGBT and SiC Improvements

This article discusses Pre-Switch's solution for the elimination of switching losses by incorporating AI into the Auxiliary Resonant…


Getting the Most Out of a DC/DC Converter

Getting the Most Out of a DC/DC Converter

This article discusses the Modular DC-DC converters and their recent developments in terms of power density.


Solving the Power Density Challenge

Solving the Power Density Challenge

This article gives insight on Source-Down packaging technology, a key enabler for delivering the required power density to feed the power-hungry…


Why are Ultra-Low On-Resistance SiC FETs Hot?

Why are Ultra-Low On-Resistance SiC FETs Hot?

This article discusses UnitedSiC's state of the art low-resistance power semiconductor switches and their characteristics and application…


 Value Enhancement of Full SiC 3.3kV Power Module

Value Enhancement of Full SiC 3.3kV Power Module

This article focuses on the 2-level inverter and use this topology to exhibit the results


Versatile IGBT Power Modules for Demanding Industrial and Automotive Applications

Versatile IGBT Power Modules for Demanding Industrial and Automotive Applications

This article provides an overview of the versatile combinations of chipsets and packaging and the resulting performance.


Scalability of SiC Near Chip-Scale Packages for Electric Vehicle & Locomotive Traction

Scalability of SiC Near Chip-Scale Packages for Electric Vehicle & Locomotive Traction

This article introduces the µMaxPak, a proprietary power QFN package using automated low-cost QFN assembly technology.


SiC-Based Totem Pole PFC for Industrial Power Supplies

SiC-Based Totem Pole PFC for Industrial Power Supplies

This article focuses on the AC-to-DC stage with power factor correction


IRS2452AM Class D Amplifier IC

IRS2452AM Class D Amplifier IC

The Revolutionary New Impedance Analyzer

The Revolutionary New Impedance Analyzer

This article discusses how replacing loop with HIL devices opens new possibilities for developing and testing power electronic systems.


How Thermal Environment Impacts Power Supply Success

How Thermal Environment Impacts Power Supply Success

How Thermal Environment Impacts Power Supply Success.


Investigating Effects of Non-Idealities of Current Sensors and Powertrain on the Performance of an EV System using PLECS Simulation Software

Investigating Effects of Non-Idealities of Current Sensors and Powertrain on the Performance of an EV System using PLECS Simulation Software

This article highlights Plexim Incorporated PLECS is a simulation tool developed for drives engineers for very efficient and robust modeling of…


Envelope Tracking for Cellular RF Power Amplifiers

Envelope Tracking for Cellular RF Power Amplifiers

This article highlights Texas Instruments envelope tracking that is a new power management technology for improving PA efficiency of LTE transmitters.


Increasing Power Density Consider Packaging and Silicon

Increasing Power Density Consider Packaging and Silicon

This article features Nexperia's LFPAK package family designed to improve power density.


Producing Negative Voltages Using a Buck Controller

Producing Negative Voltages Using a Buck Controller

This article features Analog's LTC3892 dual output controllers used to produce a negative output voltage with a Ćuk topology.