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Solving Industry Inrush Current Problem with IXYS Digital Power Controller

Solving Industry Inrush Current Problem with IXYS Digital Power Controller

This article illustrates advantages of digital power control that overcomes many disadvantages of the inrush current problems with power devices.


Packaging GaN in a TO247

Packaging GaN in a TO247

This article describes how Transphorm Inc. developed a 63 mOhm 600V GaN HEMT (high electron mobility transistor) to be packaged in a TO-247.


How to Reduce up to 20 Percent of Power Loss in Cordless Power Tools

How to Reduce up to 20 Percent of Power Loss in Cordless Power Tools

This article features an investigation on the feasibility of replacing TO-220 package MOSFETs with a much smaller SuperSO8 package MOSFET


Developing Embedded Controls using PLECSPIL

Developing Embedded Controls using PLECSPIL

This article presents a methodology and product to help embedded controls engineers develop and test sophisticated real-time power conversion…


Robustness of SiC JFETs and Cascodes

Robustness of SiC JFETs and Cascodes

This article sheds light on the short-circuit and avalanche behavior of the standalone JFET, and how it is altered in the cascode implementation


Highly Reliable Transfer-Molded Power Modules

Highly Reliable Transfer-Molded Power Modules

This article describes a high power IGBT module for electric and hybrid electric vehicle inverters and offers technical concepts and benefits.


DeRisking the Route to Silicon Carbide

DeRisking the Route to Silicon Carbide

This article highlights Raytheon UK’s Semiconductor Business Unit with high-temperature SiC (HiTSiC) technology for an advanced SiC manufacturing…


EMC Simulation of Cable Interference in Ecars

EMC Simulation of Cable Interference in Ecars

This article presents three geometry simulation models of the basic components in an E-car to obtain optimum cable length and receive suitable EMC.


MADMIX The Standard for Measuring SMPS Inductors

MADMIX The Standard for Measuring SMPS Inductors

This article introduces the advantages and features of MinDCet's MADMIX for power electronics industry to consistently measure inductors in…


Magnetics Design Tool for Power Applications

Magnetics Design Tool for Power Applications

This article discusses the features of the free app, SOFT Power, for simulations such as hysteresis modelling for reliable design of power…


Performance Comparisons of SiC Transistors GaN Cascodes and Si  Coolmos in SMPS

Performance Comparisons of SiC Transistors GaN Cascodes and Si Coolmos in SMPS

This article compares the performances of SiC Transistors, GaN Cascodes and Si-Coolmos in Switch Mode Power Supplies through extensive tests.


Get to Market Faster with Digital Power

Get to Market Faster with Digital Power

This article presents the advantages of transitioning to digital power regulators for faster and easier design process and reduced design cycle.


Power Modules Win Out but Choose Wisely

Power Modules Win Out but Choose Wisely

This article introduces and describes IISL8203M control scheme that allows good transient performance with excellent peak-to-peak variation.


Biricha Lecture Notes on Analog and Digital Power Supply Design Part 1C

Biricha Lecture Notes on Analog and Digital Power Supply Design Part 1C

This article discusses the transfer functions and role in helping engineers in designing circuits in the frequency domain, shaping the…


Automated Acoustic Inspection for IGBT Modules

Automated Acoustic Inspection for IGBT Modules

This article discusses the non-destructive inspecting of IGBT modules for internal structural defects such as voids, non-bonds, delamination and…


The Nichols Chart  the Practical Tool for Design and Test

The Nichols Chart the Practical Tool for Design and Test

This article presented the Nichols Chart, invented by Nathaniel Nichols in 1947, as the superior practical method for feedback loop design and test.


Bond Buffer – Increase Power Density and Lifetime without Changing the System

Bond Buffer – Increase Power Density and Lifetime without Changing the System

This article discusses Danfoss Bond Buffer Technology and its impact on improving power density and lifetime of power modules without changing the…


Pushing Hall Effect Technology to New Limits

Pushing Hall Effect Technology to New Limits

This article discusses how to use LEM uses Hall Effect Technology to manage fluxgate and improve efficiency, productivity and performance in many…


Analysing Thermal Performance of Intelligent Power Modules for Better PCB Design

Analysing Thermal Performance of Intelligent Power Modules for Better PCB Design

This article discusses module thermal performance under various operating conditions to predict operating temperature, power and PCB design for…