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Bond Buffer – Increase Power Density and Lifetime without Changing the System

Bond Buffer – Increase Power Density and Lifetime without Changing the System

This article discusses Danfoss Bond Buffer Technology and its impact on improving power density and lifetime of power modules without changing the…


Pushing Hall Effect Technology to New Limits

Pushing Hall Effect Technology to New Limits

This article discusses how to use LEM uses Hall Effect Technology to manage fluxgate and improve efficiency, productivity and performance in many…


Analysing Thermal Performance of Intelligent Power Modules for Better PCB Design

Analysing Thermal Performance of Intelligent Power Modules for Better PCB Design

This article discusses module thermal performance under various operating conditions to predict operating temperature, power and PCB design for…