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The Search for High-Performance, Low-cost PFC Solutions

The Search for High-Performance, Low-cost PFC Solutions

This article discusses how the cost differences can be bridged by the benefits of the 4x inductor size reduction, smaller heat sink and smaller…


Design Considerations for a GaN-Based High Frequency LLC Resonant Converter

Design Considerations for a GaN-Based High Frequency LLC Resonant Converter

This article discusses the benefits of commercial GaN power transistors in comparison to Si SJMOS and SiC MOS transistors for a soft-switching LLC…


AI-Powered Architecture Unleashes Future Silicon IGBT and SiC Improvements

AI-Powered Architecture Unleashes Future Silicon IGBT and SiC Improvements

This article discusses Pre-Switch's solution for the elimination of switching losses by incorporating AI into the Auxiliary Resonant…


Why are Ultra-Low On-Resistance SiC FETs Hot?

Why are Ultra-Low On-Resistance SiC FETs Hot?

This article discusses UnitedSiC's state of the art low-resistance power semiconductor switches and their characteristics and application…


 Value Enhancement of Full SiC 3.3kV Power Module

Value Enhancement of Full SiC 3.3kV Power Module

This article focuses on the 2-level inverter and use this topology to exhibit the results


Versatile IGBT Power Modules for Demanding Industrial and Automotive Applications

Versatile IGBT Power Modules for Demanding Industrial and Automotive Applications

This article provides an overview of the versatile combinations of chipsets and packaging and the resulting performance.


Scalability of SiC Near Chip-Scale Packages for Electric Vehicle & Locomotive Traction

Scalability of SiC Near Chip-Scale Packages for Electric Vehicle & Locomotive Traction

This article introduces the µMaxPak, a proprietary power QFN package using automated low-cost QFN assembly technology.


SiC-Based Totem Pole PFC for Industrial Power Supplies

SiC-Based Totem Pole PFC for Industrial Power Supplies

This article focuses on the AC-to-DC stage with power factor correction


Increasing Power Density Consider Packaging and Silicon

Increasing Power Density Consider Packaging and Silicon

This article features Nexperia's LFPAK package family designed to improve power density.


Rugged 600V 3-Phase Gate Driver with Integrated Bootstrap Diode and Fast Over-current Protection

Rugged 600V 3-Phase Gate Driver with Integrated Bootstrap Diode and Fast Over-current Protection

This article highlights STMicroelectronics STDRIVE601 monolithic device embedding three half-bridge gate drivers for N channel power MOSFETs or IGBTs.


Design and Optimization of Silicon Carbide Schottky Diode

Design and Optimization of Silicon Carbide Schottky Diode

This article highlights WeEn Semiconductors WeEn NXPSC0465 device for design and optimization of Silicon Carbide (SiC) Schottky Diode.


Kelvin Emitter Configuration Further Improves Switching Performance of TRENCHSTOP 5 IGBTs

Kelvin Emitter Configuration Further Improves Switching Performance of TRENCHSTOP 5 IGBTs

This article investigates the full-bridge LLC converter with variable-frequency operation and multi-domain interactions through modelling and…


The Optimal Design for High Frequency GaN-Based Totem Pole PFC

The Optimal Design for High Frequency GaN-Based Totem Pole PFC

This article highlights GaN Systems EMI filter modelling methodology for a high frequency Bridgeless Totem Pole Power Factor Correction Circuit…


Simulating WideBandgap Power Circuits Using Advanced Characterization and Modeling

Simulating WideBandgap Power Circuits Using Advanced Characterization and Modeling

This article highlights Keysight Technologies Incorporated simulation of wide-bandgap (WBG) power semiconductor devices with characterization and…


Automotive High Capacity Power Module

Automotive High Capacity Power Module

The automotive industry is currently undergoing a tremendous change. Due to higher awareness of the negative impact of air pollutants on human…


Rectifier Package Development

Rectifier Package Development

This article features Taiwan Semiconductor Europe SMA and SMD Package as newer packages that transport heat more efficiently and waste less space…


Demystifying the Paralleling of IGBT Modules

Demystifying the Paralleling of IGBT Modules

Demystifying the Paralleling of IGBT Modules.


EconoDUAL 3 has Highest Power Density and Performance Using New IGBT7

EconoDUAL 3 has Highest Power Density and Performance Using New IGBT7

This article highlights Infineon chipset of IGBT7 and emitter-controlled 7 diode that is user-friendly and optimized to fulfill the GPD requirements.


A High Temperature Gate Driver for Half Bridge SiC MOSFET 62mm Power Modules

A High Temperature Gate Driver for Half Bridge SiC MOSFET 62mm Power Modules

This article features CISSOID CMT-TIT8243 high temperature high voltage isolated Gate Driver for 62mm SiC MOSFET power modules with High peak gate…


Designing a SiCMOSFET Based 66kW BiDirectional EV OnBoard Charger

Designing a SiCMOSFET Based 66kW BiDirectional EV OnBoard Charger

This article discusses how to design a SiC-MOSFET Based 6.6kW Bi-Directional EV On-Board Charger.