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Digital Power Comes of Age

Digital Power Comes of Age

This article describes the factors that have driven the evolution of distributed power architectures of HF DC-DC converter modules and offers…


LLC Resonant Converter Simulation Using PLECS

LLC Resonant Converter Simulation Using PLECS

This article discusses simulation of resonant LLC converter using PLECS that permits analysis of transient effects from multiple physical domains.


Enhanced Trench IGBTs and Field Charge Controlled Diode: The Next Leap in IGBT and Diode Performance

Enhanced Trench IGBTs and Field Charge Controlled Diode: The Next Leap in IGBT and Diode Performance

This article discusses the future generation of IGBT modules which will employ Enhanced Trench ET-IGBTs and Field Charge Extraction and their…


eGaN Technology Transforming the Future

eGaN Technology Transforming the Future

This article discusses the potential of eGaN technology in various applications such as outer space, machine interface, electricity and medicine.


The Nichols Chart  the Practical Tool for Design and Test

The Nichols Chart the Practical Tool for Design and Test

This article presented the Nichols Chart, invented by Nathaniel Nichols in 1947, as the superior practical method for feedback loop design and test.


InDUR Nonlinear and SiFe – Special AC Filter and DC Power Inductors

InDUR Nonlinear and SiFe – Special AC Filter and DC Power Inductors

This article discusses the new applications of the thermally optimized STS InDUR inductors are presented and offers method to optimize the…


Bond Buffer – Increase Power Density and Lifetime without Changing the System

Bond Buffer – Increase Power Density and Lifetime without Changing the System

This article discusses Danfoss Bond Buffer Technology and its impact on improving power density and lifetime of power modules without changing the…


High Power Density Dual  nHPD2 Packaging Generation

High Power Density Dual nHPD2 Packaging Generation

This article introduces Hitachi's nHPD2 and its benefits in terms of market potential, performance, modularity and ease of transition.


Where is the Journey Headed? The Future of High-Power Semiconductors

Where is the Journey Headed? The Future of High-Power Semiconductors

This article discusses the future of high-power semiconductors in power electronics systems technology of energy savings, dynamics and noise…


Pushing Hall Effect Technology to New Limits

Pushing Hall Effect Technology to New Limits

This article discusses how to use LEM uses Hall Effect Technology to manage fluxgate and improve efficiency, productivity and performance in many…


The eGaN FET Supply Chain

The eGaN FET Supply Chain

This article discusses the supply chain of silicon MOSFETs and eGaN FET and offers their capital investment and product costs and effect against…


Thermal Efficiency of Chipscale Packaging for eGaN® FETs

Thermal Efficiency of Chipscale Packaging for eGaN® FETs

This article discusses the thermal performance of the chipscale package and compare with the state-of-the-art power MOSFET packaging available today.


Optimized Core and Bobbin Allow for more than 25 Percent Increase in Power Handling

Optimized Core and Bobbin Allow for more than 25 Percent Increase in Power Handling

This article discusses the innovative design approach for Pulse's EP13 plus platform with the ability to provide more power with similar…


Voltage Proof on the Highest Level

Voltage Proof on the Highest Level

This article discusses important insights about polymer aluminum electrolytic capacitor such as construction, properties, lifetime and…


Analysing Thermal Performance of Intelligent Power Modules for Better PCB Design

Analysing Thermal Performance of Intelligent Power Modules for Better PCB Design

This article discusses module thermal performance under various operating conditions to predict operating temperature, power and PCB design for…


The Expanding Markets for GaN Technology

The Expanding Markets for GaN Technology

This article discusses the expanding markets for GaN technology and offers some insights and reasons why it is better than their silicon-counterparts.