Latest Rail Technical Articles

This article discusses the benefits and advantages of CoolMOS CFD2 in terms of efficiency in motor drive applications and…

This article discusses the benefits and advantages of CoolMOS CFD2 in terms of efficiency in motor drive applications and gives recommended layouts.

This article discusses how the implementation of three module approach can help lower the total cost of ownership and…

This article discusses how the implementation of three module approach can help lower the total cost of ownership and maximum junction temperature.

This article focuses on automotive-grade SiC power devices, including some of their common applications and reliability data.

This article focuses on automotive-grade SiC power devices, including some of their common applications and reliability data.

This article highlights GaN Systems Inc. comparison of GaN E-HEMTs and SiC MOSFET performance and characteristics in…

This article highlights GaN Systems Inc. comparison of GaN E-HEMTs and SiC MOSFET performance and characteristics in power switching applications.

This article discusses the advantages of using the innovative approach to Remote Sense for power supply test and…

This article discusses the advantages of using the innovative approach to Remote Sense for power supply test and measurement applications.

This article discusses the advantages and benefits of applying Infineon's SiC MOSFETs with blocking voltages of 1200V in…

This article discusses the advantages and benefits of applying Infineon's SiC MOSFETs with blocking voltages of 1200V in various application…

This article highllights MPS Dynamic Power Path Management (DPPM) scheme that adjusts the charge current dynamically on…

This article highllights MPS Dynamic Power Path Management (DPPM) scheme that adjusts the charge current dynamically on the input source current…

This article highlights Wolfspeed C3M™ SiC MOSFETs that considers package inductance and printed circuit board layout…

This article highlights Wolfspeed C3M™ SiC MOSFETs that considers package inductance and printed circuit board layout as factors for best system…

This article features a novel technique to redue substrate tilt and improve bondline control between AIN substrate and…

This article features a novel technique to redue substrate tilt and improve bondline control between AIN substrate and AlSiC Baseplate in IGBT…

This article has introduced new closed-loop Hall cell transducers which give the extra performance of fluxgate…

This article has introduced new closed-loop Hall cell transducers which give the extra performance of fluxgate transducers without the extra cost.

This article provides insight into the latest generation of 6.5kV HiPak modules with reliable performance demonstrated in…

This article provides insight into the latest generation of 6.5kV HiPak modules with reliable performance demonstrated in the new THB-HVDC test.

This article discusses a flexible approach to gate drive designs using nHPD2 package from Hitachi targeted at traction…

This article discusses a flexible approach to gate drive designs using nHPD2 package from Hitachi targeted at traction applications.

This article highlights Panasonic Hybrid Drain Gate Injection Transistor (HD-GiT) with overview of advantages that aimed…

This article highlights Panasonic Hybrid Drain Gate Injection Transistor (HD-GiT) with overview of advantages that aimed aimed at power converters.

This article features the 7th generation IGBT Module based on SLC (SoLid Cover)-Technology with high reliability and high…

This article features the 7th generation IGBT Module based on SLC (SoLid Cover)-Technology with high reliability and high thermal conductivity.

This article features the advantages and benefits of implementing bi-directional power design allowing full reversible power flow.

This article features the advantages and benefits of implementing bi-directional power design allowing full reversible power flow.

This article discusses the optimization of heat sinks to be used in handheld devices particularly on heat sink spacing…

This article discusses the optimization of heat sinks to be used in handheld devices particularly on heat sink spacing and thickness.

This article features the new Infineon HybridPACK Drive IGBT module characterized with compact design and high efficiency…

This article features the new Infineon HybridPACK Drive IGBT module characterized with compact design and high efficiency for e-mobility applications.

This article highlights Vincotech GmbH the benefits of combining the lowinductiveVINco X12 package and the Mitsubishi gen…

This article highlights Vincotech GmbH the benefits of combining the lowinductiveVINco X12 package and the Mitsubishi gen 7 for outstanding…

This article features the IXYS' IXIDM1401 high-voltage isolated gate driver module and its features, higher performance…

This article features the IXYS' IXIDM1401 high-voltage isolated gate driver module and its features, higher performance and reliability.