This article highlights Avnet Silica devices featuring STSiC Power components for SiC information.
May 04, 2021 by Thomas Hauer
This article highlights publicly-funded project MessLeha addresses this issue by defining a machine-readable data sheet to support the setup of…
March 30, 2021 by Uwe Jansen
This article discusses the challenges that thermal management raises due to increased power density, especially with chip-scale-packaging (CSP).
March 15, 2021 by John Glaser
This article highlights Infineon Technologies AG CoolSiC™ MOSFET performance that are for servo-drive systems, which are typically characterized…
February 24, 2021 by Blaz Klobucar
This article highlights eviewed the parameters of the new G4 UJ4C 750V SiC FETs from UnitedSiC compared to SiC MOSFETs and Superjunction FETs in…
February 15, 2021 by Anup Bhalla, UnitedSiC
Learn about the electrostatic discharge (ESD) events, component ESD qualification tests, and the ESD protection strategies commonly employed in ICs.
January 29, 2021 by Lorenzo Mari
This article highlights TDK 3D design techniques that can help reduce parasitic losses, and improve thermal performance while also reducing the PCB…
January 25, 2021 by Tony Ochoa
In high switching frequency applications, the high commutation slopes of the power switches require immunity against high levels of common mode…
January 20, 2021 by Vladimir Scarpa
This article highlights Keysight Technologies that overcome the challenges associated with GaN FET dynamic characterization.
November 02, 2020 by Ryo Takeda
This article describes the steps of development and research carried out to design a clamping system for disc semiconductors and analyzes the…
October 05, 2020 by Proton-Electrotex
This article highlights the drawbacks, advantages, and features of silicon carbide current-limiting devices.
July 27, 2020 by Jean Baptiste Fonder
This article discusses Pre-Switch's solution for the elimination of switching losses by incorporating AI into the Auxiliary Resonant…
March 16, 2020 by Bruce Renouard
This article focuses on the 2-level inverter and use this topology to exhibit the results
March 09, 2020 by Katsuaki Saito
This article introduces the µMaxPak, a proprietary power QFN package using automated low-cost QFN assembly technology.
February 24, 2020 by Courtney Furnival
This article features Nexperia's LFPAK package family designed to improve power density.
January 28, 2020 by Neil Massey
This article highlights WeEn Semiconductors WeEn NXPSC0465 device for design and optimization of Silicon Carbide (SiC) Schottky Diode.
January 10, 2020 by Alex Cui
This article highlights Keysight PD1500A Dynamic Power Device Analyzer/DPT as next generation dynamic test platform for power semiconductor device.
August 13, 2019 by Ryo Takeda
This article features JSC Proton-Electrotex research and development to find structural and technological solutions providing increased insulation…
August 09, 2019 by Sergey Antonov
This article highlights Efficient Power Conversion eGaN FETs improvements in size and performance compared with equivalently Silicon power MOSFETs.
June 20, 2019 by Alex Lidow
This article highlights Transphorm Incorporated TPH3205WSQA device field reliability data for high voltage GaN power converters applications.
April 16, 2019 by Ronald Barr
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