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Latest Semiconductors & ICs Technical Articles

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How to Compensate for Temperature Sensor Accuracy at Hot and Cold Extremes

How to Compensate for Temperature Sensor Accuracy at Hot and Cold Extremes

This article discusses the method of compensating non-linear accuracy characteristics of temperature sensors for higher-accuracy embedded systems.


Building Higher Reliability Power MOSFETs at a Lower Cost

Building Higher Reliability Power MOSFETs at a Lower Cost

This article discusses the advantages and the promising benefits of SiC MOSFETs for power conversion systems in PV inverters, data centers, and more.


How Off-Board Charger Can Benefit from the Rapid Implementation of Power Semiconductors

How Off-Board Charger Can Benefit from the Rapid Implementation of Power Semiconductors

This article discusses the requirements for off-board electric vehicle chargers and introduces Vincotech's platform for chargers OEM.


An Introduction to Utilizing the AVSBus Interface in Power Design

An Introduction to Utilizing the AVSBus Interface in Power Design

This article discusses the advantages and benefits of AVSBus, a protocol for DVFS for faster clock speed and lesser switching losses.


Evaluating Silver Sintering as a Reliable Die-Attach Material for Automotive Power Module Applications

Evaluating Silver Sintering as a Reliable Die-Attach Material for Automotive Power Module Applications

This article discusses the benefits of double-sided silver-sintering technology and demonstrate the superiority over conventional solder.


LinPak, the Standard Expands to 3300V and Shows Excellent Parallel Operation as well as SiC Readiness

LinPak, the Standard Expands to 3300V and Shows Excellent Parallel Operation as well as SiC Readiness

This article presents general module design considerations and first results on switching characteristics of LinPaks in different configurations.


Lifetime Analysis of PrimePACK™ Modules with IGBT5 and .XT

Lifetime Analysis of PrimePACK™ Modules with IGBT5 and .XT

This article introduces Infineon Technologies'novel joinging technology .XT for PrimePack power modules and it's advantages over…


Thermal Management of Semiconductors

Thermal Management of Semiconductors

This article introduces EPCOS' NTC and PTC sensors with different characteristics for thermal management of a wide variety of semiconductor…


Enhanced IGBT Module Power Density Utilizing the Improved Thermal Conductivity of SLC-Technology

Enhanced IGBT Module Power Density Utilizing the Improved Thermal Conductivity of SLC-Technology

This article introduces the new IGBT module generation of Mitsubishi Electric with improved Insulated Metal Baseplate as a key element of the…


Improving Thermal Performance with Chip-Scale Packaged Gallium Nitride Transistors

Improving Thermal Performance with Chip-Scale Packaged Gallium Nitride Transistors

This article discusses the advantages of chip-scale packaging of GaN transistors by evaluating its thermal performance and efficiency.


Design Methodology for First Pass Success: A rationale for hardware simulation

Design Methodology for First Pass Success: A rationale for hardware simulation

This article highlights the importance of modelling and simulation task in design methodology to reduce the number of design iterations and acquire…


High Current Power MOSFET with Current Mirror and Temperature Sense Diodes

High Current Power MOSFET with Current Mirror and Temperature Sense Diodes

This article discusses the advantages of IXYS' MMIXT132N50P3 with current mirror to monitor the drain current and its various applications.


Recent Advancements in IGCT Technologies for High-Power Electronics Applications

Recent Advancements in IGCT Technologies for High-Power Electronics Applications

This article discusses the main features which make the IGCT an attractive option for high power applications with respect to the technology…


Simplify Power Electronics Design with GaN Power ICs

Simplify Power Electronics Design with GaN Power ICs

This article highlights Gallium Nitride's (GAN) advantages over silicon in terms of performance to finally displace silicon in power devices.


Overcoming Challenges in Driving Silicon Carbide Power Modules

Overcoming Challenges in Driving Silicon Carbide Power Modules

This article discusses the advancements of AgileSwitch in Programmable Gate Drivers.


No Need for External Sensors in New Inverters

No Need for External Sensors in New Inverters

This article introduces IC integration to allow PCB based sensor solutions for the reduction of cost and footprint of power converters.


CIPS 2016 - Power Electronics in Challenging Little Boxes and More

CIPS 2016 - Power Electronics in Challenging Little Boxes and More

This article discusses methods on solving challenges in power electronics and suggests methods to improve performance of power electronics…


Direct Cooled Molded Power Module for Motor Integration in Electric and Hybrid Vehicles

Direct Cooled Molded Power Module for Motor Integration in Electric and Hybrid Vehicles

This article offers a solution to improve motor drive's package density to reduce the production costs and better design and flexibility.


Low Loss Thyristors for High Power Applications

Low Loss Thyristors for High Power Applications

This article describes a new 8.5 kV low loss thyristor family designed for industrial applications with full blocking capability at 50Hz/60Hz…


Neo-Iso™ Power Switch Enables IoT and Industrial Systems Better than Mechanical and Solid State Relays

Neo-Iso™ Power Switch Enables IoT and Industrial Systems Better than Mechanical and Solid State Relays

This article discusses how SemTech's Neo-Iso™ power switch enables IoT and industrial systems better than mechanical and solid-state relays.