Latest Silicon Technical Articles

This article highlights Infineon CoolSiC™ G6 diode as the new sixth generation of SiC Schottky diodes that reduced…

This article highlights Infineon CoolSiC™ G6 diode as the new sixth generation of SiC Schottky diodes that reduced conduction losses and surge…

This article highlights Infineon CoolSiC™ semiconductor solutions with an implementation of a 1200 V CoolSiC™ MOSFET…

This article highlights Infineon CoolSiC™ semiconductor solutions with an implementation of a 1200 V CoolSiC™ MOSFET in three-phase Si based…

This article highlights Vincotech M7 chip and the SLC package technology utilized by VINco E3 product line for an…

This article highlights Vincotech M7 chip and the SLC package technology utilized by VINco E3 product line for an efficient and reliable mid-power…

This article highlights semiconductor solutions using Infineon Technologies AG IGBT modules belonging to the PrimePACK™…

This article highlights semiconductor solutions using Infineon Technologies AG IGBT modules belonging to the PrimePACK™ family equipped with…

This article discusses the improvements brought by equipping sense emitter feature and on-chip temperature sensor to…

This article discusses the improvements brought by equipping sense emitter feature and on-chip temperature sensor to Si-IGBT modules.

This article features the benefits of using SiC Power Modules in terms of energy conversion efficiency, cost-efficiency…

This article features the benefits of using SiC Power Modules in terms of energy conversion efficiency, cost-efficiency and environmental energy…

For standard low voltage (≤690Vac) motor drives the IGBT based voltage source 2 level topology dominates the landscape.…

For standard low voltage (≤690Vac) motor drives the IGBT based voltage source 2 level topology dominates the landscape. However at higher…

This article discusses tips on properly designing IGBT or SiC FET bridge circuits to prevent false triggering and ensure…

This article discusses tips on properly designing IGBT or SiC FET bridge circuits to prevent false triggering and ensure high reliability.

This article discusses how acoustic micro imaging tools work and how it helps detect and keep defective capacitors out of…

This article discusses how acoustic micro imaging tools work and how it helps detect and keep defective capacitors out of production.

This article highlights Advanced Packaging Center and Alpha Assembly Solutions Silver (Ag) sintering proven and reliable…

This article highlights Advanced Packaging Center and Alpha Assembly Solutions Silver (Ag) sintering proven and reliable bonding technology for…

> <p>This article highlights ROHM about the potential structures of SiC devices, focusing on different structures and…

> <p>This article highlights ROHM about the potential structures of SiC devices, focusing on different structures and showing that…

This article highlights SiCrystal AG and Rohm Semiconductor GmbH for the potential of Silicon Carbide material for power…

This article highlights SiCrystal AG and Rohm Semiconductor GmbH for the potential of Silicon Carbide material for power and RF electronics…

This article features the ABB's third generation of 1700V SPT++ IGBTs which is capable of operating up to a max…

This article features the ABB's third generation of 1700V SPT++ IGBTs which is capable of operating up to a max temperature of 175˚C.

This article discusses the advantages and benefits of MiniSKiip with Si3N4 AMB Substrate and compares that of the…

This article discusses the advantages and benefits of MiniSKiip with Si3N4 AMB Substrate and compares that of the conventional counterpart.

This article discusses the advantages of chip-scale packaging of GaN transistors by evaluating its thermal performance…

This article discusses the advantages of chip-scale packaging of GaN transistors by evaluating its thermal performance and efficiency.

This article discusses the advancements of AgileSwitch in Programmable Gate Drivers.

This article discusses the advancements of AgileSwitch in Programmable Gate Drivers.

This article highlights the advantages of GaN E-HMET from GaN Systems over the conventional silicon-based IGBT and MOSFET…

This article highlights the advantages of GaN E-HMET from GaN Systems over the conventional silicon-based IGBT and MOSFET inverter solutions.

This article discusses the method of increasing packing density of power electronics using Chip-on-Heatsink Technology…

This article discusses the method of increasing packing density of power electronics using Chip-on-Heatsink Technology for better thermal management.

This article highlights Infineon Technologies AG Silicon Carbide transistors development for industrial power electronics…

This article highlights Infineon Technologies AG Silicon Carbide transistors development for industrial power electronics applications and the goal…