EEPower

Latest Power Supplies Technical Articles

Categories

The State of Intelligent SiC MOSFET Gate Drivers

The State of Intelligent SiC MOSFET Gate Drivers

This article talks about the major improvements on Augmented Switching which resulted to significant loss reduction on overshoot voltage.


SiC and GaN Systems Design Engineers no Longer “flying blind”

SiC and GaN Systems Design Engineers no Longer “flying blind”

This article highlights Tektronix IsoVu Measurement System for complete galvanic isolation from DUT and uses an electro-optic sensor to convert…


Wide Band Gap is No Mystery

Wide Band Gap is No Mystery

This article highlights Siemens AG GaN power semiconductors technology in the power electronics system design that work at higher switching…


Taking Advantage of SiC’s High Switching Speeds

Taking Advantage of SiC’s High Switching Speeds

This article highlights Littelfuse Incorporated some of the prevailing challenges associated with the use of SiC and best practices to help design…


Accelerating the Adoption of SiC Power

Accelerating the Adoption of SiC Power

This article highlights Cree | Wolfspeed SiC availability and adoption considering markets today the customer base is harvesting the advantages SiC…


Why You Should Use Power Stage Designer™ to Start a Power Supply Design

Why You Should Use Power Stage Designer™ to Start a Power Supply Design

This article highlights Texas Instruments Power Stage Designer as a tool quick assessment values and waveforms for commonly used power-supply…


DCM 1000 Designed to Meet the Future Demand of Electric Vehicle Drive Train

DCM 1000 Designed to Meet the Future Demand of Electric Vehicle Drive Train

The acceleration of global warming and pollution, as well as international carbon emission targets, initiated a process to reduce emissions in all…


High Efficiency IGBT M7 Chip Technology utilized in the Mid Power Package VINco E3

High Efficiency IGBT M7 Chip Technology utilized in the Mid Power Package VINco E3

This article highlights Vincotech M7 chip and the SLC package technology utilized by VINco E3 product line for an efficient and reliable mid-power…


ONE Design Equation for Custom Inductors An Introduction to Power Electronics

ONE Design Equation for Custom Inductors An Introduction to Power Electronics

Over 35 years ago, I started my career in power electronics. I completed a practical power project in my senior year in college, building a 6KV, 20kHz


Full SiC Performance in Power Modules

Full SiC Performance in Power Modules

This article highlights Semikron silicon carbide performance in power modules especially SEMITRANS 3 module and SEMITOP E2 baseplate-less module.


SiC Cascodes and Their Advantages in Power Electronic Applications

SiC Cascodes and Their Advantages in Power Electronic Applications

This article highlights United Silicon Carbide Inc. SiC Cascodes advantages for power electronics applications and comparison with other WBG devices.


SiC in Industrial Auxiliary Power Supplies

SiC in Industrial Auxiliary Power Supplies

This article highlights ROHM Semiconductor BD768xFJ control IC with the ROHM 1700V SiC MOSFET as part of principal circuit of the auxiliary power…


7th Generation 1700 V IGBT Modules: Loss Reduction and Excellent System Performance

7th Generation 1700 V IGBT Modules: Loss Reduction and Excellent System Performance

This article features Mitsubishi Electric Europe B.V. 7th Generation IGBT Modules with the analysis of IGBT chip and diode chip performances.


Semiconductor Solutions for Energy Storage Systems in Light Traction Vehicles

Semiconductor Solutions for Energy Storage Systems in Light Traction Vehicles

This article highlights semiconductor solutions using Infineon Technologies AG IGBT modules belonging to the PrimePACK™ family equipped with…


Cool Running, 144W, 4 × 40A μModule POL Regulator

Cool Running, 144W, 4 × 40A μModule POL Regulator

The LTM®4636 is a 40A-capable μModule® regulator featuring 3D packaging technology, or component-on-package (CoP) to keep it cool. In addition…


A Low-Profile IPM with Optimized Heat Dissipation for Use in Restricted Environments CIPOS Nano IPM

A Low-Profile IPM with Optimized Heat Dissipation for Use in Restricted Environments CIPOS Nano IPM

This article introduces the Infineon's CIPOS Nano IPM that functions in space-constrained environments by dissipating heat via PCB.


Evaluating Fringing Effects in Multi-Gapped Toroids

Evaluating Fringing Effects in Multi-Gapped Toroids

This article highlights the importance of evaluating the fringing and thermal effects of multiple gaps in toroidal cores.


GaN Power ICs Enable the New Revolution in Power Electronics

GaN Power ICs Enable the New Revolution in Power Electronics

This article highlights Navitas Semiconductor GaN Power ICs history with power electronics technology development and advantages brought by GaN…


Wireless Medical Instrumentation Benefits from New Power ICs

Wireless Medical Instrumentation Benefits from New Power ICs

This article introduces the LTC3119 IC which meets the necessary attributes of DC-DC converters utilized in portable medical instrumentation.


Measuring Signals in the Time Domain to Understand and Design EMI Filters

Measuring Signals in the Time Domain to Understand and Design EMI Filters

This article highlights the importance of measuring the voltage and currents in the time domain to better understand and design EMI filters.