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“AllI n One” DIPIPM Series for Compact Inverter Designs

“AllI n One” DIPIPM Series for Compact Inverter Designs

This article introduces Mitsubishi Electric's DIPIPM+TM series, a Converter-Inverter-Brake modules, to help reduce the cost and size of…


Technical Articles Sep 05, 2016 by
Evaluating Silver Sintering as a Reliable Die-Attach Material for Automotive Power Module Applications

Evaluating Silver Sintering as a Reliable Die-Attach Material for Automotive Power Module Applications

This article discusses the benefits of double-sided silver-sintering technology and demonstrate the superiority over conventional solder.


LinPak, the Standard Expands to 3300V and Shows Excellent Parallel Operation as well as SiC Readiness

LinPak, the Standard Expands to 3300V and Shows Excellent Parallel Operation as well as SiC Readiness

This article presents general module design considerations and first results on switching characteristics of LinPaks in different configurations.


A Revolutionary Technology for Cost Tailoring Power Inductive Components

A Revolutionary Technology for Cost Tailoring Power Inductive Components

This article introduces MAGMENT's power inductors and transformers based on disruptive technology and discusses its advantages over…


Lifetime Analysis of PrimePACK™ Modules with IGBT5 and .XT

Lifetime Analysis of PrimePACK™ Modules with IGBT5 and .XT

This article introduces Infineon Technologies'novel joinging technology .XT for PrimePack power modules and it's advantages over…


Thermal Management of Semiconductors

Thermal Management of Semiconductors

This article introduces EPCOS' NTC and PTC sensors with different characteristics for thermal management of a wide variety of semiconductor…


Enhanced IGBT Module Power Density Utilizing the Improved Thermal Conductivity of SLC-Technology

Enhanced IGBT Module Power Density Utilizing the Improved Thermal Conductivity of SLC-Technology

This article introduces the new IGBT module generation of Mitsubishi Electric with improved Insulated Metal Baseplate as a key element of the…


Improving Thermal Performance with Chip-Scale Packaged Gallium Nitride Transistors

Improving Thermal Performance with Chip-Scale Packaged Gallium Nitride Transistors

This article discusses the advantages of chip-scale packaging of GaN transistors by evaluating its thermal performance and efficiency.


High Voltage Ceramic Capacitors for Power Electronics

High Voltage Ceramic Capacitors for Power Electronics

This article presents the characteristics and performances of a new range of high voltage ceramic capacitors manufactured using a new ceramic…


High Current Power MOSFET with Current Mirror and Temperature Sense Diodes

High Current Power MOSFET with Current Mirror and Temperature Sense Diodes

This article discusses the advantages of IXYS' MMIXT132N50P3 with current mirror to monitor the drain current and its various applications.


CIPS 2016 - Power Electronics in Challenging Little Boxes and More

CIPS 2016 - Power Electronics in Challenging Little Boxes and More

This article discusses methods on solving challenges in power electronics and suggests methods to improve performance of power electronics…


Direct Cooled Molded Power Module for Motor Integration in Electric and Hybrid Vehicles

Direct Cooled Molded Power Module for Motor Integration in Electric and Hybrid Vehicles

This article offers a solution to improve motor drive's package density to reduce the production costs and better design and flexibility.


Low Loss Thyristors for High Power Applications

Low Loss Thyristors for High Power Applications

This article describes a new 8.5 kV low loss thyristor family designed for industrial applications with full blocking capability at 50Hz/60Hz…


Discharger for Ultra-Capacitor Modules and Assemblies

Discharger for Ultra-Capacitor Modules and Assemblies

This article introduces Innovation Plus Power Systems' Discharger Family for ultra-capacitor modules and assemblies, reducing the discharge time.


SiC for safeguarding AC and DC power circuitry

SiC for safeguarding AC and DC power circuitry

This article discusses the novel Silicon Carbine based hybrid surge suppressor module for safeguarding AC and DC power circuitry and its benefits.


Increased Packing Density From Double-Sided Power Semiconductor Cooling

Increased Packing Density From Double-Sided Power Semiconductor Cooling

This article discusses the method of increasing packing density of power electronics using Chip-on-Heatsink Technology for better thermal management.


A Commercial High Temperature Capacitor Dielectric for Power Applications

A Commercial High Temperature Capacitor Dielectric for Power Applications

This article introduces DuPont Teijin Films' Teonex, a new dielectric for DC-Link and snubber power capacitors and discusses its features and…


Temperature Limits for Power Modules – Part 2: Lifetime

Temperature Limits for Power Modules – Part 2: Lifetime

This article talks about calculating if the module internal interconnects could withstand the temperature swings and meet the design lifetime…


Enhancing the performance of traditional IGBT-module-based power assemblies with SiC modules

Enhancing the performance of traditional IGBT-module-based power assemblies with SiC modules

This article discusses how Silicon Carbide MOSFETs enable high frequency in high power conversion systems for enhanced performance of power…


IGCT – A Highly Efficient Device with Continuing Great Success in High Power Applications

IGCT – A Highly Efficient Device with Continuing Great Success in High Power Applications

This article compares the IGCT with IGBT and discusses its advantages of IGCT over IGBT in terms of power density as well as device and converter…