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A Fast Track to Complex Power System Designs

A Fast Track to Complex Power System Designs

This article discusses recent advancements in power system components and power conversion architectures it also introduces Vicor's Power…


Solving Power Capacity Challenges with Software Defined Power

Solving Power Capacity Challenges with Software Defined Power

This article introduces Intelligent Control of Energy solution for complete power management of data centers and similar network and IT…


Combining Creepage with Miniaturization in High-Voltage Automotive Drives

Combining Creepage with Miniaturization in High-Voltage Automotive Drives

This article highlights the concerns for the miniaturization in high voltage automotive drives which is arcing and introduces KEMET's…


Rectiverter Creates New Category of Power System

Rectiverter Creates New Category of Power System

This article discusses the advantages and features of Eltek's Rectiverter in terms of design simplicity, flexibility and cost-effectiveness.


Innova Macroprocessors

Innova Macroprocessors

This article introduces SPCO's Innova Macroprocessor, a solid-state, scalable power module sourcing optical signals to trigger control circuits.


PLECS Goes Real-Time: A New HILSystem for Power Electronics

PLECS Goes Real-Time: A New HILSystem for Power Electronics

This article introduces Plexim's PLECS RT Box and its benefits for system modelling, design, simulation and testing of power electronics systems.


Advantages of the 1200 V SiC Schottky Diode with MPS Design

Advantages of the 1200 V SiC Schottky Diode with MPS Design

This article describes how consistent innovations in device design and assembly techniques improve performance, reliability and cost position of…


Rethinking Power Analysis

Rethinking Power Analysis

This article introduces ZES ZIMMER's innovations to their power analyzers in terms of DUT physical interface, user interface and interface to…


Increased Power Density and Performance with 3D Embedded Substrate Technologies

Increased Power Density and Performance with 3D Embedded Substrate Technologies

This article discusses the investigation done by PSMA and offers the important core technologies required for embedding substrates.


The Integrated Simulation Environment for Power Modules

The Integrated Simulation Environment for Power Modules

This article highlights Vincotech GmbH integrated simulation environment software designed to provide customers the opportunity to preselect power…


InFORMS vs the Trimmed  Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

InFORMS vs the Trimmed Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

This article discusses TT Electronics and Hybrid testing the inFORMS and discusses the reliability of this interconnect increases in thermal cycles.


Low Stress Silicone Encapsulant Enables Distributed Power Generation

Low Stress Silicone Encapsulant Enables Distributed Power Generation

This article highlights Dow Corning Corporation EE-3200 Low Stress Silicone Encapsulant that contributes to the penetration of this technology.


SMT Hybrid Packaging 2015 How to Package Future Power Components

SMT Hybrid Packaging 2015 How to Package Future Power Components

This article discusses the Surface Mount Technology Hybrid Packaging 2015, an exhibition aimed to inform visitors about the latest trends in…


Packaging GaN in a TO247

Packaging GaN in a TO247

This article describes how Transphorm Inc. developed a 63 mOhm 600V GaN HEMT (high electron mobility transistor) to be packaged in a TO-247.


DeRisking the Route to Silicon Carbide

DeRisking the Route to Silicon Carbide

This article highlights Raytheon UK’s Semiconductor Business Unit with high-temperature SiC (HiTSiC) technology for an advanced SiC manufacturing…


Digital Power Comes of Age

Digital Power Comes of Age

This article describes the factors that have driven the evolution of distributed power architectures of HF DC-DC converter modules and offers…


High Power Density Dual  nHPD2 Packaging Generation

High Power Density Dual nHPD2 Packaging Generation

This article introduces Hitachi's nHPD2 and its benefits in terms of market potential, performance, modularity and ease of transition.


Thermal Efficiency of Chipscale Packaging for eGaN® FETs

Thermal Efficiency of Chipscale Packaging for eGaN® FETs

This article discusses the thermal performance of the chipscale package and compare with the state-of-the-art power MOSFET packaging available today.


Analysing Thermal Performance of Intelligent Power Modules for Better PCB Design

Analysing Thermal Performance of Intelligent Power Modules for Better PCB Design

This article discusses module thermal performance under various operating conditions to predict operating temperature, power and PCB design for…