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Success Factors of EMC in the Design Phase

Success Factors of EMC in the Design Phase

This article discusses electromagnetic compatibility and how it can prove difficult for developers and project managers.


Second Sourcing Rectifiers

Second Sourcing Rectifiers

This article will focus on some of the issues designers face when comparing datasheets and what critical information is missing in a datasheet.


Smarter Packaging for Demanding Power Applications

Smarter Packaging for Demanding Power Applications

The new baseplate-less flow S3 package extends the power range of Vincotech’s well-established flow housing family. The housing is tailored for…


X-Series RFC Diodes for Robust and Reliable Medium-Voltage Drives

X-Series RFC Diodes for Robust and Reliable Medium-Voltage Drives

This article explains the popularity of the topology, the semiconductor requirements, and how the new X-Series diode module of MITSUBISHI ELECTRIC…


Inductive Charging Systems

Inductive Charging Systems

After developing a universal inductive charging system and many developments in the field of offboard and onboard charging devices for industry and…


Higher VGS Threshold Voltage Benefits in Resonant Applications

Higher VGS Threshold Voltage Benefits in Resonant Applications

This article highlights the impact of a super junction MOSFET gate-source threshold voltage (VGSth) in soft switching applications, using a…


Alpine Harmonic Measurement

Alpine Harmonic Measurement

This article discusses the EMC measurement technology, which is performed under extreme conditions, during the development of snow guns.


Double Pulse Testing

Double Pulse Testing

Two or double testing is a key implement in the toolbox of power electronics engineers that enables comprehensive and accurate measurements to be…


Overcoming the Challenges of Characterizing High Speed Power Semiconductors

Overcoming the Challenges of Characterizing High Speed Power Semiconductors

This article discusses DPT fixture design to obtain repeatable and reliable results from a DPT setup.


An Intelligent Power Module for High Switching Speeds

An Intelligent Power Module for High Switching Speeds

This article discusses the differences between SLIMDIP-L and SLIMDIP-W and investigates what suits the market demand for compact and…


Electrical Grounding Using the Isolated (or Ungrounded) Method

Electrical Grounding Using the Isolated (or Ungrounded) Method

Learn about the isolated or ungrounded method of system grounding, its main characteristics, advantages, disadvantages, and areas of application.


Integrated Power Electronics for Drive Systems in Electric and Hybrid Vehicles

Integrated Power Electronics for Drive Systems in Electric and Hybrid Vehicles

Consortium-developed integrated power electronics for drives systems in electric and hybrid vehicles uses FTCAP DC link capacitors


ATEX and the Power Management of Smart Gas Meters

ATEX and the Power Management of Smart Gas Meters

This article features Texas Instrument on how the TPS62840 step-down converter in the DGR package can help system and equipment design teams meet…


Low Loss and Low Forward Voltage Drop SIPOS Passivated Fast Recovery Diode

Low Loss and Low Forward Voltage Drop SIPOS Passivated Fast Recovery Diode

This article introduces a 1700V soft recovery diode with different current ratings.


Thermal Endurance Estimation of Magnetic Components Used in Embedded Automotive Applications

Thermal Endurance Estimation of Magnetic Components Used in Embedded Automotive Applications

This article reviews the common definitions of temperature stated for an insulating material to have an idea of its resistance to heat versus time.


Properly Validating Output Chokes: Ferrite vs. Dust Core

Properly Validating Output Chokes: Ferrite vs. Dust Core

For the emerging mega-watt applications with SiC power devices, the proper validation of output chokes poses great challenges.


Improving Vacuum Solder Reflow for Challenging Power Module Packaging

Improving Vacuum Solder Reflow for Challenging Power Module Packaging

This article discusses the evaluation of flux-free soldering process for bare copper DBC substrate to Nickel-plated copper base plate soldering.


Getting the Most Out of a DC/DC Converter

Getting the Most Out of a DC/DC Converter

This article discusses the Modular DC-DC converters and their recent developments in terms of power density.


 Value Enhancement of Full SiC 3.3kV Power Module

Value Enhancement of Full SiC 3.3kV Power Module

This article focuses on the 2-level inverter and use this topology to exhibit the results


The Revolutionary New Impedance Analyzer

The Revolutionary New Impedance Analyzer

This article discusses how replacing loop with HIL devices opens new possibilities for developing and testing power electronic systems.