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Biricha Lecture Notes on Analog and Digital Power Supply Design Part 2D

Biricha Lecture Notes on Analog and Digital Power Supply Design Part 2D

This article discusses the reasons why Proportional Integral Derivative (PID) controller is not best suited for stabilising most switch-mode power…


Calibration Meeting the Challenges of HighFrequency Power Measurement

Calibration Meeting the Challenges of HighFrequency Power Measurement

This article defines calibration and introduces Yokogawa's calibration capabilities and emphasizes the importance of accreditation for…


Rethinking Power Analysis

Rethinking Power Analysis

This article introduces ZES ZIMMER's innovations to their power analyzers in terms of DUT physical interface, user interface and interface to…


Everything for Capacitive Power Supplies from a Single Source

Everything for Capacitive Power Supplies from a Single Source

This article emphasizes the importance of capacitors and their capacitive properties and topologies in the designs of power supplies.


Adding Flexibility to ACDC Power Supply Design that Uses PFCLLC Topology

Adding Flexibility to ACDC Power Supply Design that Uses PFCLLC Topology

This article discusses the advantages of PFC/LLC Combo controller and their key features and benefits in adding flexibility to power supply designs.


BiAgX HighTemperature LeadFree Pbfree Solder Paste

BiAgX HighTemperature LeadFree Pbfree Solder Paste

This article introducest Indium Corporation's BiAgX, a high-temperature lead-free solder paste for surface-mount-technology (SMT) applications.


Low Loss HighPower Thyristors for Industrial Applications

Low Loss HighPower Thyristors for Industrial Applications

This article introduces ABB's development of the Phase Control Thyristor for HVDC and discusses its design concept and the device performance.


Powering IGBT Drivers with TI039s FlyBuck Converter

Powering IGBT Drivers with TI039s FlyBuck Converter

This article offers methods of using Fly-Buck converter as a cost-effective and simpler solution to power IGBT driver in the AC motor drives and…


Driving and Protecting 1200VClass IGBTs with HVICs

Driving and Protecting 1200VClass IGBTs with HVICs

This article introduces Mitsubishi Electric's 1200V/2A HVIC, the M81748FP, with high-side and low-side short circuit (SC) protection circuit.


How to use a small microcontroller to control the LED driver for a dimmable triac

How to use a small microcontroller to control the LED driver for a dimmable triac

This article offers a method on using a small microcontroller to control the LED driver for a dimmable TRIAC for inherent power factor correction.


Increased Power Density and Performance with 3D Embedded Substrate Technologies

Increased Power Density and Performance with 3D Embedded Substrate Technologies

This article discusses the investigation done by PSMA and offers the important core technologies required for embedding substrates.


DCDC Voltage Regulation Complete Solution Targeting  PoL Market

DCDC Voltage Regulation Complete Solution Targeting PoL Market

This article introduces Infineon's latest multiphase digital controller for DC to DC product applications focused on increasing density and…


Eliminating Earth Leakage  Currents and Significantly  Improving EMC

Eliminating Earth Leakage Currents and Significantly Improving EMC

This article presents TDK offering a new kind of solution for removing leakage currents and improving EMC performance of the system.


Electrical Power Supply Matrix Systems

Electrical Power Supply Matrix Systems

This article highlights AEPS-GROUP electrical power supply systems with GaN technology instead of GaAs technology for a reduction in APAR power…


The Integrated Simulation Environment for Power Modules

The Integrated Simulation Environment for Power Modules

This article highlights Vincotech GmbH integrated simulation environment software designed to provide customers the opportunity to preselect power…


InFORMS vs the Trimmed  Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

InFORMS vs the Trimmed Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

This article discusses TT Electronics and Hybrid testing the inFORMS and discusses the reliability of this interconnect increases in thermal cycles.


Efficient Inverters for PV Systems

Efficient Inverters for PV Systems

This article highlights Zeversolar that is a chinese manufacturer of PV inverters in the budget segment, making the solar energy available to…


Enhanced Module Design Makes Most of New IGBT5 Performance

Enhanced Module Design Makes Most of New IGBT5 Performance

This article highlights Infineon Technologies AG PrimePACK 3+ package that extends the current range of the PrimePACK series to 1800 A with .XT…


Reverse Power Feeding Enables HighSpeed Internet Access

Reverse Power Feeding Enables HighSpeed Internet Access

This article highlights Texas Instruments power solution on how these interconnection points are supplied by the end customers using the same…


Launching Material Systems Concept Boosting Power Electronics Industry

Launching Material Systems Concept Boosting Power Electronics Industry

This article highlights an interview of Gavin Hsu of Bodos power system and Ralf Merget Heraeus Electronics material systems concept.