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EPC Claims its New 350 V GaN Transistor is 20 Times Smaller than Comparable Silicon Offerings

EPC Claims its New 350 V GaN Transistor is 20 Times Smaller than Comparable Silicon Offerings

The enhancement mode power transistor features a maximum continuous drain current of 6.3 A and a maximum RDS(ON) of 80 mΩ


STMicroelectronics Debuts 50 W GaN Converter for High-efficiency Power Applications

STMicroelectronics Debuts 50 W GaN Converter for High-efficiency Power Applications

The company’s new converter is a quasi-resonant (QR) flyback controller incorporating 650 V E-mode GaN transistors.


ROHM Introduces 150 V GaN High Electron Mobility Transistor with an 8 V Withstand Gate Voltage

ROHM Introduces 150 V GaN High Electron Mobility Transistor with an 8 V Withstand Gate Voltage

The new gallium nitride (GaN) device provides a safety margin of 3 V, as compared to the 1 V margin offered by standard devices of 200 V or less.


Microchip Expands its Silicon Carbide Power Portfolio with New 3.3 kV MOSFETs and Schottky Barrier Diodes

Microchip Expands its Silicon Carbide Power Portfolio with New 3.3 kV MOSFETs and Schottky Barrier Diodes

The new MOSFETs sport RDS(ON)s of 25mΩ, while the SBDs handle an industry leading 90 amps.


Infineon Introduces New CoolSiC MOSFET and 2EDN Gate Driver Families

Infineon Introduces New CoolSiC MOSFET and 2EDN Gate Driver Families

The two new families will serve to enhance energy efficiency, in addition to saving weight and board space.


Power Integrations Introduces Tandem Power IC Families at APEC

Power Integrations Introduces Tandem Power IC Families at APEC

The new ICs enable designers to meet tough new efficiency requirements, while at the same time realizing excellent power factor correction (PFC).


Alpha and Omega Debuts Two New 600 V Super Junction MOSFETs Featuring RDS(ON)s of 110 and 140 mΩ

Alpha and Omega Debuts Two New 600 V Super Junction MOSFETs Featuring RDS(ON)s of 110 and 140 mΩ

Taking up a scant 64 mm2 with a height of 0.9 mm in DFN8x8 packages, the new devices are aimed at meeting today’s demands for high efficiency and…


Teledyne e2v HiRel’s New 650 V, 60 A GaN HEMTs are Space-screened at NASA’s Top Assurance Level

Teledyne e2v HiRel’s New 650 V, 60 A GaN HEMTs are Space-screened at NASA’s Top Assurance Level

The two new transistors are tested through NASA’s Level 1 screening flow, its most stringent set, and can be qualified to NASA’s full Level 1…


Teledyne e2v HiRel Releases a 100 V Transistor Driver for 20 MHz FET and GaN Transistors

Teledyne e2v HiRel Releases a 100 V Transistor Driver for 20 MHz FET and GaN Transistors

The radiation-tolerant device is available in a space-saving flip chip die, and is aimed at driving the company’s 100 V gallium nitride (GaN)…


Eggtronic Unveils a New Demo Board Aimed at Streamlining the Design of Compact, Efficient 35 W Adapters and Chargers

Eggtronic Unveils a New Demo Board Aimed at Streamlining the Design of Compact, Efficient 35 W Adapters and Chargers

The new board employs the company’s proprietary EcoVoltas QuarEgg+ technology, and can be specified with either a GaN or Silicon FET.


EPC Space Expands its Rad-Hard GaN Offerings With New Demo Boards

EPC Space Expands its Rad-Hard GaN Offerings With New Demo Boards

The five easy-to-use demonstration boards will allow engineers to more quickly exploit the capabilities of radiation-hardened (RH) gallium nitride…


Power Integrations Claims its New AEC-Q100 Qualified Switcher ICs Are First to Incorporate a SiC MOSFET

Power Integrations Claims its New AEC-Q100 Qualified Switcher ICs Are First to Incorporate a SiC MOSFET

The devices can efficiently deliver power to battery and fuel-cell passenger EVs, in addition to electric buses and trucks.


Power MOSFET Package Enables Innovative Source-Down

Power MOSFET Package Enables Innovative Source-Down

New OptiMOS™ power MOSFET package enables innovative Source-Down technology for PQFN 3.3 x 3.3 mm2 in 25 V to 100 V variants.


ST’s Silicon-Carbide Power Devices for E-Mobility and Energy-Efficient Industry

ST’s Silicon-Carbide Power Devices for E-Mobility and Energy-Efficient Industry

ST’s latest-generation silicon-carbide (SiC) power devices extend leadership in performance and reliability for…


hofer powertrain and VisIC Technologies develop 3-Level 800V GaN inverter

hofer powertrain and VisIC Technologies develop 3-Level 800V GaN inverter

hofer powertrain, a globally leading automotive powertrain technology company, and VisIC Technologies Ltd., a global leader in gallium nitride…


ROHM’s New Compact Surface Mount 45W Output AC/DC Converter ICs: Equipped with Integrated High Voltage SJ MOSFET

ROHM’s New Compact Surface Mount 45W Output AC/DC Converter ICs: Equipped with Integrated High Voltage SJ MOSFET

Fly-back converter ICs maximizing performance, reducing system cost and increasing reliability for industrial and consumer power supply solutions.


Solitron Devices Announces 1200V, 100A Power Modules

Solitron Devices Announces 1200V, 100A Power Modules

Solitron Devices is pleased to announce the introduction of the SD11906, SD11907, SD11956 and SD11957 1200V Silicon Carbide (SiC) Half Bridge…


Allegro Debuts a 3-Phase Gate Driver IC Purposed to Reduce EV Noise Levels

Allegro Debuts a 3-Phase Gate Driver IC Purposed to Reduce EV Noise Levels

The new unit is aimed at sensorless, brushless DC (BLDC) motors operating over a 5V to 50V voltage range.


Sungrow’s String Inverter Employs Infineon Module and Chip Technology

Sungrow’s String Inverter Employs Infineon Module and Chip Technology

The 352kW, 1500 VDC Sungrow device offers a 40% increase in output power when compared to the company’s previous best.


Toshiba Unveils New Simulation Technology Accu-ROM to Reduce Semiconductor Verification Time

Toshiba Unveils New Simulation Technology Accu-ROM to Reduce Semiconductor Verification Time

Toshiba has recently developed a new model-based development (MBD) simulation technology that can reportedly reduce verification times for…