The new surface-mounted, AEC-Q200 qualified hybrid devices are aluminum electrolytic, and feature high capacitances in a smaller PCB footprint.
June 04, 2022 by Gary Elinoff
The surface-mounted devices are available with capacitances of 47 to 10,000 µF and voltage ratings from 6.3 to 100 VDC.
April 05, 2022 by Gary Elinoff
This disruptive patented solution has been designed to increase power density (decreasing power magnetic required volume), combining 2 or 3…
October 28, 2021 by Hailey Stewart
NAZP series features high CV in reduced case sizes with low impedance and high ripple current ratings for use in power conversion (DC-DC) and…
October 23, 2021 by Hailey Stewart
TDK’s wide array of products meets the needs for common filters for high-speed differential signal lines, including for USB, MIPI and HDMI.
September 05, 2021 by Hailey Stewart
The A69861 and L69861 from STMicroelectronics (ST), are designed for automotive and industrial applications, respectively.
July 18, 2021 by Gary Elinoff
This article highlights ceramic YAG (yttrium aluminum garnet) platform for solid-state lasers and optical components.
March 11, 2021 by Hailey Stewart
New authenticator IC avoids the pitfalls of complex, microcontroller-based solutions
February 02, 2021 by Gary Elinoff
Wolfspeed’s WolfPACK Power Modules are aimed squarely at medium power applications.
January 20, 2021 by Gary Elinoff
This article highlights NIC Components NCST-C series of current sensing SMT chip resistors utilizing low-cost thick film construction.
December 13, 2020 by NIC Components
TRB Lightweight Structures (TRB) has created a new production process to deliver continuous-fibre thermoset composite parts at high volume.
October 22, 2020 by Hailey Stewart
April 29, 2020 by Paul Shepard
April 28, 2020 by Paul Shepard
April 27, 2020 by Paul Shepard
April 26, 2020 by Paul Shepard
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