New Industry Products

Power Integrations Introduces Tandem Power IC Families at APEC

March 23, 2022 by Gary Elinoff

The new ICs enable designers to meet tough new efficiency requirements, while at the same time realizing excellent power factor correction (PFC).

Looking to aid engineers in simplifying the design of LLC resonant power converters, Power Integrations (PI) this Monday introduced its HiperPFS-5 family of PFC ICs together with a new chipset, the HiperLCS-2, at the Applied Power Electronics Conference 2022 (APEC 2022) in Houston, Texas.

Utilizing this type of IC pairing is a design strategy frequently employed when efficiency levels beyond those obtainable from flyback converters is required. In tandem, these new ICs can form the basis of designs capable of delivering up to 240 W without a heatsink, along with a power factor of 98% or better.


Size Matters

With the HiperPFS-5, PI has combined its PowiGaN gallium nitride switch with a quasi-resonant, variable-frequency discontinuous mode boost PFC topology. HiperPFS-5 ICs mesh well with both the HiperLCS-2 chipset and PI’s InnoSwitch4-CZ active-clamp flyback ICs. 


HiperPFS-5 ICs are targeted at range of applications, from LCD TVs to gaming consoles and high-power adaptors. Image used courtesy of Business Wire


OEMs employing these ICs in their designs can satisfy the most stringent efficiency regulations. What’s more, thanks to the high levels of integration supported by the new devices, designers could potentially cut their BOMs by as much as half.  

Per Edward Ong, PI's senior product marketing manager, those factors give engineers a critical advantage as OEMs and after-market suppliers race to create the fastest, smallest, most versatile USB PD chargers for mobile devices. 


The HiperPFS-5 Family

PI’s HiperPFS-5 family incorporates nine separate PFC ICs, all of which are housed in a low profile, surface mount InSOP-T28F package. Each IC incorporates an internal 750 V PowiGaN switch, and the family’s output power peaks with the PFS5178F-TL, which can deliver up to 240 W without a heatsink.

Engineered to effect the PFC necessary when AC voltage and current go out of phase, the units can achieve a power factor of 0.98 or greater. That’s crucial in meeting government regulations requiring PFC for power supplies drawing over 75 W. In addition, no load power consumption is less than 40 mW. 



The HiperLCS-2 family consists of LLC converters that achieve 98% efficiency. The solution employs two chips; referring to the schematic below, they are the center-positioned half-bridge (HiperLCS2-HB) and the secondary side controller (HiperLCS2-SR) to the furthermost right. 


Members of the HiperPFS-5 family work in conjunction with the HiperLCS-2 chipset. Screenshot used courtesy of Power Integrations


The controller incorporates PI’s FluxLink, which allows for isolated, high-bandwidth communication between itself and the primary side half-bridge.



Power Integrations’ new IC families are suited for power supplies in small form factor applications, such as:

  • Power adapters of up to 250 W
  • e-bikes
  • Power tools
  • TVs
  • Game consoles
  • Open frame displays


Getting to Market Faster

A reference design, the DER-672, is offered for engineers wishing to evaluate the HiperPFS-5 and HiperLCS-2 ICs. It intends for a 220 W power factor corrected LLC power supply, applicable to TVs and monitors.


A bottom-view of the DER-672, as configured with HiperPFS-5 and HiperLCS-2 ICs. Images [modified] used courtesy of Power Integrations 


Its specifications include input voltage from 90 to 265 VAC and 24 VDC output at up to 9.2 A.


Feature image used courtesy of Power Integrations