Unveiled today at PCIM, TI’s new automotive-grade battery monitor IC increases channel density by 44% and embeds real-time EIS to detect internal…
Unveiled today at PCIM, TI’s new automotive-grade battery monitor IC increases channel density by 44% and embeds real-time EIS to detect internal…
The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers…
The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers deep visibility into…
A new automotive silicon carbide power module pushes thermal boundaries to enhance electric vehicle traction inverter…
A new automotive silicon carbide power module pushes thermal boundaries to enhance electric vehicle traction inverter density and streamline…
New HV-D3 mSiC silicon carbide phase leg modules enhance grid-to-rack efficiency and thermal robustness for hyperscale…
New HV-D3 mSiC silicon carbide phase leg modules enhance grid-to-rack efficiency and thermal robustness for hyperscale data centers.
The TPD7110F integrates reverse-polarity protection, overvoltage and undervoltage shutoff, and VDS-based reverse-current…
The TPD7110F integrates reverse-polarity protection, overvoltage and undervoltage shutoff, and VDS-based reverse-current blocking in a 2.9 × 2.8…
STMicroelectronics has introduced an automotive high-side driver for harsh electrical transients and isolated gate…
STMicroelectronics has introduced an automotive high-side driver for harsh electrical transients and isolated gate drivers for high-voltage…
A new wave of automotive ICs may tackle the complex mix of precision sensing, high-speed signaling, and compact actuation…
A new wave of automotive ICs may tackle the complex mix of precision sensing, high-speed signaling, and compact actuation inside modern EVs and ICEs.
The vertical GaN (vGaN) power semiconductors claim to boost performance and efficiency in data centers, EVs, and renewables.
The vertical GaN (vGaN) power semiconductors claim to boost performance and efficiency in data centers, EVs, and renewables.
The 100 V MOSFETs in compact CCPAK1212 packaging cut conduction losses, save space, and boost performance in 48 V…
The 100 V MOSFETs in compact CCPAK1212 packaging cut conduction losses, save space, and boost performance in 48 V automotive applications.
Infineon, Toshiba, and Rohm’s product releases and proven applications indicate continued growth in the high-power…
Infineon, Toshiba, and Rohm’s product releases and proven applications indicate continued growth in the high-power MOSFET market.
Nexperia’s first AEC-Q101 ESD protection diodes for 48 V automotive networks preserve signal integrity and save PCB…
Nexperia’s first AEC-Q101 ESD protection diodes for 48 V automotive networks preserve signal integrity and save PCB space in electric and…
The SOIC8-N packaged devices feature 3 kV isolation, 100 kV/µs CMTI, and 50 Mbps data rates, suitable for onboard…
The SOIC8-N packaged devices feature 3 kV isolation, 100 kV/µs CMTI, and 50 Mbps data rates, suitable for onboard chargers and battery management…
The BD1423xFVJ-C and BD1422xG-C series current sense amplifiers offer design simplicity for electric vehicle and other…
The BD1423xFVJ-C and BD1422xG-C series current sense amplifiers offer design simplicity for electric vehicle and other automotive systems.
EPC9196 brings high-speed, medium-voltage BLDC drive capability to compact platforms.
EPC9196 brings high-speed, medium-voltage BLDC drive capability to compact platforms.
MaxLinear and Comtrend have released G.hn powerline communication modules that eliminate the need for Ethernet or extra wiring.
MaxLinear and Comtrend have released G.hn powerline communication modules that eliminate the need for Ethernet or extra wiring.
The series is designed for lithium-ion battery systems used in electric vehicles and energy storage systems.
The series is designed for lithium-ion battery systems used in electric vehicles and energy storage systems.
With its compact heat dissipation design, the new modules are designed to "sets a new standard for onboard chargers."
With its compact heat dissipation design, the new modules are designed to "sets a new standard for onboard chargers."
The high-voltage MOSFETs offer better efficiency, thermal performance, and reliability with a smaller die and lower losses.
The high-voltage MOSFETs offer better efficiency, thermal performance, and reliability with a smaller die and lower losses.
Infineon’s isolated gate driver ICs support the latest IGBT and SiC technologies, improving efficiency, reliability,…
Infineon’s isolated gate driver ICs support the latest IGBT and SiC technologies, improving efficiency, reliability, and safety in EV powertrains.
The MCU family comes in Entry and Main Line products, giving designers a scalable range of performance and memory options.
The MCU family comes in Entry and Main Line products, giving designers a scalable range of performance and memory options.
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