The PFE1500FB series accepts 85 to 305 VAC input and features a metal baseplate for sealed enclosures and liquid-cooled systems.
The PFE1500FB series accepts 85 to 305 VAC input and features a metal baseplate for sealed enclosures and liquid-cooled systems.
The STDRIVEG212 and STDRIVEG612 bring fast switching and smart shutdown to motion control and power conversion applications.
The STDRIVEG212 and STDRIVEG612 bring fast switching and smart shutdown to motion control and power conversion applications.
Hioki’s modules bring fast, scalable thermistor-based temperature measurement for its LR8450 data logger series.
Hioki’s modules bring fast, scalable thermistor-based temperature measurement for its LR8450 data logger series.
The AIF13WAC, a 600 W full-brick AC-DC power supply, delivers up to 94% efficiency with digital control and drop-in…
The AIF13WAC, a 600 W full-brick AC-DC power supply, delivers up to 94% efficiency with digital control and drop-in compatibility for existing…
STMicroelectronics has introduced an automotive high-side driver for harsh electrical transients and isolated gate…
STMicroelectronics has introduced an automotive high-side driver for harsh electrical transients and isolated gate drivers for high-voltage…
Microchip’s MCPF1525 Power Module with PMBus delivers 25 A in a compact, stackable module, reducing board footprint…
Microchip’s MCPF1525 Power Module with PMBus delivers 25 A in a compact, stackable module, reducing board footprint while boosting AI data…
The RMD40-UW and RMD75-UW target EN 50155 rail applications with a single 11:1 input range, integrated ride-through, and…
The RMD40-UW and RMD75-UW target EN 50155 rail applications with a single 11:1 input range, integrated ride-through, and baseplate cooling for…
Vishay, SemiQ, Infineon, and Alpha & Omega Semiconductor have released upgraded SiC MOSFET products to deliver…
Vishay, SemiQ, Infineon, and Alpha & Omega Semiconductor have released upgraded SiC MOSFET products to deliver efficiency, thermal performance,…
The top-side-cooled MOSFETs combine silicon carbide performance with improved thermal paths for electric vehicles, energy…
The top-side-cooled MOSFETs combine silicon carbide performance with improved thermal paths for electric vehicles, energy infrastructure, and data…
The dual-phase trans-inductance voltage regulator modules aim to bring compact, high-efficiency power to AI and HPC workloads
The dual-phase trans-inductance voltage regulator modules aim to bring compact, high-efficiency power to AI and HPC workloads
Nexperia, Toshiba, and Infineon have designed MOSFETs that offer different strategies in advancing high-power design.
Nexperia, Toshiba, and Infineon have designed MOSFETs that offer different strategies in advancing high-power design.
The 100 V MOSFETs in compact CCPAK1212 packaging cut conduction losses, save space, and boost performance in 48 V…
The 100 V MOSFETs in compact CCPAK1212 packaging cut conduction losses, save space, and boost performance in 48 V automotive applications.
Infineon, Toshiba, and Rohm’s product releases and proven applications indicate continued growth in the high-power…
Infineon, Toshiba, and Rohm’s product releases and proven applications indicate continued growth in the high-power MOSFET market.
The CoolSiC G2 MOSFET variants expand cooling options and compact form factors to medium-power SMPS designs.
The CoolSiC G2 MOSFET variants expand cooling options and compact form factors to medium-power SMPS designs.
The 1200 V CoolSiC G2 MOSFETs deliver higher power density, lower losses, and improved thermal performance for industrial systems.
The 1200 V CoolSiC G2 MOSFETs deliver higher power density, lower losses, and improved thermal performance for industrial systems.
Nexperia’s MJPE-series BJTs in CFP15B format offer smaller footprints and strong thermal performance for automotive and…
Nexperia’s MJPE-series BJTs in CFP15B format offer smaller footprints and strong thermal performance for automotive and industrial designs.
TDK, Littelfuse, and Novosense have released components targeting scalability, thermal resilience, and EMI issues.
TDK, Littelfuse, and Novosense have released components targeting scalability, thermal resilience, and EMI issues.
The latest devices from Microchip, Rohm, and Semi-Q offer enhanced radiation protection, increased operation range, lower…
The latest devices from Microchip, Rohm, and Semi-Q offer enhanced radiation protection, increased operation range, lower conduction losses, and…
With its compact heat dissipation design, the new modules are designed to "sets a new standard for onboard chargers."
With its compact heat dissipation design, the new modules are designed to "sets a new standard for onboard chargers."
These advancements aim to reduce the footprint of MOSFETs while increasing power density and efficiency.
These advancements aim to reduce the footprint of MOSFETs while increasing power density and efficiency.
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