Latest Marine Technical Articles

This article highlights Vincotech GmbH integrated simulation environment software designed to provide customers the…

This article highlights Vincotech GmbH integrated simulation environment software designed to provide customers the opportunity to preselect power…

This article discusses TT Electronics and Hybrid testing the inFORMS and discusses the reliability of this interconnect…

This article discusses TT Electronics and Hybrid testing the inFORMS and discusses the reliability of this interconnect increases in thermal cycles.

This article highlights Zeversolar that is a chinese manufacturer of PV inverters in the budget segment, making the solar…

This article highlights Zeversolar that is a chinese manufacturer of PV inverters in the budget segment, making the solar energy available to…

This article highlights Dow Corning Corporation EE-3200 Low Stress Silicone Encapsulant that contributes to the…

This article highlights Dow Corning Corporation EE-3200 Low Stress Silicone Encapsulant that contributes to the penetration of this technology.

This article highlights Infineon Technologies AG PrimePACK 3+ package that extends the current range of the PrimePACK…

This article highlights Infineon Technologies AG PrimePACK 3+ package that extends the current range of the PrimePACK series to 1800 A with .XT…

This article highlights Mitsubishi Electric 7th Gen. Std-type IGBT Modules based on TMS-Technology that is the 7th Gen…

This article highlights Mitsubishi Electric 7th Gen. Std-type IGBT Modules based on TMS-Technology that is the 7th Gen Chip in the T-Series IGBT…

This article highlights Texas Instruments power solution on how these interconnection points are supplied by the end…

This article highlights Texas Instruments power solution on how these interconnection points are supplied by the end customers using the same…

This article highlights an interview of Gavin Hsu of Bodos power system and Ralf Merget Heraeus Electronics material…

This article highlights an interview of Gavin Hsu of Bodos power system and Ralf Merget Heraeus Electronics material systems concept.

This article discusses the advantages and benefits of embedding passive components such as capacitors for better…

This article discusses the advantages and benefits of embedding passive components such as capacitors for better performance and reliability.

This article emphasizes the importance of capacitors and offers the explored promising potentials of high-temperature…

This article emphasizes the importance of capacitors and offers the explored promising potentials of high-temperature dielectric PEN-HV.

This article offers methods of designing power supply achieving zero standby power by using primary-side regulated…

This article offers methods of designing power supply achieving zero standby power by using primary-side regulated flyback converters.

This article discusses the IMS and the need for standard then offers the IPC/CPCA-4105A, a joint standard covering IMS…

This article discusses the IMS and the need for standard then offers the IPC/CPCA-4105A, a joint standard covering IMS for product designers.

This article gives an overview of DMX512A, showing and explaining recommended electrical and electronic requirements, and…

This article gives an overview of DMX512A, showing and explaining recommended electrical and electronic requirements, and how the protocol was…

This article discusses how to design a compensator for all hard switched forward type peak current mode converters…

This article discusses how to design a compensator for all hard switched forward type peak current mode converters without optocoupler feedback.

This article discusses the inherent capability and behaviour of SiC cascodes to be safely paralleled for high…

This article discusses the inherent capability and behaviour of SiC cascodes to be safely paralleled for high performance, high power systems.

This article discusses how single-stage topologies deliver LED driver solutions with acceptable performance at a lower…

This article discusses how single-stage topologies deliver LED driver solutions with acceptable performance at a lower cost than two-stage topologies.

This article highlights Mitsubishi Electric Corporation SLC package technology is combined with the 7th Gen Chip in the…

This article highlights Mitsubishi Electric Corporation SLC package technology is combined with the 7th Gen Chip in the NX-type IGBT Modules Series.

This article covers methods utilized at manufacturing of fast power thyristors by means of low-temperature junction of…

This article covers methods utilized at manufacturing of fast power thyristors by means of low-temperature junction of silicon chips with…

This article sums up relevant failure modes as well as their causes and explains how numerical modelling can support…

This article sums up relevant failure modes as well as their causes and explains how numerical modelling can support design processes of development.

This article discusses the Surface Mount Technology Hybrid Packaging 2015, an exhibition aimed to inform visitors about…

This article discusses the Surface Mount Technology Hybrid Packaging 2015, an exhibition aimed to inform visitors about the latest trends in…