EEPower

Latest Test & Measurement Technical Articles

Categories

How to Compensate for Temperature Sensor Accuracy at Hot and Cold Extremes

How to Compensate for Temperature Sensor Accuracy at Hot and Cold Extremes

This article discusses the method of compensating non-linear accuracy characteristics of temperature sensors for higher-accuracy embedded systems.


“AllI n One” DIPIPM Series for Compact Inverter Designs

“AllI n One” DIPIPM Series for Compact Inverter Designs

This article introduces Mitsubishi Electric's DIPIPM+TM series, a Converter-Inverter-Brake modules, to help reduce the cost and size of…


Technical Articles Sep 05, 2016 by
High-Precision, Wideband, Highly Stable Current Sensing Technology

High-Precision, Wideband, Highly Stable Current Sensing Technology

This article introduced the detection principle used by the zero-flux method, key considerations when choosing a current sensor and some precautions.


The World’s First Peak Current Load SMD Ferrite: The Multilayer Power Suppression Bead

The World’s First Peak Current Load SMD Ferrite: The Multilayer Power Suppression Bead

This article introduces the Würth Elektronik eiSos' Multilayer Power Suppression Bead (MPSB) and discusses its advantages and benefits.


Evaluating Silver Sintering as a Reliable Die-Attach Material for Automotive Power Module Applications

Evaluating Silver Sintering as a Reliable Die-Attach Material for Automotive Power Module Applications

This article discusses the benefits of double-sided silver-sintering technology and demonstrate the superiority over conventional solder.


Enhanced IGBT Module Power Density Utilizing the Improved Thermal Conductivity of SLC-Technology

Enhanced IGBT Module Power Density Utilizing the Improved Thermal Conductivity of SLC-Technology

This article introduces the new IGBT module generation of Mitsubishi Electric with improved Insulated Metal Baseplate as a key element of the…


Moving Toward Stronger Power Electronics Prototyping

Moving Toward Stronger Power Electronics Prototyping

This article discusses a new approach for prototyping using Imperix's BoomBox RCP platform and its application as well as its integration to…


Design Methodology for First Pass Success: A rationale for hardware simulation

Design Methodology for First Pass Success: A rationale for hardware simulation

This article highlights the importance of modelling and simulation task in design methodology to reduce the number of design iterations and acquire…


Essential Considerations Relating to Partial Discharge

Essential Considerations Relating to Partial Discharge

This article emphasizes the essential considerations engineers need to take note of in design of insulation relating to partial discharge.


Low Loss Thyristors for High Power Applications

Low Loss Thyristors for High Power Applications

This article describes a new 8.5 kV low loss thyristor family designed for industrial applications with full blocking capability at 50Hz/60Hz…


Smart Transformer Condition Monitoring with Smart Meter and Rogowski Coils

Smart Transformer Condition Monitoring with Smart Meter and Rogowski Coils

This article introduces Lems's Rogowski coil with smart meter for accurate and easy-to-install smart current sensors for internet of energy.


SiC Cascode in 440 VAC – 800 VDC Power Factor Correction

SiC Cascode in 440 VAC – 800 VDC Power Factor Correction

This article explores the wide bandgap switching devices design tradeoffs for efficiency and power factor in implementing designs at higher…


Discharger for Ultra-Capacitor Modules and Assemblies

Discharger for Ultra-Capacitor Modules and Assemblies

This article introduces Innovation Plus Power Systems' Discharger Family for ultra-capacitor modules and assemblies, reducing the discharge time.


Avoidance of Reverse Recovery Ringing in Wide Band Gap Devices

Avoidance of Reverse Recovery Ringing in Wide Band Gap Devices

This article discusses the benefits of nHPD2 packaging technology and the wider market need for operational high power wide band gap devices.


Current Measurement Methods that Deliver High Precision Power Analysis in the Field of Power Electronics

Current Measurement Methods that Deliver High Precision Power Analysis in the Field of Power Electronics

This article discusses the current measurement methods specifically on Direct Connection Method and Current Sensor method used in power analyzers.


Dynamic Parameters Measurement for Fast Switching Devices

Dynamic Parameters Measurement for Fast Switching Devices

This article introduces LEMSYS PRO-AC, a test equipment specifically dedicated to fast-medium power semiconductor devices with better performance.


System Solution: “SiC-Inverter for Industrial Motor Drive”

System Solution: “SiC-Inverter for Industrial Motor Drive”

This article discusses the advantages of Silicon Carbide for industrial motor drive inverters over the silicon counter-part of such devices.


E-Mobility for Components and EMC – Simulation and Measurement

E-Mobility for Components and EMC – Simulation and Measurement

This article highlights IMG Electronic & Power Systems and University of Ruse Angel Kanchev simulation models of E Mobility for Components and…


Temperature Limits for Power Modules – Part 2: Lifetime

Temperature Limits for Power Modules – Part 2: Lifetime

This article talks about calculating if the module internal interconnects could withstand the temperature swings and meet the design lifetime…


20 MHz Bandwidth Envelope Tracking Power Supply Using eGaN® FETs

20 MHz Bandwidth Envelope Tracking Power Supply Using eGaN® FETs

This article highlights Efficient Power Conversion ET power supply using EPC8004 high frequency eGaN FETs for 4G LTE wireless base station…