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System Solution: “SiC-Inverter for Industrial Motor Drive”

System Solution: “SiC-Inverter for Industrial Motor Drive”

This article discusses the advantages of Silicon Carbide for industrial motor drive inverters over the silicon counter-part of such devices.


E-Mobility for Components and EMC – Simulation and Measurement

E-Mobility for Components and EMC – Simulation and Measurement

This article highlights IMG Electronic & Power Systems and University of Ruse Angel Kanchev simulation models of E Mobility for Components and…


Temperature Limits for Power Modules – Part 2: Lifetime

Temperature Limits for Power Modules – Part 2: Lifetime

This article talks about calculating if the module internal interconnects could withstand the temperature swings and meet the design lifetime…


20 MHz Bandwidth Envelope Tracking Power Supply Using eGaN® FETs

20 MHz Bandwidth Envelope Tracking Power Supply Using eGaN® FETs

This article highlights Efficient Power Conversion ET power supply using EPC8004 high frequency eGaN FETs for 4G LTE wireless base station…


PLECS Goes Real-Time: A New HILSystem for Power Electronics

PLECS Goes Real-Time: A New HILSystem for Power Electronics

This article introduces Plexim's PLECS RT Box and its benefits for system modelling, design, simulation and testing of power electronics systems.


High Power Digital Inrush Current Controller

High Power Digital Inrush Current Controller

This article highlights IXYS HPDICC that offers flexibility in implementing a unique control algorithm for the development of an efficient power…


NonIGBT Power Modules Acoustic Inspection

NonIGBT Power Modules Acoustic Inspection

This article discusses various types of power modules with different structure and capacity and emphasizes the importance of AMI inspection to find…


Calibration Meeting the Challenges of HighFrequency Power Measurement

Calibration Meeting the Challenges of HighFrequency Power Measurement

This article defines calibration and introduces Yokogawa's calibration capabilities and emphasizes the importance of accreditation for…


Rethinking Power Analysis

Rethinking Power Analysis

This article introduces ZES ZIMMER's innovations to their power analyzers in terms of DUT physical interface, user interface and interface to…


Adding Flexibility to ACDC Power Supply Design that Uses PFCLLC Topology

Adding Flexibility to ACDC Power Supply Design that Uses PFCLLC Topology

This article discusses the advantages of PFC/LLC Combo controller and their key features and benefits in adding flexibility to power supply designs.


BiAgX HighTemperature LeadFree Pbfree Solder Paste

BiAgX HighTemperature LeadFree Pbfree Solder Paste

This article introducest Indium Corporation's BiAgX, a high-temperature lead-free solder paste for surface-mount-technology (SMT) applications.


Low Loss HighPower Thyristors for Industrial Applications

Low Loss HighPower Thyristors for Industrial Applications

This article introduces ABB's development of the Phase Control Thyristor for HVDC and discusses its design concept and the device performance.


How to use a small microcontroller to control the LED driver for a dimmable triac

How to use a small microcontroller to control the LED driver for a dimmable triac

This article offers a method on using a small microcontroller to control the LED driver for a dimmable TRIAC for inherent power factor correction.


Driving a SinglePhase Brushless DC BLDC Motor

Driving a SinglePhase Brushless DC BLDC Motor

This article offers a method of How to use a low-cost microcontroller as a driver for a single-winding, single-phase brushless DC motor.


DCDC Voltage Regulation Complete Solution Targeting  PoL Market

DCDC Voltage Regulation Complete Solution Targeting PoL Market

This article introduces Infineon's latest multiphase digital controller for DC to DC product applications focused on increasing density and…


Eliminating Earth Leakage  Currents and Significantly  Improving EMC

Eliminating Earth Leakage Currents and Significantly Improving EMC

This article presents TDK offering a new kind of solution for removing leakage currents and improving EMC performance of the system.


InFORMS vs the Trimmed  Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

InFORMS vs the Trimmed Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

This article discusses TT Electronics and Hybrid testing the inFORMS and discusses the reliability of this interconnect increases in thermal cycles.


Reverse Power Feeding Enables HighSpeed Internet Access

Reverse Power Feeding Enables HighSpeed Internet Access

This article highlights Texas Instruments power solution on how these interconnection points are supplied by the end customers using the same…


A Substrate to Rely On New IPC Standards for MetalClad PCBs Give the Power to Choose

A Substrate to Rely On New IPC Standards for MetalClad PCBs Give the Power to Choose

This article discusses the IMS and the need for standard then offers the IPC/CPCA-4105A, a joint standard covering IMS for product designers.


Paralleling SiC Cascodes for High Performance High Power Systems

Paralleling SiC Cascodes for High Performance High Power Systems

This article discusses the inherent capability and behaviour of SiC cascodes to be safely paralleled for high performance, high power systems.