Latest Semiconductors Technical Articles

This article introduces EPCOS' NTC and PTC sensors with different characteristics for thermal management of a wide…

This article introduces EPCOS' NTC and PTC sensors with different characteristics for thermal management of a wide variety of semiconductor…

This article introduces the new IGBT module generation of Mitsubishi Electric with improved Insulated Metal Baseplate as…

This article introduces the new IGBT module generation of Mitsubishi Electric with improved Insulated Metal Baseplate as a key element of the…

This article discusses the advantages of chip-scale packaging of GaN transistors by evaluating its thermal performance…

This article discusses the advantages of chip-scale packaging of GaN transistors by evaluating its thermal performance and efficiency.

This article discusses the advantages of IXYS' MMIXT132N50P3 with current mirror to monitor the drain current and its…

This article discusses the advantages of IXYS' MMIXT132N50P3 with current mirror to monitor the drain current and its various applications.

This article discusses the main features which make the IGCT an attractive option for high power applications with…

This article discusses the main features which make the IGCT an attractive option for high power applications with respect to the technology…

This article highlights Gallium Nitride's (GAN) advantages over silicon in terms of performance to finally displace…

This article highlights Gallium Nitride's (GAN) advantages over silicon in terms of performance to finally displace silicon in power devices.

This article discusses the advancements of AgileSwitch in Programmable Gate Drivers.

This article discusses the advancements of AgileSwitch in Programmable Gate Drivers.

This article emphasizes the essential considerations engineers need to take note of in design of insulation relating to…

This article emphasizes the essential considerations engineers need to take note of in design of insulation relating to partial discharge.

This article discusses methods on solving challenges in power electronics and suggests methods to improve performance of…

This article discusses methods on solving challenges in power electronics and suggests methods to improve performance of power electronics…

This article describes a new 8.5 kV low loss thyristor family designed for industrial applications with full blocking…

This article describes a new 8.5 kV low loss thyristor family designed for industrial applications with full blocking capability at 50Hz/60Hz…

This article explores the wide bandgap switching devices design tradeoffs for efficiency and power factor in implementing…

This article explores the wide bandgap switching devices design tradeoffs for efficiency and power factor in implementing designs at higher…

This article highlights the advantages of GaN E-HMET from GaN Systems over the conventional silicon-based IGBT and MOSFET…

This article highlights the advantages of GaN E-HMET from GaN Systems over the conventional silicon-based IGBT and MOSFET inverter solutions.

This article discusses the user configurable gate drives' performance benefits for converter power stack designers and…

This article discusses the user configurable gate drives' performance benefits for converter power stack designers and maintenance engineers.

This article discusses the benefits of nHPD2 packaging technology and the wider market need for operational high power…

This article discusses the benefits of nHPD2 packaging technology and the wider market need for operational high power wide band gap devices.

This article discusses methods in using two DC-DC converters in parallel operation for better reliability and redundancy…

This article discusses methods in using two DC-DC converters in parallel operation for better reliability and redundancy for devices.

This article discusses the novel Silicon Carbine based hybrid surge suppressor module for safeguarding AC and DC power…

This article discusses the novel Silicon Carbine based hybrid surge suppressor module for safeguarding AC and DC power circuitry and its benefits.

This article discusses the TDK and Infineon's new integrated solution for inverters for e-mobility power trains and…

This article discusses the TDK and Infineon's new integrated solution for inverters for e-mobility power trains and industrial applications.

This article discusses the method of increasing packing density of power electronics using Chip-on-Heatsink Technology…

This article discusses the method of increasing packing density of power electronics using Chip-on-Heatsink Technology for better thermal management.

This article introduces Mitsubishi Electric Corporation's new three-level topology power modules with optimized packaging…

This article introduces Mitsubishi Electric Corporation's new three-level topology power modules with optimized packaging for 3-level inverter…