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1200V Hyperfast Diodes and Their Applications

1200V Hyperfast Diodes and Their Applications

This article introduces the applications of 1200V Hyperfast diodes and discusses hard switching, soft switching and power losses in diode behavior.


Gate Driver Applications For Infineon’s CoolSiC™ MOSFET

Gate Driver Applications For Infineon’s CoolSiC™ MOSFET

This article discusses the advantages of SiC T-MOSFET compared to the conventional IGBT in terms of power savings and heatsink size reduction.


Efficient MCU-Controlled High Power PFC with Two-Phase Current Modulation

Efficient MCU-Controlled High Power PFC with Two-Phase Current Modulation

This article discusses techniques on designs to increase the efficiency of conversion at high power by utilizing improvements of converters.


SiC Devices Poised and Ready for Harsh Environment Applications

SiC Devices Poised and Ready for Harsh Environment Applications

This article discusses the challenges of SiC devices under high humidity conditions and introduces the new WAS300M12BM2 Wolfspeed power module.


Choosing Among Ceramic Substrates for Power Circuits

Choosing Among Ceramic Substrates for Power Circuits

Designing modern power circuits starts with a choice of circuit material. This choice is critical for meeting performance goals. The material must…


Thyristors for Current Impulses Commutation in Amplitude Range of Hundreds kA and Duration Range of Hundreds µs

Thyristors for Current Impulses Commutation in Amplitude Range of Hundreds kA and Duration Range of Hundreds µs

This article discusses the variety of improvements of the new generation of silicon pulse thyristors for commutation of current impulses.


SiC Power Modules for a Wide Application Range Innovative Power Devices for a Sustainable Future

SiC Power Modules for a Wide Application Range Innovative Power Devices for a Sustainable Future

This article explains in detail the innovation potential and benefits of integrating SiC-technology in power electronics systems.


COLD SPLIT Provides Significant Cost Advantages for SiC Substrates and Devices

COLD SPLIT Provides Significant Cost Advantages for SiC Substrates and Devices

This article highlights Siltectra's Cold Split, a kerf-free wafering technique, and discusses its advantages over conventional techniques.


An Intelligent IGBT Module for Single-Ended Induction Heating Applications: All-in-One Solution for Induction Cooking System

An Intelligent IGBT Module for Single-Ended Induction Heating Applications: All-in-One Solution for Induction Cooking System

This article introduces Alpha & Omega Semiconductors' new IGBT Module that is specifically designed for induction heating (IH)…


Comparing Power Transistors Operating at HighTemperature Tj200C Knowing the Transistors in Designs

Comparing Power Transistors Operating at HighTemperature Tj200C Knowing the Transistors in Designs

This article highlights LTEC Corporation SCT30N120 and SCH2080KE power transistors physical analysis on high-temperature operation.


Important Parameters in Choosing an Digital Storage Oscilloscopes (DSO) - Part 2

Important Parameters in Choosing an Digital Storage Oscilloscopes (DSO) - Part 2

This article discusses the important parameters to remember in choosing the right digital storage oscilloscope for designing and testing circuitry.


Current Progress at Si IGBTs in the Voltage Range up to 1200V

Current Progress at Si IGBTs in the Voltage Range up to 1200V

In recent years the basic features introduced at the turn of the millennium for IGBTs such as trench gate cell and field stop layers could be…


Side Wall Gate - Moving on from Trench

Side Wall Gate - Moving on from Trench

This article discusses the new side wall gate structure and its performance characteristics and its module-level investigation.


Important Parameters in Choosing an Digital Storage Oscilloscopes (DSO) - Part 1

Important Parameters in Choosing an Digital Storage Oscilloscopes (DSO) - Part 1

This article discusses the important parameters to remember in choosing the right digital storage oscilloscope for designing and testing circuitry.


Investigating Losses of GaN-HFETs in a Synchronous Buck Converter

Investigating Losses of GaN-HFETs in a Synchronous Buck Converter

This article illustrates a thermal measuring method and electrical method with air-core inductors to investigate the losses in eGaNTM FETs.


“PFC + Inverter” Intelligent Power Module in 21mm x 36mm for Low Power Drives

“PFC + Inverter” Intelligent Power Module in 21mm x 36mm for Low Power Drives

This article discusses the features and advantages of intelligent power modules in terms of costs, size, thermal and overcurrent protection.


EiceDRIVER and CoolMOS CFD2 Join for High Efficiency in Refrigeration

EiceDRIVER and CoolMOS CFD2 Join for High Efficiency in Refrigeration

This article discusses the benefits and advantages of CoolMOS CFD2 in terms of efficiency in motor drive applications and gives recommended layouts.


Reliable SiC Power Devices for Automotive Applications

Reliable SiC Power Devices for Automotive Applications

This article focuses on automotive-grade SiC power devices, including some of their common applications and reliability data.


A Performance Comparison of GaN E-HEMTs versus SiC MOSFETs in Power Switching Applications

A Performance Comparison of GaN E-HEMTs versus SiC MOSFETs in Power Switching Applications

This article highlights GaN Systems Inc. comparison of GaN E-HEMTs and SiC MOSFET performance and characteristics in power switching applications.


1200V CoolSiC™ MOSFET: High Performance Complemented by High Reliability

1200V CoolSiC™ MOSFET: High Performance Complemented by High Reliability

This article discusses the advantages and benefits of applying Infineon's SiC MOSFETs with blocking voltages of 1200V in various application…