This article discusses the variety of improvements of the new generation of silicon pulse thyristors for commutation of current impulses.
This article discusses the variety of improvements of the new generation of silicon pulse thyristors for commutation of current impulses.
This article explains in detail the innovation potential and benefits of integrating SiC-technology in power electronics systems.
This article explains in detail the innovation potential and benefits of integrating SiC-technology in power electronics systems.
This article highlights Siltectra's Cold Split, a kerf-free wafering technique, and discusses its advantages over…
This article highlights Siltectra's Cold Split, a kerf-free wafering technique, and discusses its advantages over conventional techniques.
This article introduces Alpha & Omega Semiconductors' new IGBT Module that is specifically designed for induction heating…
This article introduces Alpha & Omega Semiconductors' new IGBT Module that is specifically designed for induction heating (IH)…
This article highlights LTEC Corporation SCT30N120 and SCH2080KE power transistors physical analysis on high-temperature…
This article highlights LTEC Corporation SCT30N120 and SCH2080KE power transistors physical analysis on high-temperature operation.
This article discusses the important parameters to remember in choosing the right digital storage oscilloscope for…
This article discusses the important parameters to remember in choosing the right digital storage oscilloscope for designing and testing circuitry.
In recent years the basic features introduced at the turn of the millennium for IGBTs such as trench gate cell and field…
In recent years the basic features introduced at the turn of the millennium for IGBTs such as trench gate cell and field stop layers could be…
This article discusses the new side wall gate structure and its performance characteristics and its module-level investigation.
This article discusses the new side wall gate structure and its performance characteristics and its module-level investigation.
This article discusses the important parameters to remember in choosing the right digital storage oscilloscope for…
This article discusses the important parameters to remember in choosing the right digital storage oscilloscope for designing and testing circuitry.
This article illustrates a thermal measuring method and electrical method with air-core inductors to investigate the…
This article illustrates a thermal measuring method and electrical method with air-core inductors to investigate the losses in eGaNTM FETs.
This article discusses the features and advantages of intelligent power modules in terms of costs, size, thermal and…
This article discusses the features and advantages of intelligent power modules in terms of costs, size, thermal and overcurrent protection.
This article discusses the benefits and advantages of CoolMOS CFD2 in terms of efficiency in motor drive applications and…
This article discusses the benefits and advantages of CoolMOS CFD2 in terms of efficiency in motor drive applications and gives recommended layouts.
This article focuses on automotive-grade SiC power devices, including some of their common applications and reliability data.
This article focuses on automotive-grade SiC power devices, including some of their common applications and reliability data.
This article highlights GaN Systems Inc. comparison of GaN E-HEMTs and SiC MOSFET performance and characteristics in…
This article highlights GaN Systems Inc. comparison of GaN E-HEMTs and SiC MOSFET performance and characteristics in power switching applications.
This article discusses the advantages and benefits of applying Infineon's SiC MOSFETs with blocking voltages of 1200V in…
This article discusses the advantages and benefits of applying Infineon's SiC MOSFETs with blocking voltages of 1200V in various application…
This article highlights Wolfspeed C3M™ SiC MOSFETs that considers package inductance and printed circuit board layout…
This article highlights Wolfspeed C3M™ SiC MOSFETs that considers package inductance and printed circuit board layout as factors for best system…
This article features a novel technique to redue substrate tilt and improve bondline control between AIN substrate and…
This article features a novel technique to redue substrate tilt and improve bondline control between AIN substrate and AlSiC Baseplate in IGBT…
This article provides insight into the latest generation of 6.5kV HiPak modules with reliable performance demonstrated in…
This article provides insight into the latest generation of 6.5kV HiPak modules with reliable performance demonstrated in the new THB-HVDC test.
This article discusses a flexible approach to gate drive designs using nHPD2 package from Hitachi targeted at traction…
This article discusses a flexible approach to gate drive designs using nHPD2 package from Hitachi targeted at traction applications.
This article highlights Panasonic Hybrid Drain Gate Injection Transistor (HD-GiT) with overview of advantages that aimed…
This article highlights Panasonic Hybrid Drain Gate Injection Transistor (HD-GiT) with overview of advantages that aimed aimed at power converters.