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Busbar Handles More Power without Adding More Size

Busbar Handles More Power without Adding More Size

This article discusses a method of increasing power of busbars without adding size by combining Power Ring Film Capacitors with busbars assemblies.


How Off-Board Charger Can Benefit from the Rapid Implementation of Power Semiconductors

How Off-Board Charger Can Benefit from the Rapid Implementation of Power Semiconductors

This article discusses the requirements for off-board electric vehicle chargers and introduces Vincotech's platform for chargers OEM.


“AllI n One” DIPIPM Series for Compact Inverter Designs

“AllI n One” DIPIPM Series for Compact Inverter Designs

This article introduces Mitsubishi Electric's DIPIPM+TM series, a Converter-Inverter-Brake modules, to help reduce the cost and size of…


Technical Articles Sep 05, 2016 by
High-Precision, Wideband, Highly Stable Current Sensing Technology

High-Precision, Wideband, Highly Stable Current Sensing Technology

This article introduced the detection principle used by the zero-flux method, key considerations when choosing a current sensor and some precautions.


Power Solution for 1500VDC Photovoltaic Power Generation System

Power Solution for 1500VDC Photovoltaic Power Generation System

This article discusses the photovoltaic power generation and its system and introduces power solution for monitoring multiple complementary systems.


Evaluating Silver Sintering as a Reliable Die-Attach Material for Automotive Power Module Applications

Evaluating Silver Sintering as a Reliable Die-Attach Material for Automotive Power Module Applications

This article discusses the benefits of double-sided silver-sintering technology and demonstrate the superiority over conventional solder.


A Revolutionary Technology for Cost Tailoring Power Inductive Components

A Revolutionary Technology for Cost Tailoring Power Inductive Components

This article introduces MAGMENT's power inductors and transformers based on disruptive technology and discusses its advantages over…


Thermal Management of Semiconductors

Thermal Management of Semiconductors

This article introduces EPCOS' NTC and PTC sensors with different characteristics for thermal management of a wide variety of semiconductor…


Enhanced IGBT Module Power Density Utilizing the Improved Thermal Conductivity of SLC-Technology

Enhanced IGBT Module Power Density Utilizing the Improved Thermal Conductivity of SLC-Technology

This article introduces the new IGBT module generation of Mitsubishi Electric with improved Insulated Metal Baseplate as a key element of the…


Improving Thermal Performance with Chip-Scale Packaged Gallium Nitride Transistors

Improving Thermal Performance with Chip-Scale Packaged Gallium Nitride Transistors

This article discusses the advantages of chip-scale packaging of GaN transistors by evaluating its thermal performance and efficiency.


Moving Toward Stronger Power Electronics Prototyping

Moving Toward Stronger Power Electronics Prototyping

This article discusses a new approach for prototyping using Imperix's BoomBox RCP platform and its application as well as its integration to…


Design Methodology for First Pass Success: A rationale for hardware simulation

Design Methodology for First Pass Success: A rationale for hardware simulation

This article highlights the importance of modelling and simulation task in design methodology to reduce the number of design iterations and acquire…


High Voltage Ceramic Capacitors for Power Electronics

High Voltage Ceramic Capacitors for Power Electronics

This article presents the characteristics and performances of a new range of high voltage ceramic capacitors manufactured using a new ceramic…


Recent Advancements in IGCT Technologies for High-Power Electronics Applications

Recent Advancements in IGCT Technologies for High-Power Electronics Applications

This article discusses the main features which make the IGCT an attractive option for high power applications with respect to the technology…


Simplify Power Electronics Design with GaN Power ICs

Simplify Power Electronics Design with GaN Power ICs

This article highlights Gallium Nitride's (GAN) advantages over silicon in terms of performance to finally displace silicon in power devices.


No Need for External Sensors in New Inverters

No Need for External Sensors in New Inverters

This article introduces IC integration to allow PCB based sensor solutions for the reduction of cost and footprint of power converters.


CIPS 2016 - Power Electronics in Challenging Little Boxes and More

CIPS 2016 - Power Electronics in Challenging Little Boxes and More

This article discusses methods on solving challenges in power electronics and suggests methods to improve performance of power electronics…


Enabling Faster Response to Changing Energy Demands with Power Modules

Enabling Faster Response to Changing Energy Demands with Power Modules

This article discusses the impact and importance of Energy Storage Systems (ESS) in the market and introduces Vincotech's flow series power…


Direct Cooled Molded Power Module for Motor Integration in Electric and Hybrid Vehicles

Direct Cooled Molded Power Module for Motor Integration in Electric and Hybrid Vehicles

This article offers a solution to improve motor drive's package density to reduce the production costs and better design and flexibility.


Low Loss Thyristors for High Power Applications

Low Loss Thyristors for High Power Applications

This article describes a new 8.5 kV low loss thyristor family designed for industrial applications with full blocking capability at 50Hz/60Hz…