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BiAgX HighTemperature LeadFree Pbfree Solder Paste

BiAgX HighTemperature LeadFree Pbfree Solder Paste

This article introducest Indium Corporation's BiAgX, a high-temperature lead-free solder paste for surface-mount-technology (SMT) applications.


Low Loss HighPower Thyristors for Industrial Applications

Low Loss HighPower Thyristors for Industrial Applications

This article introduces ABB's development of the Phase Control Thyristor for HVDC and discusses its design concept and the device performance.


Powering IGBT Drivers with TI039s FlyBuck Converter

Powering IGBT Drivers with TI039s FlyBuck Converter

This article offers methods of using Fly-Buck converter as a cost-effective and simpler solution to power IGBT driver in the AC motor drives and…


Driving and Protecting 1200VClass IGBTs with HVICs

Driving and Protecting 1200VClass IGBTs with HVICs

This article introduces Mitsubishi Electric's 1200V/2A HVIC, the M81748FP, with high-side and low-side short circuit (SC) protection circuit.


How to use a small microcontroller to control the LED driver for a dimmable triac

How to use a small microcontroller to control the LED driver for a dimmable triac

This article offers a method on using a small microcontroller to control the LED driver for a dimmable TRIAC for inherent power factor correction.


Driving a SinglePhase Brushless DC BLDC Motor

Driving a SinglePhase Brushless DC BLDC Motor

This article offers a method of How to use a low-cost microcontroller as a driver for a single-winding, single-phase brushless DC motor.


Increased Power Density and Performance with 3D Embedded Substrate Technologies

Increased Power Density and Performance with 3D Embedded Substrate Technologies

This article discusses the investigation done by PSMA and offers the important core technologies required for embedding substrates.


DCDC Voltage Regulation Complete Solution Targeting  PoL Market

DCDC Voltage Regulation Complete Solution Targeting PoL Market

This article introduces Infineon's latest multiphase digital controller for DC to DC product applications focused on increasing density and…


Eliminating Earth Leakage  Currents and Significantly  Improving EMC

Eliminating Earth Leakage Currents and Significantly Improving EMC

This article presents TDK offering a new kind of solution for removing leakage currents and improving EMC performance of the system.


Stop Interfering Ways to Prevent Electromagnetic Interference in Amplifier Circuits

Stop Interfering Ways to Prevent Electromagnetic Interference in Amplifier Circuits

This article offers multiple solutions to prevent electromagnetic interference in amplifier circuits of most equipments such as medical and avionics.


Electrical Power Supply Matrix Systems

Electrical Power Supply Matrix Systems

This article highlights AEPS-GROUP electrical power supply systems with GaN technology instead of GaAs technology for a reduction in APAR power…


The Integrated Simulation Environment for Power Modules

The Integrated Simulation Environment for Power Modules

This article highlights Vincotech GmbH integrated simulation environment software designed to provide customers the opportunity to preselect power…


InFORMS vs the Trimmed  Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

InFORMS vs the Trimmed Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

This article discusses TT Electronics and Hybrid testing the inFORMS and discusses the reliability of this interconnect increases in thermal cycles.


Efficient Inverters for PV Systems

Efficient Inverters for PV Systems

This article highlights Zeversolar that is a chinese manufacturer of PV inverters in the budget segment, making the solar energy available to…


Low Stress Silicone Encapsulant Enables Distributed Power Generation

Low Stress Silicone Encapsulant Enables Distributed Power Generation

This article highlights Dow Corning Corporation EE-3200 Low Stress Silicone Encapsulant that contributes to the penetration of this technology.


Enhanced Module Design Makes Most of New IGBT5 Performance

Enhanced Module Design Makes Most of New IGBT5 Performance

This article highlights Infineon Technologies AG PrimePACK 3+ package that extends the current range of the PrimePACK series to 1800 A with .XT…


DC/DC Application Ideas

DC/DC Application Ideas


Industry White Papers In partnership with RECOM
Highest Power density by 7th Gen IGBT StdType Module with New TMSTechnology

Highest Power density by 7th Gen IGBT StdType Module with New TMSTechnology

This article highlights Mitsubishi Electric 7th Gen. Std-type IGBT Modules based on TMS-Technology that is the 7th Gen Chip in the T-Series IGBT…


Reverse Power Feeding Enables HighSpeed Internet Access

Reverse Power Feeding Enables HighSpeed Internet Access

This article highlights Texas Instruments power solution on how these interconnection points are supplied by the end customers using the same…


Launching Material Systems Concept Boosting Power Electronics Industry

Launching Material Systems Concept Boosting Power Electronics Industry

This article highlights an interview of Gavin Hsu of Bodos power system and Ralf Merget Heraeus Electronics material systems concept.