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State of the SiC MOSFET: Device evolution, technology merit, and commercial prospects

State of the SiC MOSFET: Device evolution, technology merit, and commercial prospects

This article features Littelfuse Inc. SiC MOSFET device evolution, technology merit, and commercial success and substantial role for green energy…


High Current Welding Diodes for Demanding Industrial Applications

High Current Welding Diodes for Demanding Industrial Applications

This article highlights ABB welding diodes that is designed for such extreme load and set new power cycling records for all power semiconductor…


Step Up to Half-Bridge GaN Power ICs

Step Up to Half-Bridge GaN Power ICs

This article features Navitas Semiconductor's half-bridge Gan Power Integrated Circuit applications with power levels from 20W to 300W or more.


Operation of Power Silicon for Cascade Cell Based MV Motor Drives

Operation of Power Silicon for Cascade Cell Based MV Motor Drives

For standard low voltage (≤690Vac) motor drives the IGBT based voltage source 2 level topology dominates the landscape. However at higher…


Rethinking the Power MOSFET Figure of Merit

Rethinking the Power MOSFET Figure of Merit

This article highlights Vishay Siliconix Figure of Merit (FOM) brief history with power MOSFET and comparison one design platform to another.


IGBT/SiC-FET Driver Design Tips to Prevent False Triggering

IGBT/SiC-FET Driver Design Tips to Prevent False Triggering

This article discusses tips on properly designing IGBT or SiC FET bridge circuits to prevent false triggering and ensure high reliability.


High Voltage Ceramic Chip Capacitors Evaluated Acoustically

High Voltage Ceramic Chip Capacitors Evaluated Acoustically

This article discusses how acoustic micro imaging tools work and how it helps detect and keep defective capacitors out of production.


Ag-Sintering as an Enabler for Thermally Demanding Electronic and Semiconductor Applications

Ag-Sintering as an Enabler for Thermally Demanding Electronic and Semiconductor Applications

This article highlights Advanced Packaging Center and Alpha Assembly Solutions Silver (Ag) sintering proven and reliable bonding technology for…


The Creation and Potential Cell Structures of SiC Devices

The Creation and Potential Cell Structures of SiC Devices

> <p>This article highlights ROHM about the potential structures of SiC devices, focusing on different structures and showing that…


High Voltage IGBT Modules in the 3300 V Class

High Voltage IGBT Modules in the 3300 V Class

This article describes the basic points of the X-Series design including the improvements contributing to a safe operation of the device.


LV100 - a Dual Power Module for the Next Generation Railway Inverters

LV100 - a Dual Power Module for the Next Generation Railway Inverters

This article discusses the new standard dual-module package specially developed for High Voltage IGBTs HVIGBTs used in railway applications.


Modern Induction Cooking Demands Compact and Efficient Solutions

Modern Induction Cooking Demands Compact and Efficient Solutions

This article describes the challenges of inverter-based induction cooking and introduces a new technology that meets the technical and price…


Applying Silver Low-Temperature Sintering Technology

Applying Silver Low-Temperature Sintering Technology

This article discusses the application of technologies of low-temperature sintering of silicon wafers and molybdenum discs using the silver…


GaN Transistor Gate Drive Optocouplers

GaN Transistor Gate Drive Optocouplers

This article features Broadcom's Gallium Nitride (GaN) Transistor Gate Drive Optocouplers and discusses its advantages, marketing, drive and…


The Next Generation Bimode Insulated Gate Transistors Based on Enhanced Trench Technology

The Next Generation Bimode Insulated Gate Transistors Based on Enhanced Trench Technology

This article demonstrate the next step in device evolution can be achieved by combining the ET-IGBT MOS cell and the BIGT integration structure.


The Creation of Silicon Carbide  Revolutionary Semiconductor

The Creation of Silicon Carbide Revolutionary Semiconductor

This article highlights SiCrystal AG and Rohm Semiconductor GmbH for the potential of Silicon Carbide material for power and RF electronics…


MiniSKiiP: The Power Density Master for Motor Drives

MiniSKiiP: The Power Density Master for Motor Drives

This article features the MiniSKiip series as the power density master for compact motor drives in reducing cost by maximizing output power density.


The Rugged 62Pak IGBT Module Range Employing the Next Generation 1700V SPT Chip Set for 175C Operation

The Rugged 62Pak IGBT Module Range Employing the Next Generation 1700V SPT Chip Set for 175C Operation

This article features the ABB's third generation of 1700V SPT++ IGBTs which is capable of operating up to a max temperature of 175˚C.


Technology Trends Raising Power-Conversion Efficiency

Technology Trends Raising Power-Conversion Efficiency

This article discusses the advances in superjunction MOSFETs and SiC Rectifiers and how they can improve on-resistance and noise of power supply…


Reverse Conducting IGCT Platform optimized for Modular Multilevel Converters MMC

Reverse Conducting IGCT Platform optimized for Modular Multilevel Converters MMC

This article discusses the technical aspects of ABB's newly developed Reverse Conducting Integrated Gate Commutated Thyristor (RC-IGCT) platform.