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Reducing Power Supply Requirements for Ceramic Capacitors

Reducing Power Supply Requirements for Ceramic Capacitors

The input side requires ceramic capacitors for decoupling and to filter EMI due to their low ESR and low ESL in high frequency.


Grounding and Bonding for High-Frequency Stimulus

Grounding and Bonding for High-Frequency Stimulus

Learn about the behavior of grounding and bonding conductors with high-frequency signals


The Demand for Seamless Characterization, Simulation and Development of Power Semiconductors

The Demand for Seamless Characterization, Simulation and Development of Power Semiconductors

This article highlights publicly-funded project MessLeha addresses this issue by defining a machine-readable data sheet to support the setup of…


DC-Meters for Fair and Smart EV Fast Charge Billing

DC-Meters for Fair and Smart EV Fast Charge Billing

This article highlights LEM DC Billing Meter (DCBM) that is smart, extremely compact, and fully compliant with the German “Eichrecht” regulations.


Understanding Thermal Management of Chip-Scale GaN Devices

Understanding Thermal Management of Chip-Scale GaN Devices

This article discusses the challenges that thermal management raises due to increased power density, especially with chip-scale-packaging (CSP).


Eliminating EMC at the Source

Eliminating EMC at the Source

This article highlights Ing Buro Springett elimination of the source of the noise by replacing the mosfet with a source tabbed, Nexperia GAN063-650W.


3D Bond Wire Modelling and Electro-Magnetic Simulation Accelerates IGBT Module Development

3D Bond Wire Modelling and Electro-Magnetic Simulation Accelerates IGBT Module Development

This article introduces software MFis Wire and its advantages in significantly shortening time for creating complex 3D geometry models of bond wire…


Differential Mode Vs. Common Mode Conducted Emissions

Differential Mode Vs. Common Mode Conducted Emissions

The article presented the basic knowledge about conducted emissions providing an essential and intuitive overview, starting from how they are…


1200V Discrete SiC MOSFETs Compared to High-Speed 3 IGBTs for Servo-Drive Systems

1200V Discrete SiC MOSFETs Compared to High-Speed 3 IGBTs for Servo-Drive Systems

This article highlights Infineon Technologies AG CoolSiC™ MOSFET performance that are for servo-drive systems, which are typically characterized…


An Overview of Conducted Emissions

An Overview of Conducted Emissions

This article presents the general background of conducted emissions, their frequency range, how they are generated, and how they are tested at EMC…


Understanding the Development Process of Inductor Design

Understanding the Development Process of Inductor Design

This article will analyze the challenge of measuring the saturation roll off and introduce the BsT-pulse which attempts to solve this problem.


Bipolar Power Solutions for Precision Test and Measurement Systems

Bipolar Power Solutions for Precision Test and Measurement Systems

This article discusses how generating bipolar power supply systems with isolation can be a balancing act between system performance, maintaining a…


Interpreting and Validating Dynamic Characteristics for Wide Bandgap Power Device Data Sheets

Interpreting and Validating Dynamic Characteristics for Wide Bandgap Power Device Data Sheets

This article discusses practical considerations for the measurement and extraction of dynamic power semiconductor parameters.


An Introduction to TRIAC Basics

An Introduction to TRIAC Basics

Learn about the triode for alternative currents (TRIAC), including its construction, circuit characteristics, applications, and testing procedures.


Chip-Embedded Technology Enables High Current Density Power

Chip-Embedded Technology Enables High Current Density Power

This article highlights TDK 3D design techniques that can help reduce parasitic losses, and improve thermal performance while also reducing the PCB…


Pulse Current Systems up to 35kA

Pulse Current Systems up to 35kA

This article introduces pulse current systems up to 35kA and offers applications and technical descriptions.


Damp-Oscillation Solution for Validation of the Nanocrystalline Core for Common Mode Choke

Damp-Oscillation Solution for Validation of the Nanocrystalline Core for Common Mode Choke

This article highlights Bs&T Frankfurt am Main GmbH damping-oscillation soluttion is presented with detailed principle description and…


The Circuit Description and Functionality of a Two Terminal Bipolar Power Supply

The Circuit Description and Functionality of a Two Terminal Bipolar Power Supply

This article demonstrates a simple 2-quadrant voltage source circuit using the LTC8714.


Substation Protection Against Transient Overvoltages and Lightning Strikes

Substation Protection Against Transient Overvoltages and Lightning Strikes

Learn how surge arresters protect power substations against lightning and switching overvoltages.


High Voltage Detectors in Power Electronics

High Voltage Detectors in Power Electronics

While prominent for AC lines, DC voltage detectors are hard to find and seldom used in power electronics especially for voltages higher than 1000V,…