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Inevitability of Near Chip-Scale SMD Packaging for Power GaN and SiC

Inevitability of Near Chip-Scale SMD Packaging for Power GaN and SiC

This article is a Q&A aiming to provide insight into the benefits of WBG near chip-scale package capability and its ultimate form, the μMaxPak…


Gate Drive Optocouplers for GaN Power Devices

Gate Drive Optocouplers for GaN Power Devices

This article discusses Gallium Nitride Technology and wide variety of designs of different competing companies.


USB Type-C: Consumer Convenience Comes with Design Challenges

USB Type-C: Consumer Convenience Comes with Design Challenges

This article discusses the USB Type-C Connectors and its innovation for cable simplicity.


x-GaN 2.0: The Destination FiT10 is Demonstrably Exceeded

x-GaN 2.0: The Destination FiT10 is Demonstrably Exceeded

This article highlights Panasonic X-GaNTM transistors that is called as HD-GiT that aimed for power converters application in the ~100 W to ~5-6 kW…


Utilizing SiC Traction Technology Inverters in Automotive Applications

Utilizing SiC Traction Technology Inverters in Automotive Applications

This article focuses on presenting the benefits of a newly developed SiC power module and the utilization of this module in a powertrain inverter


Secrets of ‘Fluid-Like’ Heat Flow in Solid Semiconductor at Nanoscale

Secrets of ‘Fluid-Like’ Heat Flow in Solid Semiconductor at Nanoscale

This article discusses the thermoreflectance thermal imaging approach allowing researchers to create maps of temperature rise at far higher…


New Advances in Friction Stir Welding for Cold Plate Manufacture

New Advances in Friction Stir Welding for Cold Plate Manufacture

This article discusses Columbia-Staver's successfully developed Friction Stir Welding and its thermal characteristics.


Class 2 MLCC Dielectrics and the Case of the Missing Capacitance

Class 2 MLCC Dielectrics and the Case of the Missing Capacitance

This article discusses two different characteristics of the Multilayer Ceramic Chip Capacitors.


A Novel Circuit Topology for Turning a ‘Normally On’ GaN Transistor into ‘Normally Off’

A Novel Circuit Topology for Turning a ‘Normally On’ GaN Transistor into ‘Normally Off’

This article discusses how D-mode GaN transistors make themselves excellent building blocks for the next generation power conversion systems.


Dynamically Configurable Off-Line Switcher IC for Higher Application Flexibility

Dynamically Configurable Off-Line Switcher IC for Higher Application Flexibility

This article discusses Power Integrations Switcher ICs offering significant advantages of programmability, configurability, and adjustability.


Optimisation of dV/dt – Losses Trade Off Using Switchable Gate Resistance

Optimisation of dV/dt – Losses Trade Off Using Switchable Gate Resistance

This article has explored the application of selectable (switchable) gate resistances to optimize the trade-off between dV/dt and switching loss,…


Benefitting from the Evolution of Power Transistors

Benefitting from the Evolution of Power Transistors

This article discusses the evolution of power transistors and how they are redesigned and revised for increasing demands.


TOPTriac - A Temperature and Overload Protected Triac

TOPTriac - A Temperature and Overload Protected Triac

This article discusses WeEn Semiconductors TOPTriac and its features such as temperature and overload protection.


DCM™ 1000X Designed to Meet the Future SiC Demand of Electric Vehicle Drive Trains

DCM™ 1000X Designed to Meet the Future SiC Demand of Electric Vehicle Drive Trains

This article discusses Danfoss' DCM technology for traction applications and its electrical performance.


Handling Late Changes in Power System Designs

Handling Late Changes in Power System Designs

This article discusses Power System Design and how to improve flexibility in adapting to the changing requirements.


eGaN® FET-Based Synchronous Rectification

eGaN® FET-Based Synchronous Rectification

This article covers the similarities and differences of Si MOSFETS and eGan FETS that function as a “body diode” as well as their advantages…


Making the Most of Three-Level NPC Topology

Making the Most of Three-Level NPC Topology

This article looks at two chipset combinations to highlight the importance of understanding how the target parameters affect the selection of chips…


New Transfer Molded SMD Type IPM from Mitsubishi Electric

New Transfer Molded SMD Type IPM from Mitsubishi Electric

Mitsubishi Electric introduced a new addition to its line of new transfer molded SMD type Intelligent Power Module - the MISOP.


Making Single-Phase Solar Inverters Smaller, Cheaper & Safer

Making Single-Phase Solar Inverters Smaller, Cheaper & Safer

This article has used the example of photovoltaic installations to show the advances in recent LEM current transducers


Integrated Circuits Offer Enhanced Protection & Improved Safety Features for High Reliability Power Supplies

Integrated Circuits Offer Enhanced Protection & Improved Safety Features for High Reliability Power Supplies

This article discusses the high-reliability power systems and increasing efficiency and reliability.