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EPC’s New Half-bridge Power Stage IC Handles Up to 35 A

EPC’s New Half-bridge Power Stage IC Handles Up to 35 A

Efficient Power Conversion’s new EPC2302 eGaN IC switches at 1 MHz and boasts a withstand voltage of up to 100 V.


Wide Bandwidth Current Transducers for Power Analysis

Wide Bandwidth Current Transducers for Power Analysis

Power conversion products based on wide bandgap semiconductor technologies such as gallium nitride (GaN) and silicon carbide (SiC) are now…


Nano Pulse Technology for Primary DC/DC Converter Design: Reducing Application PCB Size and Cost

Nano Pulse Technology for Primary DC/DC Converter Design: Reducing Application PCB Size and Cost

The industrial and consumer market is requiring increased power density for DC/DC converters that have high step-down ratios and use high…


EPC Adds Another Rad-hard Gallium Nitride Power FET

EPC Adds Another Rad-hard Gallium Nitride Power FET

The new gallium nitride (GaN) FET joins EPC’s well-established line aimed at space-based applications including DC-DC power, motor drives, and…


ST’s New Chip Could Save 15 Nuclear Plants Worth of Energy

ST’s New Chip Could Save 15 Nuclear Plants Worth of Energy

The latest controller chip from STMicroelectronics incorporates an Arm Cortex-M0+ core and is designed to boost efficiency in USB-PD 3.1 adapters.


GaN Systems, EPC Both Unveil New GaN Power Transistors

GaN Systems, EPC Both Unveil New GaN Power Transistors

EPC’s (Efficient Power Conversion) new GaN FET targets space-based applications, while GaN Systems’ new offering is aimed at terrestrial…


EPC Says its New 40 V GaN FET Is World’s Smallest at 1.1 mΩ

EPC Says its New 40 V GaN FET Is World’s Smallest at 1.1 mΩ

The fresh EPC2066 is an enhancement-mode gallium nitride (eGaN) power FET expanding the company’s extensive portfolio of low-voltage,…


Efficient Power Conversion Unveils New 200 V Rad-hard GaN FET

Efficient Power Conversion Unveils New 200 V Rad-hard GaN FET

The latest addition to Efficient Power Conversion’s (EPC) line of rad-hardened devices features a maximum RDS(ON) of 25 mΩ and 20 A of…


EPC Space Unveils New 40 V Rad-Hard GaN Power Transistor

EPC Space Unveils New 40 V Rad-Hard GaN Power Transistor

The surface-mounted gallium nitride (GaN) device handles 95 A of continuous drain current and sports an RDS(ON) of only 4 milliohms.


EPC Claims its New 350 V GaN Transistor is 20 Times Smaller than Comparable Silicon Offerings

EPC Claims its New 350 V GaN Transistor is 20 Times Smaller than Comparable Silicon Offerings

The enhancement mode power transistor features a maximum continuous drain current of 6.3 A and a maximum RDS(ON) of 80 mΩ


STMicroelectronics Debuts 50 W GaN Converter for High-efficiency Power Applications

STMicroelectronics Debuts 50 W GaN Converter for High-efficiency Power Applications

The company’s new converter is a quasi-resonant (QR) flyback controller incorporating 650 V E-mode GaN transistors.


ROHM Introduces 150 V GaN High Electron Mobility Transistor with an 8 V Withstand Gate Voltage

ROHM Introduces 150 V GaN High Electron Mobility Transistor with an 8 V Withstand Gate Voltage

The new gallium nitride (GaN) device provides a safety margin of 3 V, as compared to the 1 V margin offered by standard devices of 200 V or less.


Power Integrations Introduces Tandem Power IC Families at APEC

Power Integrations Introduces Tandem Power IC Families at APEC

The new ICs enable designers to meet tough new efficiency requirements, while at the same time realizing excellent power factor correction (PFC).


Teledyne e2v HiRel’s New 650 V, 60 A GaN HEMTs are Space-screened at NASA’s Top Assurance Level

Teledyne e2v HiRel’s New 650 V, 60 A GaN HEMTs are Space-screened at NASA’s Top Assurance Level

The two new transistors are tested through NASA’s Level 1 screening flow, its most stringent set, and can be qualified to NASA’s full Level 1…


Teledyne e2v HiRel Releases a 100 V Transistor Driver for 20 MHz FET and GaN Transistors

Teledyne e2v HiRel Releases a 100 V Transistor Driver for 20 MHz FET and GaN Transistors

The radiation-tolerant device is available in a space-saving flip chip die, and is aimed at driving the company’s 100 V gallium nitride (GaN)…


EPC Space Expands its Rad-Hard GaN Offerings With New Demo Boards

EPC Space Expands its Rad-Hard GaN Offerings With New Demo Boards

The five easy-to-use demonstration boards will allow engineers to more quickly exploit the capabilities of radiation-hardened (RH) gallium nitride…


hofer powertrain and VisIC Technologies develop 3-Level 800V GaN inverter

hofer powertrain and VisIC Technologies develop 3-Level 800V GaN inverter

hofer powertrain, a globally leading automotive powertrain technology company, and VisIC Technologies Ltd., a global leader in gallium nitride…


Allegro Debuts a 3-Phase Gate Driver IC Purposed to Reduce EV Noise Levels

Allegro Debuts a 3-Phase Gate Driver IC Purposed to Reduce EV Noise Levels

The new unit is aimed at sensorless, brushless DC (BLDC) motors operating over a 5V to 50V voltage range.


Sungrow’s String Inverter Employs Infineon Module and Chip Technology

Sungrow’s String Inverter Employs Infineon Module and Chip Technology

The 352kW, 1500 VDC Sungrow device offers a 40% increase in output power when compared to the company’s previous best.


Toshiba Unveils New Simulation Technology Accu-ROM to Reduce Semiconductor Verification Time

Toshiba Unveils New Simulation Technology Accu-ROM to Reduce Semiconductor Verification Time

Toshiba has recently developed a new model-based development (MBD) simulation technology that can reportedly reduce verification times for…