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Power Integrations Introduces Tandem Power IC Families at APEC

Power Integrations Introduces Tandem Power IC Families at APEC

The new ICs enable designers to meet tough new efficiency requirements, while at the same time realizing excellent power factor correction (PFC).


Teledyne e2v HiRel’s New 650 V, 60 A GaN HEMTs are Space-screened at NASA’s Top Assurance Level

Teledyne e2v HiRel’s New 650 V, 60 A GaN HEMTs are Space-screened at NASA’s Top Assurance Level

The two new transistors are tested through NASA’s Level 1 screening flow, its most stringent set, and can be qualified to NASA’s full Level 1…


Teledyne e2v HiRel Releases a 100 V Transistor Driver for 20 MHz FET and GaN Transistors

Teledyne e2v HiRel Releases a 100 V Transistor Driver for 20 MHz FET and GaN Transistors

The radiation-tolerant device is available in a space-saving flip chip die, and is aimed at driving the company’s 100 V gallium nitride (GaN)…


EPC Space Expands its Rad-Hard GaN Offerings With New Demo Boards

EPC Space Expands its Rad-Hard GaN Offerings With New Demo Boards

The five easy-to-use demonstration boards will allow engineers to more quickly exploit the capabilities of radiation-hardened (RH) gallium nitride…


hofer powertrain and VisIC Technologies develop 3-Level 800V GaN inverter

hofer powertrain and VisIC Technologies develop 3-Level 800V GaN inverter

hofer powertrain, a globally leading automotive powertrain technology company, and VisIC Technologies Ltd., a global leader in gallium nitride…


Allegro Debuts a 3-Phase Gate Driver IC Purposed to Reduce EV Noise Levels

Allegro Debuts a 3-Phase Gate Driver IC Purposed to Reduce EV Noise Levels

The new unit is aimed at sensorless, brushless DC (BLDC) motors operating over a 5V to 50V voltage range.


Sungrow’s String Inverter Employs Infineon Module and Chip Technology

Sungrow’s String Inverter Employs Infineon Module and Chip Technology

The 352kW, 1500 VDC Sungrow device offers a 40% increase in output power when compared to the company’s previous best.


Toshiba Unveils New Simulation Technology Accu-ROM to Reduce Semiconductor Verification Time

Toshiba Unveils New Simulation Technology Accu-ROM to Reduce Semiconductor Verification Time

Toshiba has recently developed a new model-based development (MBD) simulation technology that can reportedly reduce verification times for…


Taiwan Semi Introduces 2A LED Driver with 4.5-75V Input

Taiwan Semi Introduces 2A LED Driver with 4.5-75V Input

AEC-Q100 qualified, high efficiency driver for automotive and high-reliability DC input industrial and medical lighting; Hysteretic control…


Microchip Debuts a High-Precision Voltage Reference IC for Automotive Applications

Microchip Debuts a High-Precision Voltage Reference IC for Automotive Applications

The new AEC-Q100 qualified device offers high reliability and low drift over an extended temperature range.


GaN Systems Offers Reference Designs for 3kW AC/DC Power Supplies

GaN Systems Offers Reference Designs for 3kW AC/DC Power Supplies

The two power supply unit (PSU) designs offer either full bridge LLC resonant converter or bridgeless totem-pole PFC formats.


Maxim Debuts Single Input Multiple Output (SIMO) Power Management IC (PMIC)

Maxim Debuts Single Input Multiple Output (SIMO) Power Management IC (PMIC)

The unit offers a 300mA battery charger, three independent power rails, and a separate LDO output.


Stackpole Enhances High Voltage Chip Resistor Tolerances and TCR Values

Stackpole Enhances High Voltage Chip Resistor Tolerances and TCR Values

HVCB High Voltage Precision Chip Resistors Offer 0.1% Tolerance and 25 ppm TCR.


Keysight Partners with University for Wide Bandgap Semiconductor Testing

Keysight Partners with University for Wide Bandgap Semiconductor Testing

Their goals are to improve efficiencies in the design and testing validation of GaN and SiC semiconductors.


Alpha and Omega Semiconductor (AOS) Debuts a New Series of Coil Drivers

Alpha and Omega Semiconductor (AOS) Debuts a New Series of Coil Drivers

The first series member is a highly integrated half-bridge device aimed at wireless charging applications.


High-Precision Voltage Reference IC Provides Very-Low Drift for Extended-Temperature Automotive Applications

High-Precision Voltage Reference IC Provides Very-Low Drift for Extended-Temperature Automotive Applications

New device completes Microchip’s family of Vref products providing increased reliability and AEC-Q100 qualification.


Siemens Introduces a Power Integrity Analytical SW Tool for IC Design

Siemens Introduces a Power Integrity Analytical SW Tool for IC Design

The new package enables EM/IR assessment of analog, digital, and mixed-signal IC designs of any size before committing to silicon.


Central Semiconductor Releases New CAK3 & CAK6 Series 5G Transient Voltage Suppressors

Central Semiconductor Releases New CAK3 & CAK6 Series 5G Transient Voltage Suppressors

Central Semiconductor Corp., introduces its CAK3-012C & CAK6-042C series of 5G bi-directional transient voltage suppressors (TVS).


3kW AC/DC PSU from GaN Systems Shatters Size and Cost Barriers for Power Supply Applications

3kW AC/DC PSU from GaN Systems Shatters Size and Cost Barriers for Power Supply Applications

PSU exceeds 80+ Titanium efficiency requirements and presents the highest power density solution at a lower cost than traditional silicon solutions.


Vishay Intertechnology Enhances Thick Film Chip Resistor in 1206 Case Size With Higher 0.5 W Power Rating

Vishay Intertechnology Enhances Thick Film Chip Resistor in 1206 Case Size With Higher 0.5 W Power Rating

AEC-Q200 Qualified Device Saves Board Space While Lowering Component Counts and Placement Costs.