Announced at APEC 2024, the highly integrated family of devices reduces package size and increases power density for designers.
March 04, 2024 by Jake Hertz
Infineon has entered into a strategic collaboration with Honda to develop semiconductor solutions for cars. The company has also secured a key…
March 03, 2024 by Mike Falter
February 29, 2024 by Bodo Arlt
Infineon’s family of solid-state isolators features a coreless transformer capable of delivering faster and more reliable switching and…
February 28, 2024 by Mike Falter
Freight transportation, off-road and industrial vehicles, marine applications, and aviation contribute more than 55% of the total greenhouse gas…
February 28, 2024 by Pierre Delatte
The company is demonstrating the new GaN power stages and DC-DC modules at APEC.
February 27, 2024 by Aaron Carman
This article explores the differences between GaN FETs and silicon MOSFETs, provides recommendations for using generic gate drivers with GaN FETs,…
February 27, 2024 by Alejandro Pozo, Efficient Power Conversion
Wolfspeed has expanded agreements with Infineon and another leading global semiconductor manufacturer to supply 150 mm silicon carbide (SiC) wafers…
February 25, 2024 by Mike Falter
Part 1 of this series explains timing factors and solutions for reducing power while maintaining precision in low-power systems, as required for…
February 21, 2024 by Padraic O’Reilly
The data center of the future—the AI factory—runs on thousands of AI accelerators, each of which consumes over 1000 A. Creating a green AI…
February 20, 2024 by Paul Yeaman
February 18, 2024 by Giuliano Cassataro, Nexperia
The XPH8R316MC and XPH13016MC power MOSFETs exhibit improved on-state resistance compared to previous generations.
February 18, 2024 by Jake Hertz
AOS’ DFN 5x6 double-sided cooling package promises to overcome the challenge of cooling power MOSFETs in power electronics.
February 17, 2024 by Jake Hertz
This article examines the reasons GaN power devices work for power conversion applications in space and how their resistance to radiation makes…
February 15, 2024 by Max Zafrani
February 11, 2024 by Patrick Baginski
Reference designs from Power Integrations explore the capabilities of the LinkSwitch-XT2SR family of switching supply controllers in smart meters…
February 11, 2024 by Mike Falter
The FETs use Transphorm’s GaN-on-Silicon substrate technology.
February 10, 2024 by Jake Hertz
February 06, 2024 by Alejandro Pozo, Efficient Power Conversion
IC designers can now securely share thermal models across the supply chain—without compromising critical details of chip architecture.
February 02, 2024 by Jake Hertz
Two major companies make acquisitions impacting wide bandgap semiconductors and software-defined vehicle technology for electric vehicles.
February 01, 2024 by Mike Falter
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