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Breaking the Silicon Limit and Moving Beyond the SiC Ceiling

Breaking the Silicon Limit and Moving Beyond the SiC Ceiling

Learn how IceMOS Technology’s MEMS-based superjunction platform pushes power transistor limits, aiming to break the silicon barrier and surpass…


Why EV Inverter Efficiency Measurements Become Unreliable at Higher SiC Switching Frequencies

Why EV Inverter Efficiency Measurements Become Unreliable at Higher SiC Switching Frequencies

Learn why high-frequency SiC switching can distort EV inverter efficiency results and how a…


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Briefs: Forward Steps in Batteries, Microreactors, and DC Systems

Briefs: Forward Steps in Batteries, Microreactors, and DC Systems

Queen’s University Belfast, Hyundai Motor Group, SK On, Terra Innovatum, Waiken ILW, ABB, and Advantics are achieving significant steps in…


News Jul 23, 2026 by Karen Hanson
Briefs: AI Data Centers Drive Power and Storage Solutions

Briefs: AI Data Centers Drive Power and Storage Solutions

Infineon, LS Electric, Peak Energy, ESS Tech, and Inovance Technologies have new products for grid-scale energy storage and AI data center power…


News Jul 16, 2026 by Karen Hanson
Melexis Unveils a Digital Current Sensor for High-Power EVs

Melexis Unveils a Digital Current Sensor for High-Power EVs

The MLX91229 Hall sensor trades an analog output for a digital bitstream to keep current readings clean inside EV traction inverters as SiC and GaN…


Capacitors: Indispensable Building Block of Electrification

Capacitors: Indispensable Building Block of Electrification

As inverter-based resources replace spinning generation, capacitors are becoming a critical tool for maintaining grid stability.


Isolation Barrier Stress and Partial Discharge in Gate Drivers

Isolation Barrier Stress and Partial Discharge in Gate Drivers

Fast transients can push the gate driver isolation past its normal limits. This can cause partial discharge and, over time, lead to insulation…


Nexperia Expands Wide-Bandgap Portfolio With SiC and GaN Updates

Nexperia Expands Wide-Bandgap Portfolio With SiC and GaN Updates

Nexperia rolled out two wide-bandgap product updates: a top-side cooled QDPAK package for its 1200 V SiC MOSFETs, and an expanded lineup of 650 V…


Tektronix Intros Wideband Shunts and High Voltage Differential Probe

Tektronix Intros Wideband Shunts and High Voltage Differential Probe

The new wideband shunts and the high-voltage differential probe are designed to enable engineers to extend measurement coverage from precision…


Rohm Releases PLECS Electronics Verification Simulator

Rohm Releases PLECS Electronics Verification Simulator

Rohm has launched a free, browser-based simulator built on the PLECS environment, enabling power electronics engineers to run loss and thermal…


Next-Gen Power Electronic Products Debut at PCIM Europe 2026

Next-Gen Power Electronic Products Debut at PCIM Europe 2026

Infineon, Mitsubishi Electric, Semikron Danfoss, Fraunhofer IAF, Wolfspeed, EPC, and Onsemi introduced products and innovations in power…


News Jun 15, 2026 by Karen Hanson
Wolfspeed Intros 3.3 kV SiC Power Modules

Wolfspeed Intros 3.3 kV SiC Power Modules

Wolfspeed has released two 3.3 kV SiC modules: an LM half-bridge reducing switching losses by 42% and a WolfPACK full-bridge offering 50% smaller…


Onsemi Unveils Interactive Web Tool to Simplify Power Design

Onsemi Unveils Interactive Web Tool to Simplify Power Design

The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers deep visibility into…


Infineon Intros 1300 V SiC Module Capable of 205°C Continuous Operation

Infineon Intros 1300 V SiC Module Capable of 205°C Continuous Operation

A new automotive silicon carbide power module pushes thermal boundaries to enhance electric vehicle traction inverter density and streamline…


Microchip Launches 3.3 kV Power Modules for Solid-State Transformers

Microchip Launches 3.3 kV Power Modules for Solid-State Transformers

New HV-D3 mSiC silicon carbide phase leg modules enhance grid-to-rack efficiency and thermal robustness for hyperscale data centers.


new products May 29, 2026 by Dale Wilson
Infineon Adds 2300 V SiC MOSFET Modules to Power Module Family

Infineon Adds 2300 V SiC MOSFET Modules to Power Module Family

The high-power CoolSiC variants support 1500 V DC-link voltages, with RDS(on) from 1 to 2 mΩ and 4 or 6 kV isolation, targeting wind, solar, and…


new products May 26, 2026 by Luke James
Littelfuse Launches High-Voltage TVS Diodes for Power Protection

Littelfuse Launches High-Voltage TVS Diodes for Power Protection

The high-voltage TVS diode family delivers a stand-off voltage of up to 400 V in a single AEC-Q101 SMC package.


Solution-based Manufacturing Platform for Advanced WBG Technologies

Solution-based Manufacturing Platform for Advanced WBG Technologies

Learn how Sanan offers a solution-based, vertically integrated manufacturing platform for advanced SiC/GaN WBG technologies, enabling faster…


TDK Intros Common-Mode Choke Series Rated up to 1250 VDC

TDK Intros Common-Mode Choke Series Rated up to 1250 VDC

The B82722V6*B040 series common-mode chokes combine compact size and high resonance performance in high-voltage power electronics.


Sensor Placement Errors in High-Voltage Systems That Distort Measurements

Sensor Placement Errors in High-Voltage Systems That Distort Measurements

Improper sensor placement in high-voltage systems can lead to distorted measurements. This article explains how ground shifts, dv/dt, and layout…