With the advancement of electrification in the automotive industry, active cooling is needed more often. When a fan is used, noise can become a…
April 18, 2024 by Karsten Witt
Infineon’s state-of-the-art MOSFETs set new industry standards by offering high performance, increased power density, and enhanced efficiency.
March 30, 2024 by Jake Hertz
Announced at APEC 2024, the highly integrated family of devices reduces package size and increases power density for designers.
March 04, 2024 by Jake Hertz
In this roundup, we highlight three DC-DC converters that emerged in the last few months, each driven by package and performance improvements.
February 24, 2024 by Darshil Patel
IC designers can now securely share thermal models across the supply chain—without compromising critical details of chip architecture.
February 02, 2024 by Jake Hertz
Littelfuse has rolled out TTape, an innovative temperature monitoring and detection system that seamlessly integrates with electric vehicle battery…
January 28, 2024 by John Nieman
Until now, determining the thermal diffusivity of extremely thin and thermally highly conductive ceramic substrates has been error-ridden, but this…
January 11, 2024 by Martina Schmirler
Microgravity laboratories in the International Space Station are being used to understand the basic science of heat transfer and how it can improve…
November 10, 2023 by Kevin Clemens
In applications like switched-mode power supplies, semiconductor devices often run in pulsed mode, not continuous waves. These devices might never…
November 05, 2023 by Reza Behtash
New toroidal power factor correction chokes from Würth use flat wire windings that result in fewer winding losses when compared with traditional…
September 02, 2023 by Mike Falter
The trend toward digitalization and the adoption of new technologies utilizing artificial intelligence has led to a significant increase in global…
August 08, 2023 by Christopher Rocneanu
A new European Union-funded platform lets industrial producers calculate capacities and map the supply/demand of waste heat to potential users…
June 19, 2023 by Shannon Cuthrell
Toyochem introduces sintering nano-silver pastes engineered for power electronics bonding in automotive applications.
May 13, 2023 by Mike Falter
Silver sintering and transient liquid phase soldering are replacement technologies for bonding using high reliability solder alloys. This article…
May 03, 2023 by Dmytro Pavlyuchkov
This article explores the importance of thermal paste in high-power electronics, including its conductivity and ability to enhance durability and…
March 27, 2023 by Millicent Kwamboka
Transient thermal impedance is a measure of how a device behaves when pulsed power is applied. Transient thermal impedance is an important…
March 16, 2023 by Christophe Vaucourt
Innovative semiconductor design and packaging technologies are improving efficiencies in data centers as server power demands increase.
March 09, 2023 by Robert Taylor
The number of semiconductors in nearly every application is multiplying. Many of the design challenges facing electronics engineers all tie back to…
February 24, 2023 by Robert Taylor
Celanese will feature advanced material initiatives for electric vehicles and consumer electronics.
January 07, 2023 by Mike Falter
Aluminum formate, a new, easily produced material, has been found to filter carbon dioxide effectively when used in power plant smokestacks. It…
November 28, 2022 by Claire Turvill
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