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Grounding for Noise Reduction in Electronic Systems

Grounding for Noise Reduction in Electronic Systems

Learn about everyday grounding systems to reduce common-mode noise.


Automatic Magnetic Simulation Generation for Inductive Components Design

Automatic Magnetic Simulation Generation for Inductive Components Design

This article highlights PERMO GaN and SiC technologies which permit to obtain the most efficient converters in the smallest size.


Resonance in High Frequency Grounding and Bonding Networks

Resonance in High Frequency Grounding and Bonding Networks

Learn about the impact of resonance in grounding and bonding conductors.


Grounding and Bonding for High-Frequency Stimulus

Grounding and Bonding for High-Frequency Stimulus

Learn about the behavior of grounding and bonding conductors with high-frequency signals


The Demand for Seamless Characterization, Simulation and Development of Power Semiconductors

The Demand for Seamless Characterization, Simulation and Development of Power Semiconductors

This article highlights publicly-funded project MessLeha addresses this issue by defining a machine-readable data sheet to support the setup of…


What is a Voltage Source?

What is a Voltage Source?

This article highlights the meaning of independent and dependent voltage sources.


Magnetic Core Characteristics and Applications

Magnetic Core Characteristics and Applications

Internal Design of Current Transformers

Internal Design of Current Transformers

This article offers an overview of the basic working principles and design of current transformers.


Utilizing GaN with High-Performance Gate Driving

Utilizing GaN with High-Performance Gate Driving

This article highlights MinDCet GaN power stages that requires implementing an optimized gate-driver for GaN transistors.


DC-Meters for Fair and Smart EV Fast Charge Billing

DC-Meters for Fair and Smart EV Fast Charge Billing

This article highlights LEM DC Billing Meter (DCBM) that is smart, extremely compact, and fully compliant with the German “Eichrecht” regulations.


The Basics of Magnetic Materials

The Basics of Magnetic Materials

This article highlights the basics of magnetic materials — the control, transfer, and conditioning of electric power.


Saving Energy and Cost with the Use of Buffers

Saving Energy and Cost with the Use of Buffers

This article highlights IDEA GmbH high-efficiency products and solutions for induction heating applications, such as tempering, soldering and…


Understanding Thermal Management of Chip-Scale GaN Devices

Understanding Thermal Management of Chip-Scale GaN Devices

This article discusses the challenges that thermal management raises due to increased power density, especially with chip-scale-packaging (CSP).


Understanding the Ferranti Effect in Transmission Lines

Understanding the Ferranti Effect in Transmission Lines

This article presents an overview of the Ferranti effect, describing the causes and consequences of the phenomenon and highlighting which main…


Utilizing Fuses for Overcurrent Protection

Utilizing Fuses for Overcurrent Protection

This article highlights Types of Fuses that are overcurrent protection devices with a fusible link that melts and opens a circuit when an overload…


Eliminating EMC at the Source

Eliminating EMC at the Source

This article highlights Ing Buro Springett elimination of the source of the noise by replacing the mosfet with a source tabbed, Nexperia GAN063-650W.


Innovative Manufacturing Approach Reduces Costs and Optimizes Electrification Time to Market

Innovative Manufacturing Approach Reduces Costs and Optimizes Electrification Time to Market

This article introduces Comau rethinking electrical motor and transmission assembly reducing costs and optimizes electrification time to market.


AC and DC Circuit Breakers for Overcurrent Protection

AC and DC Circuit Breakers for Overcurrent Protection

This article highlights circuit breaker that is an overcurrent protection device (OCPD) designed to protect electrical devices and individuals from…


3D Bond Wire Modelling and Electro-Magnetic Simulation Accelerates IGBT Module Development

3D Bond Wire Modelling and Electro-Magnetic Simulation Accelerates IGBT Module Development

This article introduces software MFis Wire and its advantages in significantly shortening time for creating complex 3D geometry models of bond wire…


Differential Mode Vs. Common Mode Conducted Emissions

Differential Mode Vs. Common Mode Conducted Emissions

The article presented the basic knowledge about conducted emissions providing an essential and intuitive overview, starting from how they are…