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Interatomic Bonding in the Solid-State

Interatomic Bonding in the Solid-State

Learn about solid-state characteristics: atomic bonding and crystals.


Understanding the Electric Structure of Atoms

Understanding the Electric Structure of Atoms

In this “semiconductor basics” article, learn about the electronic structure of atoms and the electrons’ energy.


Understanding Atomic Energy Levels in Solid-state Electronic Devices

Understanding Atomic Energy Levels in Solid-state Electronic Devices

Learn about the shell structure of atomic energy levels.


How Does Flyback Synchronous Rectification Affect EMI?

How Does Flyback Synchronous Rectification Affect EMI?

This article highlights Monolithic Power Systems flyback adapter design with synchronous rectification (SR) as different from conventional set-ups…


How SiC MOSFETS are Made and How They Work Best

How SiC MOSFETS are Made and How They Work Best

This article highlights Avnet Silica devices featuring STSiC Power components for SiC information.


Minimizing Thermo-Mechanical Stress in Chipscale eGaN Devices

Minimizing Thermo-Mechanical Stress in Chipscale eGaN Devices

This article highlights EPC EPC2001C and EPC2053 temperature cycling results.


Dual Component 700A Thyristor Modules with Minimized Static and Heat Losses

Dual Component 700A Thyristor Modules with Minimized Static and Heat Losses

This article highlighs Proton Electrotex dual-component A2-type power thyristor module with a baseplate width of 60 mm rated for a voltage of 1800…


Single-Point and Multi-Point Signal Grounding

Single-Point and Multi-Point Signal Grounding

A grounding arrangement must be designed and implemented adequately for the electronic equipment’s proper performance


The Demand for Seamless Characterization, Simulation and Development of Power Semiconductors

The Demand for Seamless Characterization, Simulation and Development of Power Semiconductors

This article highlights publicly-funded project MessLeha addresses this issue by defining a machine-readable data sheet to support the setup of…


Utilizing GaN with High-Performance Gate Driving

Utilizing GaN with High-Performance Gate Driving

This article highlights MinDCet GaN power stages that requires implementing an optimized gate-driver for GaN transistors.


Understanding Thermal Management of Chip-Scale GaN Devices

Understanding Thermal Management of Chip-Scale GaN Devices

This article discusses the challenges that thermal management raises due to increased power density, especially with chip-scale-packaging (CSP).


Eliminating EMC at the Source

Eliminating EMC at the Source

This article highlights Ing Buro Springett elimination of the source of the noise by replacing the mosfet with a source tabbed, Nexperia GAN063-650W.


3D Bond Wire Modelling and Electro-Magnetic Simulation Accelerates IGBT Module Development

3D Bond Wire Modelling and Electro-Magnetic Simulation Accelerates IGBT Module Development

This article introduces software MFis Wire and its advantages in significantly shortening time for creating complex 3D geometry models of bond wire…


1200V Discrete SiC MOSFETs Compared to High-Speed 3 IGBTs for Servo-Drive Systems

1200V Discrete SiC MOSFETs Compared to High-Speed 3 IGBTs for Servo-Drive Systems

This article highlights Infineon Technologies AG CoolSiC™ MOSFET performance that are for servo-drive systems, which are typically characterized…


Layout Considerations for GaN Transistor Circuits

Layout Considerations for GaN Transistor Circuits

This article is the first in a series of articles discussing three topics that can help power systems designers achieve the most out of their…


Enabling Higher Efficiency Power Designs with 750V Gen 4 SiC FETs

Enabling Higher Efficiency Power Designs with 750V Gen 4 SiC FETs

This article highlights eviewed the parameters of the new G4 UJ4C 750V SiC FETs from UnitedSiC compared to SiC MOSFETs and Superjunction FETs in…


Chip-Embedded Technology Enables High Current Density Power

Chip-Embedded Technology Enables High Current Density Power

This article highlights TDK 3D design techniques that can help reduce parasitic losses, and improve thermal performance while also reducing the PCB…


How to Achieve Fast Switching with a High-Voltage Isolated Driver IC

How to Achieve Fast Switching with a High-Voltage Isolated Driver IC

In high switching frequency applications, the high commutation slopes of the power switches require immunity against high levels of common mode…


Highly Efficient SiC Power Devices for a Wide Range of Applications

Highly Efficient SiC Power Devices for a Wide Range of Applications

This article discusses the demands of different applications, highlights the MITSUBISHI ELECTRIC SiC power devices available in different voltage…


Coreless Transformers Isolate SiC Gate Drivers for EV and Industrial Applications

Coreless Transformers Isolate SiC Gate Drivers for EV and Industrial Applications

This article introduces conventional isolated gate driver technology, including discrete transformer, opto-isolated, and capacitive methods, though…