This article discusses the evaluation of flux-free soldering process for bare copper DBC substrate to Nickel-plated copper base plate soldering.
March 27, 2020 by Matt Vorona
This article discusses the Modular DC-DC converters and their recent developments in terms of power density.
March 13, 2020 by Steve Roberts
This article gives insight on Source-Down packaging technology, a key enabler for delivering the required power density to feed the power-hungry…
March 12, 2020 by Bastian Lang
This article discusses UnitedSiC's state of the art low-resistance power semiconductor switches and their characteristics and application…
March 11, 2020 by Anup Bhalla, UnitedSiC
How Thermal Environment Impacts Power Supply Success.
February 03, 2020 by Dylan Howes
This article highlights Texas Instruments envelope tracking that is a new power management technology for improving PA efficiency of LTE transmitters.
January 30, 2020 by Juha Pennanen
This article describes some common pitfalls of AC to DC Power Supplies and provides insight how to get maximum performance for specific applications.
January 16, 2020 by Ira J. Pitel
This article highlights International Rectifier Corporation iMotion integrated design platform that enabled designers to realise energy-efficient…
January 10, 2020 by Alberto Guerra
This article highlights Analog Devices Incorporated LT8650S synchronous Silent Switcher® 2 regulator features a wide input voltage range of 3 V to…
January 06, 2020 by Hua Bai
This article highlights Bs&T Frankfurt am Main GmbH design of power magnetic components that requires proper specification for good reliability.
December 23, 2019 by JC Sun
This article introduces the LTM8003, a wide input and output range, low noise, 3.5 A stepdown µModule regulator featuring the Silent Switcher…
December 04, 2019 by Zhongming Ye
The automotive industry is currently undergoing a tremendous change. Due to higher awareness of the negative impact of air pollutants on human…
December 03, 2019 by Rene Spenke
This article presented the impact of the use of different thermal PCB PADs on the thermal performance of Ignition IGBTs.
November 26, 2019 by Hugo Guzmán
This article features Infineon USB-PD adapters that supports a wide range of output voltages and power up to 60 W for charging different end…
November 25, 2019 by Manfred Schlenk
This article features Taiwan Semiconductor Europe SMA and SMD Package as newer packages that transport heat more efficiently and waste less space…
October 25, 2019 by Jos Van Loo
This article highlights Mitsubishi Electric Europe B.V. DIPIPM™ series package that offers the highest level of integration and compactness for…
October 14, 2019 by Philipp Jabs
The dream of many engineering managers is having a single simulation model or “digital twin” for a newly developed product or application. This…
October 09, 2019 by Jost Allmeling
This article highlights Infineon chipset of IGBT7 and emitter-controlled 7 diode that is user-friendly and optimized to fulfill the GPD requirements.
September 30, 2019 by Klaus Vogel
This article features CISSOID CMT-TIT8243 high temperature high voltage isolated Gate Driver for 62mm SiC MOSFET power modules with High peak gate…
September 25, 2019 by Pierre Delatte
This article highlights TH Köln - Cologne University of Applied Sciences coupled-inductor configurations for high power densities based on two…
August 23, 2019 by Christian P. Dick
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