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PowerBud  Technology for High Current Low Insertion Force Low Resistance and Long Cycle Life Power Connectors

PowerBud Technology for High Current Low Insertion Force Low Resistance and Long Cycle Life Power Connectors

This article introduces the features and advantages of Methode's PowerBud, a new class of patented power connector interface, over…


An Introduction to Utilizing the AVSBus Interface in Power Design

An Introduction to Utilizing the AVSBus Interface in Power Design

This article discusses the advantages and benefits of AVSBus, a protocol for DVFS for faster clock speed and lesser switching losses.


Soft-Short Protection, a Burning Issue in Mobile Travel Adapters

Soft-Short Protection, a Burning Issue in Mobile Travel Adapters

This article discusses the importance of protecting mobile devices by using standard cables and introduces Dialog Semiconductor's SmartDefender.


Current Measurement Methods that Deliver High Precision Power Analysis in the Field of Power Electronics

Current Measurement Methods that Deliver High Precision Power Analysis in the Field of Power Electronics

This article discusses the current measurement methods specifically on Direct Connection Method and Current Sensor method used in power analyzers.


LinPak – the new Standard Phase-Leg Module with Exceptional Low Inductance

LinPak – the new Standard Phase-Leg Module with Exceptional Low Inductance

This article introduces ABB Semiconductor's LinPak, a new IGBT module generation that is the enabler for lowest overall stray inductance.


InFORMS vs the Trimmed  Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

InFORMS vs the Trimmed Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

This article discusses TT Electronics and Hybrid testing the inFORMS and discusses the reliability of this interconnect increases in thermal cycles.


Lighting up the Theatre Safely

Lighting up the Theatre Safely

This article gives an overview of DMX512A, showing and explaining recommended electrical and electronic requirements, and how the protocol was…


EMC Simulation of Cable Interference in Ecars

EMC Simulation of Cable Interference in Ecars

This article presents three geometry simulation models of the basic components in an E-car to obtain optimum cable length and receive suitable EMC.


When to Use Litz Wire

When to Use Litz Wire

This article discusses the best practices of when to use Litz Wire in design process for inductors, transformer, and/or systems.


Active Vibration Control in Ultrasonic Wire Bonding Improving Bondability on Demanding Surfaces

Active Vibration Control in Ultrasonic Wire Bonding Improving Bondability on Demanding Surfaces

This article shows the capability to suppress or reduce unwanted vertical vibrations using special control IDE actuators and active vibration control.