This article provides insights into easy-to-use, real-time-capable models for the FPGA-based testing of an onboard charger.
This article provides insights into easy-to-use, real-time-capable models for the FPGA-based testing of an onboard charger.
Power electronics are a cornerstone of innovation in automotive, enabling superior performance and efficiency. Add SiC…
Power electronics are a cornerstone of innovation in automotive, enabling superior performance and efficiency. Add SiC and they become even better.
The increasing power demand in data centers, led by advances in artificial intelligence, is driving the need for…
The increasing power demand in data centers, led by advances in artificial intelligence, is driving the need for converters with higher power…
Silicon Carbide and Gallium Nitride technologies are significantly reshaping the power electronics industry—from…
Silicon Carbide and Gallium Nitride technologies are significantly reshaping the power electronics industry—from electric vehicles to renewable…
Electronic circuit interruption solutions protect the wiring and limit short-circuit let-through current and energy…
Electronic circuit interruption solutions protect the wiring and limit short-circuit let-through current and energy delivered to a faulted load.…
This article examines an evaluation kit to shorten time-to-market for SiC inverters.
This article examines an evaluation kit to shorten time-to-market for SiC inverters.
Which active components fit well into applications for green hydrogen systems?
Which active components fit well into applications for green hydrogen systems?
The MCU family comes in Entry and Main Line products, giving designers a scalable range of performance and memory options.
The MCU family comes in Entry and Main Line products, giving designers a scalable range of performance and memory options.
Advances in radio frequency generation have led to innovative designs transforming applications within the sub-100 MHz…
Advances in radio frequency generation have led to innovative designs transforming applications within the sub-100 MHz region. This article…
Improvements in SiC wafering and epitaxy manufacturing challenges are delivering affordable, high-efficiency power semiconductors.
Improvements in SiC wafering and epitaxy manufacturing challenges are delivering affordable, high-efficiency power semiconductors.
Tech giants like Intel and Infineon unveiled significant developments in gallium nitride technology in 2024.
Tech giants like Intel and Infineon unveiled significant developments in gallium nitride technology in 2024.
SiC substrates and products showed tremendous performance in 2024. Will the trend continue in 2025?
SiC substrates and products showed tremendous performance in 2024. Will the trend continue in 2025?
New architectures and AC-DC distribution configurations are increasing demand for data center rack and PSU power,…
New architectures and AC-DC distribution configurations are increasing demand for data center rack and PSU power, necessitating more processing…
What are this year’s major innovations in power supply technology?
What are this year’s major innovations in power supply technology?
This article examines the technical benefits and total cost of ownership of SiC in two types of motor drive applications.
This article examines the technical benefits and total cost of ownership of SiC in two types of motor drive applications.
As the adoption of photovoltaic systems continues, pressure on manufacturers drives innovation and the adoption of new…
As the adoption of photovoltaic systems continues, pressure on manufacturers drives innovation and the adoption of new technologies to reduce cost…
This article examines high electron GaN mobility transistors as an alternative to SiC in power electronics.
This article examines high electron GaN mobility transistors as an alternative to SiC in power electronics.
What causes failure in wide bandgap semiconductors, and how can engineers mitigate them?
What causes failure in wide bandgap semiconductors, and how can engineers mitigate them?
This article examines how Fraunhofer is combining lateral and vertical geometry to develop vertical GaN power ICs and…
This article examines how Fraunhofer is combining lateral and vertical geometry to develop vertical GaN power ICs and related technology.
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