EEPower

Latest Automotive Technical Articles

Categories

Combining Creepage with Miniaturization in High-Voltage Automotive Drives

Combining Creepage with Miniaturization in High-Voltage Automotive Drives

This article highlights the concerns for the miniaturization in high voltage automotive drives which is arcing and introduces KEMET's…


Reference Design for Inverters: First integrated solution for e-mobility and industry

Reference Design for Inverters: First integrated solution for e-mobility and industry

This article discusses the TDK and Infineon's new integrated solution for inverters for e-mobility power trains and industrial applications.


BTRAN  BiDirectional BiPolar Junction Transistor

BTRAN BiDirectional BiPolar Junction Transistor

This article discusses the functions and applications of Bi-directional Bipolar Junction Transistor (B-TRAN), a new topology for power semiconductors.


A New Dawn for Tantalum Capacitors

A New Dawn for Tantalum Capacitors

This article discusses the Tantalum capacitors and technology which hold significant technical advantages over their conventional counterparts.


Highly Reliable Transfer-Molded Power Modules

Highly Reliable Transfer-Molded Power Modules

This article describes a high power IGBT module for electric and hybrid electric vehicle inverters and offers technical concepts and benefits.


EMC Simulation of Cable Interference in Ecars

EMC Simulation of Cable Interference in Ecars

This article presents three geometry simulation models of the basic components in an E-car to obtain optimum cable length and receive suitable EMC.


eGaN Technology Transforming the Future

eGaN Technology Transforming the Future

This article discusses the potential of eGaN technology in various applications such as outer space, machine interface, electricity and medicine.


High Power Density Dual  nHPD2 Packaging Generation

High Power Density Dual nHPD2 Packaging Generation

This article introduces Hitachi's nHPD2 and its benefits in terms of market potential, performance, modularity and ease of transition.