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Enhanced IGBT Module Power Density Utilizing the Improved Thermal Conductivity of SLC-Technology

Enhanced IGBT Module Power Density Utilizing the Improved Thermal Conductivity of SLC-Technology

This article introduces the new IGBT module generation of Mitsubishi Electric with improved Insulated Metal Baseplate as a key element of the…


Direct Cooled Molded Power Module for Motor Integration in Electric and Hybrid Vehicles

Direct Cooled Molded Power Module for Motor Integration in Electric and Hybrid Vehicles

This article offers a solution to improve motor drive's package density to reduce the production costs and better design and flexibility.


LinPak – the new Standard Phase-Leg Module with Exceptional Low Inductance

LinPak – the new Standard Phase-Leg Module with Exceptional Low Inductance

This article introduces ABB Semiconductor's LinPak, a new IGBT module generation that is the enabler for lowest overall stray inductance.


Enhancing the performance of traditional IGBT-module-based power assemblies with SiC modules

Enhancing the performance of traditional IGBT-module-based power assemblies with SiC modules

This article discusses how Silicon Carbide MOSFETs enable high frequency in high power conversion systems for enhanced performance of power…


Enhanced Module Design Makes Most of New IGBT5 Performance

Enhanced Module Design Makes Most of New IGBT5 Performance

This article highlights Infineon Technologies AG PrimePACK 3+ package that extends the current range of the PrimePACK series to 1800 A with .XT…


Highest Power density by 7th Gen IGBT StdType Module with New TMSTechnology

Highest Power density by 7th Gen IGBT StdType Module with New TMSTechnology

This article highlights Mitsubishi Electric 7th Gen. Std-type IGBT Modules based on TMS-Technology that is the 7th Gen Chip in the T-Series IGBT…


More Power and Higher Reliability by 7th Generation IGBT Module with New SLC Technology

More Power and Higher Reliability by 7th Generation IGBT Module with New SLC Technology

This article highlights Mitsubishi Electric Corporation SLC package technology is combined with the 7th Gen Chip in the NX-type IGBT Modules Series.


A 10kW 3 level UPS Inverter  Utilizing a Full SiC Module  Solution to Achieve High Efficiency and Reduce Size and Weight

A 10kW 3 level UPS Inverter Utilizing a Full SiC Module Solution to Achieve High Efficiency and Reduce Size and Weight

This article highlights ROHM Semiconductor with Fraunhofer ISE 10kW three phase UPS inverter utilizing the SiC module solution to achieve high…


New 800A1200V Full SiC Module

New 800A1200V Full SiC Module

This article describes Mitsubishi Electric's new 800A/1200V full SiC module and its advantages over conventional IGBT modules in power…


A High Current Low Inductance Wide Bandgap Power Module for High Performance Motor Drive Applications

A High Current Low Inductance Wide Bandgap Power Module for High Performance Motor Drive Applications

This article presented HT-3000, a high-performance power module that takes full advantage of the benefits of wideband gap devices.