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CMOS Flip-Flops: JK, D and T-Type Flip-Flops

CMOS Flip-Flops: JK, D and T-Type Flip-Flops

Learn how the CMOS JK flip-flop device and its derivations work.


Using the Calorimetric Method to Verify Dynamic Power Device Analyzer Switching Energy Calculations

Using the Calorimetric Method to Verify Dynamic Power Device Analyzer Switching Energy Calculations

Knowing the power dissipation of a transistor is important to calculate the overall efficiency of the system and dimension the transistor’s…


Dual Linear Regulator for Digital IC Power Enables On-the-Fly Output Adjustment and Dynamic Headroom Optimization

Dual Linear Regulator for Digital IC Power Enables On-the-Fly Output Adjustment and Dynamic Headroom Optimization

Low dropout (LDO) linear regulators are often used to provide clean power to processor cores and communication circuits. In these applications, LDO…


Driving SiC MOSFETs & IGBTs With Current Source Gate Driver

Driving SiC MOSFETs & IGBTs With Current Source Gate Driver

This article outlines how ROHM’s new current source gate driver – the BM60059FV-C – offers a possibility of reducing switching losses by up…


CMOS SR Latches and Flip-Flops

CMOS SR Latches and Flip-Flops

Learn how CMOS SR latch and flip-flop devices work.


Glitch-Free Voltage Supervisor ICs — a Concept or Reality?

Glitch-Free Voltage Supervisor ICs — a Concept or Reality?

A reliable supervisor IC is always an industry need as it adds system reliability and improves system performance over voltage transients and power…


Powering the Energy Transition with Silicon Carbide and Wide Band-Gap Devices

Powering the Energy Transition with Silicon Carbide and Wide Band-Gap Devices

Silicon Carbide (SiC) is poised to transform the global power electronics industry as it makes increasing inroads into the market share of legacy…


Moving from IGBT to SiC: PFC Efficiency

Moving from IGBT to SiC: PFC Efficiency

The continuing worldwide efforts to reduce carbon emissions have driven the growth in interest in electric vehicles (EV). As a result, the demand…


Fast Short-Circuit Protection of SiC-MOSFETs through AC Current Sensors

Fast Short-Circuit Protection of SiC-MOSFETs through AC Current Sensors

Constant improvements in power semiconductor technology enable even more efficient and compact power converters. Silicon Carbide CoolSiC™ MOSFETs…


Solid Power Releases Safety and Performance Data for its High-Content Silicon Cell

Solid Power Releases Safety and Performance Data for its High-Content Silicon Cell

Solid Power, a leading developer company of all-solid-state batteries, recently unveiled a report containing its new battery’s performance and…


News Nov 05, 2021 by Ahmad Ezzeddine
Allegro Debuts a 3-Phase Gate Driver IC Purposed to Reduce EV Noise Levels

Allegro Debuts a 3-Phase Gate Driver IC Purposed to Reduce EV Noise Levels

The new unit is aimed at sensorless, brushless DC (BLDC) motors operating over a 5V to 50V voltage range.


Overviewing 4th Generation SiC MOSFETs and Application-level Support Tools

Overviewing 4th Generation SiC MOSFETs and Application-level Support Tools

High performance devices supplemented with system solution support. In 2010, ROHM has introduced its first commercial SiC MOSFET into the power…


CMOS implementation of XOR, XNOR, and TG gates

CMOS implementation of XOR, XNOR, and TG gates

Learn how to implement the logic gates XOR, XNOR, and Transmission Gate (TG) using CMOS.


Sungrow’s String Inverter Employs Infineon Module and Chip Technology

Sungrow’s String Inverter Employs Infineon Module and Chip Technology

The 352kW, 1500 VDC Sungrow device offers a 40% increase in output power when compared to the company’s previous best.


How to Choose the Right Battery-Charger IC for Ultrasound Point-of-Care Products

How to Choose the Right Battery-Charger IC for Ultrasound Point-of-Care Products

In this article, I’ll examine compact battery-charger integrated circuits (ICs) and solutions for ultrasound point-of-care products that are used…


NexWafe Raises Funds for its Low-Cost Green Silicon Wafer Technology

NexWafe Raises Funds for its Low-Cost Green Silicon Wafer Technology

NexWafe receives €39 million in funding to further develop its green solar wafer technology for large-scale production.


News Nov 01, 2021 by Stephanie Leonida
Toshiba Unveils New Simulation Technology Accu-ROM to Reduce Semiconductor Verification Time

Toshiba Unveils New Simulation Technology Accu-ROM to Reduce Semiconductor Verification Time

Toshiba has recently developed a new model-based development (MBD) simulation technology that can reportedly reduce verification times for…


EPC Debuts a Bidirectional, 50W eGaN FET-based Buck-Boost Converter

EPC Debuts a Bidirectional, 50W eGaN FET-based Buck-Boost Converter

The new demonstration board operates either as a 12V to 60V boost converter or as a 48V to 12V buck converter.


EPC’s 40V eGaN FET Ideal for High Power Density Telecom, Netcom, and Computing Solutions

EPC’s 40V eGaN FET Ideal for High Power Density Telecom, Netcom, and Computing Solutions

EPC introduces the 40 V, 1.3 milliohm EPC2067 eGaN® FET offering designers a device that is smaller, more efficient, and more reliable than…


Basic CMOS Logic Gates

Basic CMOS Logic Gates

Learn about gates built with the CMOS digital-logic family.